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High R super insulation panel

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-001/04
출원번호 US-0993883 (1992-12-23)
발명자 / 주소
  • Rusek
  • Jr. Stanley J. (Newark OH)
출원인 / 주소
  • Owens-Corning Fiberglas Technology Inc. (Summit IL 02)
인용정보 피인용 횟수 : 50  인용 특허 : 0

초록

An insulation panel comprises an insulation board of glass fibers and a partially evacuated gas-tight envelope encapsulating the board, where, prior to the evacuation of the envelope, the board has been subjected to a heat setting process in which the board is raised to a heat setting temperature ab

대표청구항

An insulation panel comprising a heat set insulation board of compressed glass fibers and a partially evacuated gas-tight envelope encapsulating the board, where, prior to the evacuation of the envelope, the board has been subjected to a heat setting process in which the glass fiber board is raised

이 특허를 인용한 특허 (50)

  1. McGrath Ralph D. (Granville OH) Kline Bret E. (Columbus OH) Musgave Dwight S. (Granville OH), Appliance cabinet construction.
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  3. Ranade, Ajit, Double bag vacuum insulation panel for steam chest molding.
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  25. Bowers, Jeffrey A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Jung, Edward K. Y.; Kare, Jordin T.; Leuthardt, Eric C.; Myhrvold, Nathan P.; Nugent, Jr., Thomas J.; Tegreene, Clarence T.; Whitmer, Charles; Wood, Jr., Lowell L., Storage container including multi-layer insulation composite material having bandgap material.
  26. Bowers, Jeffrey A.; Hyde, Roderick A.; Ishikawa, Muriel Y.; Jung, Edward K. Y.; Kare, Jordin T.; Leuthardt, Eric C.; Myhrvold, Nathan P.; Nugent, Jr., Thomas J.; Tegreene, Clarence T.; Whitmer, Charles; Wood, Jr., Lowell L., Storage container including multi-layer insulation composite material having bandgap material.
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  45. Lin David C. K., Vacuum insulation panel having blended wool filler and method for manufacturing.
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  49. Coon, Larry K.; Zguris, George; Svoboda, Patrick, Vibrationally compressed glass fiber and/or other material fiber mats and methods for making the same.
  50. Stark, David H., Wafer-level hermetic micro-device packages.
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