이 특허를 인용한 특허 (102)

1. Bollesen Vernon P., Add-on heat sink and method.

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2. Smithers Matthew (Lewisville TX), Anchor for securing a heat sink to a printed circuit board.

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3. Mertol Atila, Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages.

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4. Thurston Mark Edward,JPX ; Xie Hong, Apparatus for attaching a heat sink to a PCB mounted semiconductor package.

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5. Huang, Yu-Chung; Chung, Chen-Hui, Apparatus for positioning heat sink.

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6. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Apparatus with lighting units.

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7. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.

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8. Hill, Richard F.; Riaz, Shahi, Assemblies and methods for dissipating heat from handheld electronic devices.

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9. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Billboard and lighting assembly with heat sink and three-part lens.

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10. Auyeung, David Siucheong, Billboard with light assembly for substantially uniform illumination.

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11. Chen, Char-her, Buckle.

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12. Chu Ching-Hung,TWX, CPU heat dissipating device.

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13. Vernon P. Bollesen, Cabinet assisted heat sink.

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14. Coronati, John Michael; Messenger, Eugene; Sipics, Michael; Riska, Joseph Edward; Zhang, Jiaming, Clamp interconnect.

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15. Bell James S., Clamping device for securing an electrical component to a circuit board.

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16. Farnworth, Warren M.; Gochnour, Derek; Wood, Alan, Clip chip carrier.

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17. Hsieh Kun Lee TW; Wellint Xia CN, Clip for heat sink.

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18. Bollesen, Vernon P., Clip heat sink assembly.

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19. English,Gerald Robert, Combined board level EMI shielding and thermal management.

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20. Robinson,Kenneth M.; Kline,James E., Combined board level shielding and thermal management.

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21. Corrado, Joseph P.; Notohardjono, Budy D.; Schmidt, Roger R., Compliant heat sink device/mounting system interconnect and a method of implementing same.

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22. Busch, Klaus; Deinhardt, Günther; Reinhard, Alexander; Wiesner, Christoph, Cooling system, cold plate and assembly having a cooling system.

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23. English, Gerald Robert; Zuehlsdorf, Allan Richard, EMI shielding and thermal management assemblies including frames and covers with multi-position latching.

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24. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.

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25. Azar, Kaveh, Electronics package with integrated lugs for cooling attachment.

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26. Bollesen Vernon P., Fan heat sink and method.

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27. Wang,Frank; Yang,Chih Kai, Fastening structure.

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28. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.

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29. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Forty-eight by fourteen foot outdoor billboard to be illuminated using only two lighting assemblies.

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30. Lee,Tsung Lung; Liu,Zhi Gang, Heat dissipation device including wire clips.

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31. Yi, Chong Hun; Balthaser, Andrew Dewitt; Klinger, Brian; McAlonis, Matt Richard; Miller, Keith, Heat sink.

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32. Olson Robert Norman, Heat sink and spring clip assembly.

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33. Hung-Chi Yu TW, Heat sink assembly with pressing wedges.

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34. Richard B. Salmonson ; David Paul Gruber, Heat sink attachment clip.

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35. Azar, Kaveh; Barot, Vineet Sunil; Pikovsky, Anatoly, Heat sink clip.

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36. Azar, Kaveh; Barot, Vineet Sunil; Pikovsky, Anatoly, Heat sink clip.

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37. Bollesen Vernon P., Heat sink clip tool.

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38. Auyeung, David Siucheong, Heat sink for LED light source.

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39. Auyeung, David Siucheong, Heat sink for LED light source.

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40. Remsburg, Ralph, Heat sink having thermal distortion compensation.

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41. Tata Peter D., Heatsink assembly with adjustable retaining clip.

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42. Narasimhan,Susheela; Nguyen,Nguyen T.; Sayed,Saeed; Kadivar,Mohammad Reza Danesh, Heatsink attachment mechanism.

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43. Stephen Nicholas Siu, Heatsink retainer.

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44. Lemke, Timothy A.; Houtz, Timothy W., High density connector and method of manufacture.

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45. Lemke,Timothy A.; Houtz,Timothy W., High density connector and method of manufacture.

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46. Samaras Bill ; Brownell Michael ; McCutchan Dan R. ; Xie Hong, Integrated circuit cartridge.

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47. Yusuf Imran ; Xie Hong ; Cook ; Jr. Johnny M. ; Brandenburger Peter ; Chandran Biju ; Ekhlassi Hamid, Integrated circuit cartridge and method of fabricating the same.

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48. Richard J Luebs ; Jonathan W Craig ; Jeffrey L. Deeney ; David W. Peters, Integrated circuit device package including multiple stacked components.

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49. Meyer ; IV George A. ; Toth Jerome E. ; Tran Mai-Loan ; Taylor Attalee S., Integrated circuit heat seat.

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50. Wong, Thomas; Ulen, Neal; Davison, Peter; Shah, Ketan, Integrated circuit heat sink support and retention mechanism.

