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Thin film transistor with three dimensional multichannel structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/78
출원번호 US-0040016 (1993-03-30)
우선권정보 KR-0005291 (1992-03-30)
발명자 / 주소
  • Kim Weonkeun (Incheon KRX) Kim Chulsoo (Kyungki-do KRX) Han Jeongin (Seoul KRX)
출원인 / 주소
  • Samsung Electronics Co., Ltd. (KRX 03)
인용정보 피인용 횟수 : 185  인용 특허 : 0

초록

A thin film transistor gate structure with a three-dimensional multichannel structure is disclosed. The thin film transistor gate structure according to the present invention comprises source/drain electrodes formed so as to be spaced from and opposite to each other on a substrate; semiconductive la

대표청구항

A thin film transistor gate structure comprising: (a) a substrate; (b) a plurality of spaced apart semiconductive strips formed substantially parallel to one another and to said substrate, each said strip having a channel portion; (c) a gate insulating layer surrounding a cross-sectional periphery o

이 특허를 인용한 특허 (185)

  1. Zhang, Hongyong, Active matrix type liquid crystal display device.
  2. Im, James S., Advanced excimer laser annealing for thin films.
  3. Radosavljevic,Marko; Majumdar,Amlan; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark L.; Brask,Justin K.; Shah,Uday; Datta,Suman; Chau,Robert S., Block contact architectures for nanoscale channel transistors.
  4. Lindert, Nick; Cea, Stephen M., Bulk non-planar transistor having strained enhanced mobility and methods of fabrication.
  5. Lindert,Nick; Cea,Stephen M., Bulk non-planar transistor having strained enhanced mobility and methods of fabrication.
  6. Doyle, Brian S.; Jin, Been-Yih; Kavalieros, Jack T.; Datta, Suman; Brask, Justin K.; Chau, Robert S., CMOS devices with a single work function gate electrode and method of fabrication.
  7. Im, James S.; Chung, Ui-Jin, Collections of laterally crystallized semiconductor islands for use in thin film transistors.
  8. Im, James S.; Chung, Ui-Jin, Collections of laterally crystallized semiconductor islands for use in thin film transistors.
  9. Brask, Justin K.; Datta, Suman; Doczy, Mark L.; Blackwell, James M.; Metz, Matthew V.; Kavalieros, Jack T.; Chau, Robert S., Dielectric interface for group III-V semiconductor device.
  10. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device.
  11. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device.
  12. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device.
  13. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device.
  14. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device and method for manufacturing the same.
  15. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device and method for manufacturing the same.
  16. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device and method for manufacturing the same.
  17. Yamazaki, Shunpei; Akimoto, Kengo; Umezaki, Atsushi, Display device comprising an oxide semiconductor.
  18. Hongyong Zhang JP, Electro-optical device.
  19. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX, Electro-optical device incorporating a peripheral dual gate electrode TFT driver circuit.
  20. Radosavljevic, Marko; Datta, Suman; Doyle, Brian S.; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Majumdar, Amian; Chau, Robert S., Field effect transistor with metal source/drain regions.
  21. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  22. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  23. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  24. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  25. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  26. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  27. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  28. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  29. Sakamoto Kunihiro,JPX, Field-effect transistor and method of manufacturing same.
  30. Buynoski,Matthew S.; An,Judy Xilin; Yu,Bin, FinFET device with multiple channels.
  31. Buynoski, Matthew S.; An, Judy Xilin; Wang, Haihong; Yu, Bin, FinFET device with multiple fin structures.
  32. Lin, Ming-Ren; Wang, Haihong; Yu, Bin, FinFET device with multiple fin structures.
  33. Im, James S., Flash lamp annealing crystallization for large area thin films.
  34. Meyers, Brian R.; Smith, Gregory R., Framework for user interaction with multiple network devices.
  35. Brunner Timothy A. (Ridgefield CT) Hsu Louis L. (Fishkill NY) Mandelman Jack A. (Stormville NY) Wang Li-Kong (Montvale NJ), High performance multi-mesa field effect transistor.
  36. Fried, David M.; Nowak, Edward J.; Rankin, Jed H., Implanted asymmetric doped polysilicon gate FinFET.
  37. Fried,David M.; Nowak,Edward J.; Rankin,Jed H., Implanted asymmetric doped polysilicon gate FinFET.
  38. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors.
  39. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  40. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  41. Dennison Charles H. ; Manning Monte, Integrated circuitry and thin film transistors.
