[특허]Electronic equipment and computer with heat pipe

Electronic equipment and computer with heat pipe 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0936299 (1992-08-28)
우선권정보	JP-0219593 (1991-08-30)
발명자 / 주소	Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX)
출원인 / 주소	Hitachi, Ltd. (Tokyo JPX 03)
인용정보	피인용 횟수 : 65 인용 특허 : 0

초록 ▼

An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.

대표청구항 ▼

An electronic equipment comprising: a plurality of electronic parts generating different amounts of heat; at least one heat pipe having a first portion adjacent one end of said at least one heat pipe for absorbing the heat generated from said electronic parts and a second portion adjacent the other end of said at least one heat pipe for radiating the thus absorbed heat; and at least one generally flat heat transfer means disposed to cover said first portion of said at least one heat pipe; said electronic parts being arranged in heat conducting relation with said heat transfer means such that an electronic part generating a greater amount of heat is disposed on said heat transfer means at a first point relatively closer to said second portion of said at least one heat pipe than a second point and another electronic part generating a smaller amount of heat is disposed on said heat transfer means at said second point relative further from said second portion than said first point and between said first point and said one end of said at least one heat pipe, wherein the heat generated by each of said electronic parts and the distance from the other end of said at least one heat pipe to the electronic part has a relationship given by the following equation: [Figure] where Qi is the amount of head generated from each of said electronic parts, l1 is a distance from the other end of said heat pipe to each of said electronic parts, Q is the amount of heat generated from any one of said electronic parts when a phenomenon of dryout of a heat transfer liquid in said heat pipe takes place, l is a distance from said other end of said heat pipe to the electronic part when the dryout takes place, and i=1 . . . n indicates the number of said electronic parts.

이 특허를 인용한 특허 (65)

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Lee,Sang Cheol, Computer.
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Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
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Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
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Tajima Makoto,JPX, Electronic component cooling unit.
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Yamazaki Osamu,JPX ; Nagasawa Yoshiaki,JPX ; Ishida Katsuaki,JPX ; Sukagawa Tomoo,JPX, Frame structure of a disk drive for improved heat dissipation and a disk drive that uses such a frame structure.
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Peng,Xue Wen; Chen,Rui Hua, Heat dissipation device.
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Zhou, Shi-Wen; Liu, Peng; Cao, Jun, Heat dissipation device having a fan for dissipating heat generated by at least two electronic components.
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Rakesh Bhatia, Heat exchanger for a portable computing device utilizing active and passive heat dissipation mechanisms.
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Kawabata, Kenya; Oomi, Masaru; Ohno, Ryoji, Heat sink with heat pipes and method for manufacturing the same.
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Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.
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Shun-lung Chao, Heatsink with embedded heat pipe for thermal management of CPU.
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Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
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Cipolla Thomas Mario ; Coteus Paul William ; Mok Lawrence Shungwei, Hinge incorporating a helically coiled heat pipe for a laptop computer.
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Brownell Michael ; McCutchan Dan ; Xie Hong ; Haley Kevin, Injection molded thermal interface system.
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Wieloch Christopher J., Insulated surface mount circuit board construction.
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Samaras Bill ; Brownell Michael ; McCutchan Dan R. ; Xie Hong, Integrated circuit cartridge.
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Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Brian A. Scott, Integrated circuit refrigeration device.
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Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.
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Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
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L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
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Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
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Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
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Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
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French,F. William; Merrill,Leonard A., Method and apparatus for dispersing heat from high-power electronic devices.
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DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
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DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
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Kevin A. McCullough, Net-shape molded heat exchanger.
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Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
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Song Kwang-Ho,KRX, Portable computer having a heat-emitting device mountable on a CPU for emitting heat generated from the CPU via air ven.
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Sagal, E. Mikhail, Radial fin thermal transfer element and method of manufacturing same.
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Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
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Katsuyuki Kajiura JP, Semiconductor device mounting structure and feeding-side charger with heat radiating unit.
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Park, JaeHong; Lee, Hanhong; Joo, Sungwoo; Baek, Woon-young, Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package.
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Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
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Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
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Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.
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Sarraf David B. ; Toth Jerome E. ; Gernert Nelson J., Stress relieved integrated circuit cooler.
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Han, Jake J.; Johnson, Mitchell Kevin, System and method for extracting heat from a printed circuit board assembly.
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Garner,Scott D., Thermal management system and method for electronics system.
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Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
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Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.
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Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Electronic equipment and computer with heat pipe 원문보기

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Electronic equipment and computer with heat pipe 원문보기

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이 특허를 인용한 특허 (65)

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