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51. Wong, Thomas; Ulen, Neal; Davison, Peter; Shah, Ketan, Integrated circuit heat sink support and retention mechanism.

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52. Murphy James V., Integrated circuit intercoupling component with heat sink.

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53. Brian A. Scott, Integrated circuit refrigeration device.

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54. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.

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55. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.

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56. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, LED light assembly having three-part optical elements.

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57. Auyeung, David S., LED light assembly with three-part lens.

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58. Auyeung, David Siucheong, LED light assembly with three-part lens.

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59. Auyeung, David Siucheong; Hall, William Y; Magarill, Simon, LED lighting assembly with uniform output independent of number of number of active LEDs, and method.

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60. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Light assembly for providing substantially uniform illumination.

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61. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Lighting assembly with multiple lighting units.

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62. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Lighting assembly with multiple lighting units.

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63. Auyeung, David Siucheong; Hall, William Y; Magarill, Simon, Lighting device with transparent substrate, heat sink and LED array for uniform illumination regardless of number of functional LEDs.

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64. Robinson,Kenneth M.; Kline,James E., Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith.

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65. McLeod, Gary; Li, I-Chyau, Mechanisms and techniques for fastening a heat sink to a circuit board component.

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66. Cromwell S. Daniel ; Nobi Laszlo, Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management.

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67. Cromwell S. Daniel, Method and apparatus for a modular integrated apparatus for multi-function components.

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68. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.

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69. Cromwell S. Daniel, Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules.

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70. Wilcox,Kurt S.; Guillien,Wayne; Knollenberg,Clint; Kinnune,Brian L.; Walczak,Steven R., Method and apparatus for mounting an LED module to a heat sink assembly.

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71. Ashdown, Glynn Russell, Method and apparatus for surface mounted power transistor with heat sink.

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72. Vernon P. Bollesen, Method for thermally connecting a heat sink to a cabinet.

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73. Farnworth, Warren M.; Gochnour, Derek; Wood, Alan, Method of forming a semiconductor chip carrier.

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74. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Method of uniformly illuminating a billboard.

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75. Viernes, Rainier; Chern, Michael, Methods and apparatus for attaching a heat sink to a circuit board component.

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76. Nguyen,Nguyen Tu; Dang,Long Huu; Seyed,Saeed, Methods and apparatus for fastening a set of heatsinks to a circuit board.

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77. Evans ; III F. Lee ; Lause Alan L., One-piece clip for waffle pack chip holders.

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78. Auyeung, David Siucheong, Optical panel for LED light source.

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79. Auyeung, David Siucheong, Optical panel for LED light source.

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80. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Outdoor billboard with lighting assemblies.

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81. Auyeung, David Siucheong; Hall, William Y.; Magarill, Simon, Outdoor billboard with lighting assemblies.

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82. Cromwell S. Daniel, Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU).

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83. Kirchberger, Michael; Kulig, Stefan, Plastic frame for the mounting of an electronic heavy-current control unit.

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84. Bailey, Edmond I., Printed circuit board employing heat sink retaining apparatus and method of use.

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85. Ichikizaki, Yasunori; Hirakawa, Masato; Yamashita, Takashi, Protecting cover and electronic device assembly.

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86. Cipolla Thomas M. (Katonah NY) Coteus Paul W. (Yorktown Heights NY), Removable heat sink assembly for a chip package.

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87. Cipolla Thomas Mario ; Coteus Paul William, Removable heat sink assembly process for a chip package.

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88. Bollesen Vernon P. ; Zhang Ron ; Jones James A., SRAM heat sink assembly and method of assembling.

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89. Bollesen Vernon P., Self-locking heat sink assembly and method.

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90. Bradt Douglas H., Snap-lock heat sink clip.

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91. Mertol Atila, Stiffener with slots for clip-on heat sink attachment.

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92. Clemens Donald (The Colony TX) Smithers Matthew C. (Lewisville TX), Strap spring for heat sink clip assembly.

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93. Clemens Donald ; Smithers Matthew C., Strap spring for heat sink clip assembly.

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94. Auyeung, David Siucheong, Structure for protecting LED light source from moisture.

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95. Auyeung, David Siucheong, Structure for protecting LED light source from moisture.

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96. Andros Frank E. ; Gaynes Michael A. ; Shaukatullah Hussain ; Storr Wayne R., Structure for removably attaching a heat sink to surface mount packages.

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97. Kang Ki B., Surface complemental heat dissipation device.

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98. Nguyen,Toan; Chern,Michael; Seyed,Saeed, Techniques for attaching a heat sink assembly to a circuit board component.

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99. Liang,Hsing Sheng; Sya,George; Huynh,Hong; Koken,Michael; Chern,Michael; Fang,Yuan Cheng, Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board.

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100. Sya,George; Huynh,Hong; Koken,Michael, Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board.

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101. Bollesen Vernon, Wire heat sink assembly and method of assembling.

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102. Mania,Michael John; O'Donnell,Brian Patrick; Fox,Laurence; Pedoeem,Albert, Wrap around heat sink apparatus and method.

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