[특허]Continuous operation supercritical fluid treatment process and system

Continuous operation supercritical fluid treatment process and system 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B08B-003/02
출원번호	US-0891138 (1992-06-01)
발명자 / 주소	Palen Edward J. (Los Angeles CA)
출원인 / 주소	Hughes Aircraft Company (Los Angeles CA 02)
인용정보	피인용 횟수 : 52 인용 특허 : 0

초록 ▼

A system for continuously processing items using supercritical fluid wherein the main process vessel in which the items are cleaned or extracted is continuously pressurized with supercritical fluid. The continuous pressurization of the main process vessel is achieved by using an entry airlock to initially pressurize the item to be processed prior to transport into the main process vessel. An exit airlock is provided to depressurize the item after cleaning or extraction in the main process vessel. The system also provides for pretreatment of the items in the entry airlock prior to processing in the main vessel. Post-treatment may also be provided in the exit airlock when desired.

대표청구항 ▼

A system for continuously processing items using supercritical fluid comprising: a main process vessel comprising walls defining a supercritical fluid processing zone, said main process vessel further comprising an inlet through which said items are introduced into said supercritical fluid processing zone and an outlet through which said items are removed from said supercritial fluid processing zone; an entry airlock comprising walls defining an entry airlock zone, said entry airlock further comprising an inlet through which said items are introduced into said entry airlock zone and an outlet connected to said main process vessel inlet through which said items are passed from said entry airlock zone to said supercritical fluid processing zone; an exit airlock comprising walls defining an exit airlock zone, said exit airlock further comprising an inlet connected to said main process vessel outlet through which said items are passed from said supercritical fluid processing zone to said exit airlock, and an outlet through which said items are removed from said exit airlock; main process vessel seal means operable between open and closed positions for selectively sealing said inlet or outlet of said main process vessel; entry airlock seal means operable between open and closed positions for selectively sealing said inlet or outlet of said entry airlock; exit airlock seal means operable between open and closed positions for selectively sealing said inlet or outlet of said exit airlock; main process vessel pressure means for continuously pressurizing said supercritical fluid processing zone with supercritical fluid; entry airlock pressure means for selectively pressurizing said entry airlock zone with supercritical fluid when said inlet and outlet of said entry airlock are sealed; means for monitoring the extent to which said item has been processed with supercritical fluid in said entry airlock; exit airlock pressure means for selectively pressurizing said exit airlock with supercritical fluid when said inlet and outlet of said exit airlock are sealed; transport means for moving said items through said entry airlock zone, said main process vessel and said exit airlock zone; and means for controlling the operation of said main process vessel seal means, said entry airlock seal means, said exit airlock seal means, said entry airlock pressure means and said exit airlock pressure means to provide transport of said items through said entry airlock, main process vessel and exit airlock without depressurizing said supercritical fluid processing zone.

이 특허를 인용한 특허 (52)

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Sauer Richard A. ; Conners Robert W. ; Sundin Per O., Continuous processing apparatus and method for cleaning articles with liquified compressed gaseous solvents.
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Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
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Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
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Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
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Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
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Bayer, Oswald; Schellberg, Oliver, Method and device for lubricating and cooling a bearing that is subject to high loads.
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Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
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Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
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Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
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Stucker John F., Method and system for rejuvenating pressurized fluid solvents used in cleaning substrates.
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Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
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Stucker John F., Method for rejuvenating pressurized fluid solvent used in cleaning a fabric article.
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Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
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Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
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Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
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Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
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Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
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Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
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Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
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Sauer Richard A. ; Hubert Jean-Luc ; Connors Robert W., Pressure-swing absorption based cleaning methods and systems.
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Wuester,Christopher D., Process flow thermocouple.
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Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
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Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
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Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
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Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
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William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
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Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
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Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
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Shinbara Kaoru,JPX, Substrate processing unit and substrate processing apparatus using the same.
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Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit, Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials.
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Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
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Janikowski, Stuart K.; Toth, William J.; Ginosar, Daniel M.; Allen, Charles A.; Argyle, Mark D.; Fox, Robert V.; Propp, W. Alan; Miller, David L., System configured for applying a modifying agent to a non-equidimensional substrate.
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Janikowski,Stuart K.; Argyle,Mark D.; Fox,Robert V.; Propp,W. Alan; Toth,William J.; Ginosar,Daniel M.; Allen,Charles A.; Miller,David L., System configured for applying a modifying agent to a non-equidimensional substrate.
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Propp, W. Alan; Argyle, Mark D.; Janikowski, Stuart K.; Fox, Robert V.; Toth, William J.; Ginosar, Daniel M.; Allen, Charles A.; Miller, David L., System configured for applying multiple modifying agents to a substrate.
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Stucker John F., System for rejuvenating pressurized fluid solvents used in cleaning substrates.
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Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
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Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
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Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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Halbmaier, David L., Wafer container washing apparatus.
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Halbmaier,David L.; Gregerson,Barry, Wafer container washing apparatus.
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