$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Electronic apparatus and method of cooling the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/473
출원번호 US-0735890 (1991-07-25)
우선권정보 JP-0204690 (1990-08-01); JP-0204103 (1990-08-01); JP-0204102 (1990-08-01)
발명자 / 주소
  • Koizumi Shigeru (Hadano JPX) Zushi Shizuo (Hadano JPX) Komiya Mitsuo (Hadano JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 131  인용 특허 : 0

초록

An electronic apparatus comprises an electronic circuit unit having heat-generating electronic parts and cooling jackets fed with a coolant so as to cool the heat-generating electronic parts, and a coolant cooling unit having a heat exchanger for cooling the coolant from the cooling jackets and a pu

대표청구항

An electronic apparatus comprising: an electronic circuit unit including heat-generating electronic parts, and cooling jackets fed with a coolant from a coolant pipe so at to cool said heat-generating electronic parts; a coolant cooling unit including a coolant tube with fins through which said cool

이 특허를 인용한 특허 (131)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  3. Nickum Larry A., Apparatus for cooling an electronic device.
  4. Yatskov,Alexander I., Apparatuses and methods for cooling electronic devices in computer systems.
  5. Angelis,Walter Georg; Seidler,Siegfried; Laufer,Wolfgang, Arrangement and method for removing heat from a component which is to be cooled.
  6. Yatskov,Alexander I.; Hellriegel,Stephen V. R., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  7. Lindenstruth, Volker; Stöcker, Horst, Building for a computer centre with devices for efficient cooling.
  8. Quisenberry, Tony, Butterfly wrap.
  9. Chien Chuan-Fu,TWX, CPU cooling system.
  10. Tsai,Ming Kun, CPU heat dissipating device structure.
  11. Tsoi,Vadim, Cabinet cooling.
  12. Quisenberry, Tony, Calf wrap.
  13. Quisenberry, Tony, Calf wrap.
  14. Quisenberry, Tony, Circumferential leg wrap.
  15. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Havis, Clark R., Compression sequenced thermal therapy system.
  16. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Havis, Clark R., Compression sequenced thermal therapy system.
  17. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Havis, Clark R., Compression sequenced thermal therapy system.
  18. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Havis, Clark R., Compression sequenced thermal therapy system.
  19. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  20. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  21. Tang, Xian-Xiu, Computer casing having liquid cooling unit.
  22. Scott, Alexander Robin Walter, Computer cooling apparatus.
  23. Scott, Alexander Robin Walter, Computer cooling apparatus.
  24. Scott,Alexander Robin Walter, Computer cooling apparatus.
  25. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  26. Zimmermann, Augusto Jose Pereira; Possamai, Fabricio Caldeira; Santini, Jr., Otavio, Computer docking station.
  27. Lee,Sang Cheol, Computers.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kemink, Randall G.; Schmidt, Roger R.; Simons, Robert E., Conductive heat transport cooling system and method for a multi-component electronics system.
  29. Quisenberry, Tony; Balachandran, Niran; McSpadden, Sam K.; Blackwell, Bob, Contact cooler for skin cooling applications.
  30. Hiroyuki Osakabe JP; Kiyoshi Kawaguchi JP; Masahiko Suzuki JP; Shigeru Kadota JP, Cooling apparatus boiling and condensing refrigerant.
  31. Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
  32. Matsui Toshinori,JPX ; Niimi Yukihide,JPX ; Kobayashi Toshiki,JPX, Cooling device for electronic parts of vehicle.
  33. Novotny,Shlomo, Cooling failure mitigation for an electronics enclosure.
  34. Byers, Charles C.; Scofield, William H., Cooling manifold.
  35. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K; Schmidt,Roger R.; Simons,Robert E., Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack.
  36. Park, Jung-Sik; Hong, Eon-Pyo; Park, Yong-Dol; Shin, Dong-Koo; Jung, Jin-Young; Lee, Hyeong-Kook, Cooling system for integrated circuit chip.
  37. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  38. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  39. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  40. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  41. Hiroshi Nakamura JP; Chihei Kitahara JP; Kentaro Tomioka JP; Katsuhiko Yamamoto JP, Cooling unit for cooling a heat-generating component in an electronic apparatus.
  42. Iyengar, Madhusudan K.; Schmidt, Robert R., Data center with dual radiator cabinets for redundant operation.
