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Method of welding thermoplastic substrates with microwave frequencies 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-027/36
출원번호 US-0481296 (1990-02-20)
발명자 / 주소
  • Lause Herbert J. (Murrysville PA) Parks Kristen L. (Robinson Township
  • Indiana County PA) Tanis Larry D. (Kiskiminetas PA) Leon David D. (Murrysville PA)
출원인 / 주소
  • Aluminum Company of America (Pittsburgh PA 02)
인용정보 피인용 횟수 : 46  인용 특허 : 0

초록

Microwave frequencies in the range of 0.5 GHz to 10 GHz are used to weld thermoplastic substrates by interposing a carrier strip. The strip is formed of a polymer carrier which is miscible in the substrates. Electrically conductive submicron carbon black susceptor particles are chosen with specified

대표청구항

A method for welding substrates of a thermoplastic synthetic resinous material, comprising, (a) interposing between said substrates, in contact with each, in a weld-zone in which a weld is to be made, a strip comprising a thermoplastic carrier polymer miscible with said material, said carrier having

이 특허를 인용한 특허 (46)

  1. Cook, Michael; Paquette, Michael S.; Haley, Jr., Robert P.; Crabtree, Sam; Longoria, Jose; Siavoshani, Saeed; Mercure, Peter K.; Lai, Shih-Yaw; Van Daele, Ronald G., Additives for the use of microwave energy to selectively heat thermoplastic polymer systems.
  2. Kray, Nicholas Joseph; Finn, Scott Roger; Baehmann, Peggy Lynn; Shim, Dong-Jin; Gemeinhardt, Gregory Carl, Attachment of composite article.
  3. Kray, Nicholas Joseph; Finn, Scott Roger; Baehmann, Peggy Lynn; White, Joel Primmer, Attachment of composite article.
  4. Schramm, Detlef; Koopmans, Rudolf J.; Zalemea Bustillo, Luis G., Composition, connector, process for improving bonding between two or more means for conveying fluids, and system for conveying fluids.
  5. Fathi Zakaryae ; Garard Richard S. ; Wei Jianghua, Conductive insert for bonding components with microwave energy.
  6. Heineck, David; Fathi, Zakaryae, Customized microwave energy distribution utilizing slotted cage.
  7. Heineck, David; Fathi, Zakaryae, Customized microwaving energy distribution utilizing slotted wave guides.
  8. Kirsten, Christian N.; Christophliemk, Peter; Nonninger, Ralph; Schirra, Herrmann; Schmidt, Helmut, Detachable adhesive compounds.
  9. Rakutt, Dietmar; Berger, Lukas, Foamed plastic sheet.
  10. King James D. ; Donoho ; Jr. Harold F., H-field electromagnetic heating system for fusion bonding.
  11. Kawamoto Shigeru,JPX, Joining process of resin members.
  12. Celik, Ceyhan; Clark, Sarah L.; Hildreth, Jr., Gary Charles; Joshi, Helina; Vaideeswaran, Karthik; Valdenaire, Christophe; Sousa, Jose R.; Ghalambor, Hamid Reza, Large diameter thermoplastic seal.
  13. Bredt, James F.; Anderson, Timothy; Russell, David B.; Clark, Sarah L.; DiCologero, Matthew J., Material systems and methods of three-dimensional printing.
  14. Gupte,Sunil K.; Parrish,Kenneth R., Method and apparatus for bonding a cover to a substrate using high frequency microwaves.
  15. Kirsten,Christian, Method for accelerating the curing of adhesives.
  16. Booske, John H.; Thompson, Keith J.; Gianchandani, Yogesh B.; Cooper, Reid F., Method of bonding a stack of layers by electromagnetic induction heating.
  17. Liu, Yuxiang; Singh, Rojendra, Method of forming large diameter thermoplastic seal.
  18. Vaideeswaran, Karthik; Sousa, Jose R.; Ghalambor, Hamid Reza; Clark, Sarah L.; Celik, Ceyhan; Hildreth, Jr., Gary Charles; Joshi, Helina, Method of forming large diameter thermoplastic seal.
  19. Bruce J. Kilgore ; Thomas McKnight ; Roy Lynn O'Mohunddro ; John A. Battista, Jr. ; Richard J. Petrucci ; Zakaryae Fathi ; Jianghua Wei, Methods and apparatus for bonding deformable materials having low deformation temperatures.