  42. Im, James S., Laser-irradiated thin films having variable thickness.
  43. Datta,Suman; Brask,Justin K.; Kavalieros,Jack; Doyle,Brian S.; Dewey,Gilbert; Doczy,Mark L.; Chau,Robert S., Lateral undercut of metal gate in SOI device.
  44. Yamazaki, Shunpei; Sakata, Junichiro; Sakakura, Masayuki; Oikawa, Yoshiaki; Okazaki, Kenichi; Maruyama, Hotaka, Light-emitting device and method for manufacturing the same.
  45. Yamazaki, Shunpei; Sakata, Junichiro; Sakakura, Masayuki; Oikawa, Yoshiaki; Okazaki, Kenichi; Maruyama, Hotaka, Light-emitting device and method for manufacturing the same.
  46. Yamazaki, Shunpei; Sakata, Junichiro; Sakakura, Masayuki; Oikawa, Yoshiaki; Okazaki, Kenichi; Maruyama, Hotaka, Light-emitting device and method for manufacturing the same.
  47. Im, James S.; Van Der Wilt, Paul C., Line scan sequential lateral solidification of thin films.
  48. Lee, Seok Woo, Liquid crystal display device having dummy contact holes and fabrication method thereof.
  49. Lee, Seok Woo, Liquid crystal display device with improved heat dissipation properties and fabrication method thereof, having dummy contact hole between channels.
  50. Okazaki, Kenichi; Oikawa, Yoshiaki; Maruyama, Hotaka; Godo, Hiromichi; Yamazaki, Shunpei, Logic circuit, light emitting device, semiconductor device, and electronic device.
  51. Im, James S., Method and system for facilitating bi-directional growth.
  52. Angermann, Wolfgang; Banisch, Andreas, Method for fabricating field-effect transistors in integrated semiconductor circuits and integrated semiconductor circuit fabricated with a field-effect transistor of this type including a dual gate.
  53. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  54. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  55. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  56. Buynoski, Matthew S.; An, Judy Xilin; Yu, Bin, Method for forming channels in a finfet device.
  57. Lin, Ming-Ren; Wang, Haihong; Yu, Bin, Method for forming structures in finfet devices.
  58. Ito, Shunichi; Hosoba, Miyuki, Method for manufacturing semiconductor device.
  59. Ito, Shunichi; Hosoba, Miyuki, Method for manufacturing semiconductor device.
  60. Ito, Shunichi; Hosoba, Miyuki; Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  61. Ito, Shunichi; Hosoba, Miyuki; Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  62. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Method for manufacturing semiconductor device.
  63. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Method for manufacturing semiconductor device.
  64. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  65. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  66. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  67. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  68. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  69. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  70. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga, Method for manufacturing semiconductor device.
  71. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga; Ito, Shunichi; Hosoba, Miyuki, Method for manufacturing thin film transistor using multi-tone mask.
  72. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga; Ito, Shunichi; Hosoba, Miyuki, Method for manufacturing thin film transistor using multi-tone mask.
  73. Im, James S., Method for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts in edge regions, and a mask for facilitating such artifact reduction/elimination.
  74. Dennison Charles H. ; Manning Monte, Method of fabricating a bottom and top gated thin film transistor having an electrical sidewall connection.
  75. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  76. Brask,Justin K.; Doyle,Brian S.; Kavalleros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Method of forming a metal oxide dielectric.
  77. Brask, Justin K.; Doyle, Brian S.; Kavalieros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material.
  78. Doyle,Brian S.; Datta,Suman; Kavalieros,Jack T.; Majumdar,Amlan, Method of ion implanting for tri-gate devices.
  79. Koo, Jae Bon; You, In-Kyu; Ahn, Seongdeok; Cho, Kyoung Ik, Method of manufacturing thin film transistor and thin film transistor substrate.
  80. Koo, Jae Bon; You, In-Kyu; Ahn, Seongdeok; Cho, Kyoung Ik, Method of manufacturing thin film transistor and thin film transistor substrate.
  81. Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Chau, Robert S., Method of patterning a film.
  82. Tanzawa, Toru, Methods and apparatuses including a select transistor having a body region including monocrystalline semiconductor material and/or at least a portion of its gate located in a substrate.
  83. Tanzawa, Toru, Methods and apparatuses including a select transistor having a body region including monocrystalline semiconductor material and/or at least a portion of its gate located in a substrate.
  84. Tanzawa, Toru, Methods and apparatuses including a select transistor having a body region including monocrystalline semiconductor material and/or at least a portion of its gate located in a substrate.