  43. Iyengar, Madhusudan K.; Schmidt, Roger R., Data center with dual radiator cabinets for redundant operation.
  44. Goodwin, Jonathan; Amaral, Jr., Donald P., Electrical and fluid interconnect.
  45. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  46. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.
  47. Tomioka, Kentaro; Hisano, Katsumi; Takamatsu, Tomonao; Tanimoto, Mitsuyoshi; Kusaka, Hiroyuki; Kinoshita, Teruo, Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component.
  48. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus including liquid cooling unit.
  49. Kester,Douglas Alan; Schnetzka,Harold Robert; Yanik,Mustafa Kemel; Judge,John F.; Naduvath,Mahesh Valiya; Hill, IV,Frank Highland, Electronic component cooling system for an air-cooled chiller.
  50. Aoki, Hitoshi; Kubota, Junichi; Komatsubara, Takeo; Motegi, Junichi; Kakinuma, Hirotaka; Otsuka, Naoki; Matsuoka, Masaya, Electronic device.
  51. Overton L. Parish, IV ; Roger S. DeVilbiss, Electronic enclosure cooling system.
  52. Kondo, Yoshihiro; Ohashi, Shigeo; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuji; Nakanishi, Masato; Sasaki, Yasuhiko; Nakagawa, Tsuyoshi; Suzuki, Osamu; Matsushita, Shinji; Yamada, Yasunori, Electronic equipment.
  53. Kondo,Yoshihiro; Ohashi,Shigeo; Minamitani,Rintaro; Naganawa,Takashi; Yoshitomi,Yuji; Nakanishi,Masato; Sasaki,Yasuhiko; Nakagawa,Tsuyoshi; Suzuki,Osamu; Matsushita,Shinji; Yamada,Yasunori, Electronic equipment.
  54. Melgaard, Hans L., Enclosure and method for temperature-sensitive components.
  55. Quisenberry, Tony, Foot wrap.
  56. Ellsworth, Jr., Michael J.; Lehman, Bret W.; Matteson, Jason A.; Schmidt, Roger R., Frame level partial cooling boost for drawer and/or node level processors.
  57. Doll,Wade J., Heat-spreading devices for cooling computer systems and associated methods of use.
  58. Dunn, John; Novotny, Shlomo; Vogel, Marlin, High-power multi-device liquid cooling.
  59. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Hybrid cooling system and method for a multi-component electronics system.
  60. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Hybrid cooling system for a multi-component electronics system.
  61. Bean, Jr., John H., Ice thermal storage.
  62. Bean, Jr., John H., Ice thermal storage.
  63. Quisenberry, Tony, Knee wrap.
  64. Shih, Shoei-Yuan, Liquid cooled radiation module for servers.
  65. Matsushita,Shinji; Oikawa,Hironori, Liquid cooling module.
  66. Hamman,Brian A., Liquid cooling system.
  67. Gwin, Paul J.; Konstad, Rolf A., Liquid cooling system for processors.
  68. Tomioka,Kentaro; Hisano,Katsumi, Liquid cooling system including a liquid absorption and a leak detection device.
  69. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat exchanger therefor.
  70. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  71. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.
  72. Ishimine, Junichi; Suzuki, Masahiro; Miyo, Masahiro; Fujisaki, Akihiko; Takemura, Keizo; Wei, Jie; Kawashima, Hisashi; Udagawa, Yoshiaki; Yamamoto, Haruhiko; Mochizuki, Masahiro, Liquid-cooled electronic apparatus.
  73. Pautsch, Gregory W., Method and apparatus for cooling electronic components.
  74. Lenhardt,Ronald Robert James, Method and apparatus for cooling semiconductor chips.
  75. Ostwald, Timothy C.; Plutt, Daniel J.; Manes, Joseph P., Method and apparatus for liquid cooling computer equipment.
  76. Svante Enlund SE, Method and device for cooling of electronic/computer equipment and use thereof.
  77. Novotny,Shlomo; Rousmaniere,Arthur S.; Vogel,Marlin, Method and system for cooling electronic components.
  78. Cui, Yan; Gao, Tianyi; Ingalz, Charles J.; Heydari, Ali, Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks.
  79. Quisenberry, Tony, Method and system for therapeutic use of ultra-violet light.
  80. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony, Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis.
  81. Parish, Overton L.; Quisenberry, Tony; Balachandran, Niran; McSpadden, Sam K., Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis.
  82. Parish, Overton L.; Quisenberry, Tony; Balachandran, Niran; McSpadden, Sam K., Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis.
  83. Quisenberry, Tony; Taber, Todd Davis, Method and system for wound care.
  84. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method for combined air and liquid cooling of stacked electronics components.
  85. Liu, Lucy Yi; Sun, Jian, Method for detection of loss of refrigerant.
