초록 ▼

Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual t

Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.

대표청구항 ▼

Encapsulating mold equipment for use with a mold press, said equipment comprising: a base platen for support of a mold and an upper platen overlying said base platen; a center plate supported on said base platen and having a pair of substantially parallel side edges; end and side frame members dispo

Encapsulating mold equipment for use with a mold press, said equipment comprising: a base platen for support of a mold and an upper platen overlying said base platen; a center plate supported on said base platen and having a pair of substantially parallel side edges; end and side frame members disposed on opposite sides of said center plate; the parallel side edges of said center plate and said end and side frame members forming a pair of substantially rectangular positioning recesses; a pair of substantially rectangular, portable mold base members dimensioned to interfit within said positioning recesses, said positioning recesses being dimensioned to maintain said mold base members in fixed position relatively to said base platen, said mold base members having upwardly facing planar support surfaces for support of strip material having an upper surface with spaced apart devices to be encapsulated thereon; said center plate having an upper planar surface having grooves forming runner passages formed therein, said grooves terminating at the parallel side edges of the center plate; an elongated cavity insert having substantially parallel edges disposed in overlying relationship on each said mold base member planar support surface, each said cavity insert having a side edge abutting one of said parallel side edges of said center plate and a plurality of spaced mold forming cavities extending therethrough, said cavities corresponding in number to the devices on the upper surface of a piece of said strip material positioned on each said planar support surface, said cavities being dimensioned and positioned to receive said devices and a charge of encapsulating thermosetting resin sufficient to form an encapsulating layer covering said devices, each said cavity insert having a lower sealing surface surrounding each cavity and cooperating with the upper surface of said strip material on said upwardly facing planar support to form a seal surrounding each device, each said cavity insert further having an upper sealing surface cooperating with said upper mold plate when the upper and lower platens are in the closed position, said upper sealing surface of said cavity insert being coplanar with the upper planar surface of the center plate; gate and vent passages formed exclusively in the upper planar surface of each cavity insert, said gate passages extending from each cavity to the side edge abutting one of said side edges of said center plate and said vent passages extending from the cavities to the opposite side edge of the cavity insert, said gate passages joining with the runner passage terminating at the adjacent side edge of the center plate; and means for delivery of encapsulating resin through said runner passages, said gate passages to each of said cavities.