  85. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
  86. Charles H. Dennison ; Monte Manning, Methods of forming integrated circuitry.
  87. Dennison Charles H. ; Manning Monte, Methods of forming integrated circuitry methods of forming thin film transistors, integrated circuitry and thin film transistors.
  88. Dennison, Charles H.; Manning, Monte, Methods of forming transistors.
  89. Dennison, Charles H.; Manning, Monte, Methods of forming transistors.
  90. Im, James S., Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films.
  91. Zhang,Yuegang; Doyle,Brian S.; Bourianoff,George I., Multi-gate carbon nano-tube transistors.
  92. Doyle, Brian S.; Datta, Suman; Jin, Been Yih; Chau, Robert, Non-planar MOS structure with a strained channel region.
  93. Doyle,Brian S.; Datta,Suman; Jin,Been Yih; Chau,Robert, Non-planar MOS structure with a strained channel region.
  94. Doyle,Brian S; Datta,Suman; Jin,Been Yih; Zelick,Nancy M; Chau,Robert, Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow.
  95. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Datta,Suman; Jin,Been Yih, Nonplanar device with stress incorporation layer and method of fabrication.
  96. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  97. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  98. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  99. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  100. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  101. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  102. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  103. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  104. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  105. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Rios,Rafael; Linton,Tom; Datta,Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  106. Brask, Justin K.; Dovle, Brian S.; Kavalleros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Nonplanar transistors with metal gate electrodes.
  107. Brask,Justin K.; Doyle,Brian S.; Doczy,Mark L.; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  108. Brask,Justin K.; Doyle,Brian S.; Doczy,Mark L.; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  109. Brask,Justin K.; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  110. Suzawa, Hideomi; Sasagawa, Shinya; Muraoka, Taiga; Ito, Shunichi; Hosoba, Miyuki, Oxide semiconductor device formed by using multi-tone mask.
  111. Im, James S., Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions.
  112. Kavalieros, Jack T.; Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Datta, Suman; Doczy, Mark L.; Metz, Matthew V.; Chau, Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  113. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  114. Im, James S.; van der Wilt, Paul Christiaan, Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions.
  115. Im, James S.; van der Wilt, Paul Christiaan, Processes and systems for laser crystallization processing of film regions on a substrate utilizing a line-type beam, and structures of such film regions.
  116. Merkle, Ralph C., Public key distribution using an approximate linear function.
  117. Miyairi, Hidekazu; Osada, Takeshi; Akimoto, Kengo; Yamazaki, Shunpei, Semiconductor device.
  118. Miyairi, Hidekazu; Osada, Takeshi; Akimoto, Kengo; Yamazaki, Shunpei, Semiconductor device.
  119. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device.
  120. Zhang, Hongyong, Semiconductor device and electronic device.
  121. Zhang,Hongyong, Semiconductor device and electronic device.
  122. Yamazaki, Shunpei, Semiconductor device and fabrication method thereof.
  123. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.
  124. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.
  125. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.
  126. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.
  127. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.
  128. Miyairi, Hidekazu; Osada, Takeshi; Akimoto, Kengo; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  129. Miyairi, Hidekazu; Osada, Takeshi; Akimoto, Kengo; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  130. Miyairi, Hidekazu; Osada, Takeshi; Akimoto, Kengo; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  131. Tsunoda,Akira; Yamazaki,Shunpei; Koyama,Jun, Semiconductor device and method for manufacturing the same.
  132. Tsunoda,Akira; Yamazaki,Shunpei; Koyama,Jun, Semiconductor device and method for manufacturing the same.
  133. Yamazaki, Shunpei; Akimoto, Kengo, Semiconductor device and method for manufacturing the semiconductor device.
  134. Yamazaki, Shunpei; Akimoto, Kengo, Semiconductor device and method for manufacturing the semiconductor device.
  135. Yamazaki, Shunpei; Akimoto, Kengo, Semiconductor device and method for manufacturing the semiconductor device.
  136. Isobe, Atsuo; Yamazaki, Shunpei; Kokubo, Chiho; Tanaka, Koichiro; Shimomura, Akihisa; Arao, Tatsuya; Miyairi, Hidekazu, Semiconductor device and method of manufacturing the same.
  137. Isobe, Atsuo; Yamazaki, Shunpei; Kokubo, Chiho; Tanaka, Koichiro; Shimomura, Akihisa; Arao, Tatsuya; Miyairi, Hidekazu; Akiba, Mai, Semiconductor device and method of manufacturing the same.
  138. Yamazaki, Shunpei; Sakata, Junichiro; Miyake, Hiroyuki; Kuwabara, Hideaki; Uochi, Hideki, Semiconductor device comprising a pixel portion and a driver circuit.