  86. Quisenberry, Tony; Balachandran, Niran, Method of and system for thermally augmented wound care oxygenation.
  87. Quisenberry, Tony; Balachandran, Niran, Method of and system for thermally augmented wound care oxygenation.
  88. Igarashi, Takeshi, Method of cooling system for a personal computer and personal computer.
  89. Alvin B. See ; Richard A. Mitchell, Method, system and computer program product for self-draining plumbing for liquid-cooled devices.
  90. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Method, system and program product for monitoring rate of volume change of coolant within a cooling system.
  91. Hiltgen,Daniel K., Method, system, and article of manufacture for agent processing.
  92. Carlson,Mark A.; da Silva,Rowan E., Method, system, and program for configuring system resources.
  93. Connor,William H.; Hanson,Jeffrey A.; Taylor,Brandon E., Method, system, and program for discovering components within a network.
  94. Campbell, Levi A.; Colbert, John L.; Ellsworth, Jr., Michael J.; Sinha, Arvind K., Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates.
  95. Pfahnl,Andreas C., Modular liquid cooling of electronic assemblies.
  96. Pfahnl,Andreas C., Modular rackmount chiller.
  97. Walters,Joseph Douglass; Stefanoski,Zoran; Lee,Tommy C., Modular, scalable thermal solution.
  98. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  99. Heydari,Ali, Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
  100. Rohr, Daniel J., Optically detected liquid depth information in a climate control unit.
  101. Rapaich, Mark, Portable augmented silent cooling docking station.
  102. Beckman Jerry L., Power adapter having a thermal cooling assembly for a digital information appliance.
  103. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Redundant assembly for a liquid and air cooled module.
  104. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
  105. Gwin, Paul J.; Konstad, Rolf A.; Davison, Peter A.; Trautman, Mark A., Sealed and pressurized liquid cooling system for microprocessor.
  106. Fendley,Tracy W.; Euker,Rick T.; Thordarson,Brent W., Self contained, liquid to air cooled, memory test engineering workstation.
  107. Pautsch, Gregory W., Spray evaporative cooling system and method.
  108. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Cardenas ; Clark Montford Henry ; Winn David, Spray hood protector in a fluid-based cooling system.
  109. Cox, William E.; Schmidt, Roger R., Stackable liquid cooling pump.
  110. Shari Lynn Slovikosky, System and method for cooling a central processing unit.
  111. Kumlin, Tyrell K.; Labonte, Luc W.; Tye, Trentent; Macgregor, Zack P., System and method for cooling a computer.
  112. Franz, Jason; Bryan, James; Jackson, Bradley, System and method for cooling information handling resources.
  113. Olsen, John; Jackson, Bradley; Sendelbach, Eric; Higham, Gabriel; Bryan, James; Franz, Jason; North, Travis; Morris, William, System and method for cooling information handling resources.
  114. Stefanoski, Zoran; Kim, Jeong H., System for efficiently cooling a processor.
  115. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  116. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  117. Hellriegel,Stephen V. R.; Yatskov,Alexander I.; Kelley,Douglas P., Systems and methods for cooling computer modules in computer cabinets.
  118. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Leggett, William F., Thermal control system for rack mounting.
  119. Parish, Overton L.; Balachandran, Niran; Quisenberry, Tony; Leggett, William F., Thermal control system for rack mounting.
  120. Pfahnl,Andreas C.; Griffith,Peter, Thermally enhanced pressure regulation of electronics cooling system.
  121. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  122. Akiyama, Yuki; Osaka, Tadashi; Arai, Masatsugu, Vehicle device temperature adjustment system.
  123. Hsieh, Hsin Mao, Water-cooler radiator module.
  124. Quisenberry, Tony, Wound care and infusion method and system utilizing a thermally-treated therapeutic agent.
  125. Quisenberry, Tony, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  126. Quisenberry, Tony, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  127. Quisenberry, Tony, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  128. Quisenberry, Tony, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  129. Quisenberry, Tony, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  130. Quisenberry, Tony; Balachandran, Niran, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
  131. Quisenberry, Tony; Balachandran, Niran, Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로