  20. Bredt, James F.; Clark, Sarah L.; Uy, Evert F.; DiCologero, Matthew J.; Anderson, Timothy; Tarkanian, Michael; Williams, Derek X., Methods and compositions for three-dimensional printing of solid objects.
  21. Wang, Liusheng; Hellman, Scott; Townley-Smith, Paul; Ushinsky, Michael, Microwave assisted bonding method and joint.
  22. Heineck, David; Fathi, Zakaryae, Microwave bonding of EVA and rubber items.
  23. Heineck, David; Fathi, Zakaryae, Microwave bonding of EVA and rubber items.
  24. Wei Jianghua ; Fathi Zakaryae, Microwave curable adhesive.
  25. Owens, Jeffery R., Microwave driven diffusion of dielectric nano- and micro-particles into organic polymers.
  26. Häger, Harald; Pridöhl, Markus; Zimmermann, Guido; Kuhmann, Karl; Göring, Rainer, Plastic composite moulded bodies obtainable by welding in an electromagnetic alternating field.
  27. Padhye, Nikhil; Parks, David Moore; Trout, Bernhardt Levy; Slocum, Alexander H., Plasticity induced bonding.
  28. Kirsten,Christian, Process for adhesive separation of bonded joints.
  29. Braunecker, Laura; Ehlert, Thomas David; Fedel, Tony; Janssen, Robert Allen; MacDonald, John Gavin; McNichols, Patrick Sean; Smith, Jr., Roland C., Process for applying one or more treatment agents to a textile web.
  30. Janssen, Robert Allen; DeGroot, Dennis John; Ehlert, Thomas David; Garvey, Michael Joseph; McCraw, Jr., Earl C.; McNichols, Patrick Sean, Process for dyeing a textile web.
  31. Janssen, Robert Allen; Ehlert, Thomas David; MacDonald, John Gavin; Garvey, Michael Joseph; McNichols, Patrick Sean; McCraw, Jr., Earl C., Process for dyeing a textile web.
  32. Janssen, Robert Allen; Ehlert, Thomas David; MacDonald, John Gavin; McCraw, Jr., Earl C.; McNichols, Patrick Sean; Garvey, Michael Joseph, Process for dyeing a textile web.
  33. Janssen, Robert Allen; Ehlert, Thomas David; MacDonald, John Gavin; McCraw, Jr., Earl C.; McNichols, Patrick Sean; Garvey, Michael Joseph, Process for dyeing a textile web.
  34. Monsheimer, Sylvia; Grebe, Maik; Baumann, Franz-Erich, Process for producing three-dimensional objects by means of microwave radiation.
  35. Haq, Mahmoodul; Drzal, Lawrence T.; Koricho, Ermias G., Reversible adhesive compositions and related methods.
  36. Dempsey Douglas E., Shear bonded molded wheel assembly.
  37. Dempsey Douglas E., Shear-bonded molded bicycle component assembly.
  38. Scoles Roger W. ; Woolley William E., Susceptor integration into reinforced thermoplastic composites.
  39. Lepore ; Jr. Albert (Upper Holland PA), Thermal blanket joining tape.
  40. Bredt, James F.; Clark, Sarah L.; Williams, Derek X.; DiCologero, Matthew J., Thermoplastic powder material system for appearance models from 3D printing systems.
  41. Williams, Derek X., Three dimensional printing material system and method using peroxide cure.
  42. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  43. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  44. Alam, Amir; Bredt, James F.; Clark, Nanette; Flynn, Mary; Sprauer, Jean; Williams, Derek X., Three-dimensional printing material system with improved color, article performance, and ease of use.
  45. Cook, Michael; Salmang, Rudolfo; Paquette, Michael S.; Haley, Jr., Robert P.; Crabtree, Sam L.; Longoria, Jose J.; Bongartz, Herbert; Mayer, Andreas; Siavoshani, Saeed; Mercure, Peter K.; Lai, Shih-Yaw; Watkins, Jeff; Sugden, John L.; Van Daele, Ronald, Use of microwave energy to selectively heat thermoplastic polymer systems.
  46. Butzloff, Peter; Berger, Robert; Antongiovanni, Jamie, Welding of biodegradable polymer parts.
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