  139. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device comprising an oxide semiconductor layer.
  140. Zhang,Hongyong, Semiconductor device having a conductive layer with a light shielding part.
  141. Yamazaki, Shunpei; Isobe, Atsuo; Miyairi, Hidekazu; Suzawa, Hideomi, Semiconductor device having insulating stripe patterns.
  142. Kokubo, Chiho; Shiga, Aiko; Yamazaki, Shunpei; Miyairi, Hidekazu; Dairiki, Koji; Tanaka, Koichiro, Semiconductor device having multichannel transistor.
  143. Ponomarev, Youri V, Semiconductor device having strip-shaped channel and method for manufacturing such a device.
  144. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Semiconductor device including oxide semiconductor layer.
  145. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  146. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  147. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  148. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  149. Isobe, Atsuo; Godo, Hiromichi, Semiconductor element, method for manufacturing the semiconductor element, and semiconductor device including the semiconductor element.
  150. Isobe, Atsuo; Godo, Hiromichi, Semiconductor element, method for manufacturing the semiconductor element, and semiconductor device including the semiconductor element.
  151. Hirose, Atsushi, Shift register circuit.
  152. Hirose, Atsushi, Shift register circuit.
  153. Im, James S.; Van Der Wilt, Paul C., Single scan irradiation for crystallization of thin films.
  154. Im, James S., Single-shot semiconductor processing system and method having various irradiation patterns.
  155. Im, James S., Single-shot semiconductor processing system and method having various irradiation patterns.
  156. Hudait, Mantu K.; Shaheen, Mohamad A.; Chow, Loren A.; Tolchinsky, Peter G.; Fastenau, Joel M.; Loubychev, Dmitri; Liu, Amy W. K., Stacking fault and twin blocking barrier for integrating III-V on Si.
  157. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  158. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  159. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  160. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  161. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  162. Im, James S.; van der Wilt, Paul C., Systems and methods for creating crystallographic-orientation controlled poly-silicon films.
  163. Wang,Haihong; Ahmed,Shibly S.; Lin,Ming Ren; Yu,Bin, Systems and methods for forming multiple fin structures using metal-induced-crystallization.
  164. Im, James S.; Deng, Yikang; Hu, Qiongying; Chung, Ui-Jin; Limanov, Alexander B., Systems and methods for non-periodic pulse partial melt film processing.
  165. Im, James S.; Chung, Ui-Jin; Limanov, Alexander B.; Van Der Wilt, Paul C., Systems and methods for non-periodic pulse sequential lateral soldification.
  166. Im, James S.; Chung, Ui-Jin; Limanov, Alexander B.; Van Der Wilt, Paul C., Systems and methods for non-periodic pulse sequential lateral solidification.
  167. Im, James S., Systems and methods for preparation of epitaxially textured thick films.
  168. Im, James S., Systems and methods for preparation of epitaxially textured thick films.
  169. Im, James S., Systems and methods for preparing epitaxially textured polycrystalline films.
  170. Im, James S., Systems and methods for processing a film, and thin films.
  171. Im, James S., Systems and methods for the crystallization of thin films.
  172. Miyamoto Shoichi,JPX, Thin film transistor having a branched gate and channel.
  173. Miyairi, Hidekazu; Osada, Takeshi; Yamazaki, Shunpei, Thin film transistor with two gate electrodes.
  174. Chau, Robert S.; Doyle, Brian S.; Kavalieros, Jack; Barlage, Douglas; Datta, Suman, Tri-gate devices and methods of fabrication.
  175. Chau, Robert S.; Doyle, Brian S.; Kavalieros, Jack; Barlage, Douglas; Datta, Suman; Hareland, Scott A., Tri-gate devices and methods of fabrication.
  176. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman, Tri-gate devices and methods of fabrication.
  177. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman, Tri-gate devices and methods of fabrication.
  178. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman; Hareland,Scott A., Tri-gate devices and methods of fabrication.
  179. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  180. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  181. Chau,Robert; Datta,Suman; Doyle,Brian S; Jin,Been Yih, Tri-gate transistors and methods to fabricate same.
  182. Liao, Wen-Shiang; Shiau, Wei-Tsun, Triple gate device having strained-silicon channel.
  183. Im, James S.; Sposili, Robert S.; Crowder, Mark A., Uniform large-grained and gain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon.
  184. Im, James S.; Sposili, Robert S.; Crowder, Mark A., Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon.
  185. Im, James S.; Sposili, Robert S.; Crowder, Mark A., Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon.
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