$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Solder-bearing lead 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-004/02
  • H01R-009/09
출원번호 US-0927415 (1992-09-21)
국제출원번호 PCT/US91/02489 (1991-04-11)
§371/§102 date 19920921 (19920921)
국제공개번호 WO-9116736 (1991-10-31)
발명자 / 주소
  • Seidler Jack (Flushing NY)
출원인 / 주소
  • North American Specialties Corporation (Flushing NY 02)
인용정보 피인용 횟수 : 40  인용 특허 : 0

초록 ▼

A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mas

대표청구항 ▼

A lead for soldering to a conductive surface comprising: a elongated body including a first portion adapted to retain solder, a substantially flat terminal portion, and a middle portion disposed between said first portion and said terminal portion, said first portion including at least one solder ma

이 특허를 인용한 특허 (40) 인용/피인용 타임라인 분석

  1. Crane ; Jr. Stanford W. ; Larcomb Daniel ; Krishnapura Lakshminarasimha, Apparatus for and method of manufacturing a semiconductor die carrier.
    상세보기
  2. Crane, Jr., Stanford W.; Larcomb, Daniel; Krishnapura, Lakshminarasimha, Apparatus for and method of manufacturing a semiconductor die carrier.
    상세보기
  3. Hardin, Keith Bryan, Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component.
    상세보기
  4. Mongold, John A.; Koopman, Stephen P., Connector having improved contacts with fusible members.
    상세보기
  5. Mongold, John A.; Koopman, Stephen P., Connector having improved contacts with fusible members.
    상세보기
  6. Mongold,John A.; Koopman,Stephen P., Connector having improved contacts with fusible members.
    상세보기
  7. Mongold,John A.; Koopman,Stephen P., Connector having improved contacts with fusible members.
    상세보기
  8. Mongold,John A.; Koopman,Stephen P., Connector having improved contacts with fusible members.
    상세보기
  9. Mongold,John A.; Koopman,Stephen P., Connector having improved contacts with fusible members.
    상세보기
  10. Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board.
    상세보기
  11. Hardin, Keith Bryan, Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board.
    상세보기
  12. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Die press process for manufacturing a Z-directed component for a printed circuit board.
    상세보기
  13. Weber Dale A., Dual-beam ground contacts having a realignment twist for gang insertion into an insulator housing.
    상세보기
  14. Wang, Chien Chun; Wang, Wen Lun, Electric connector assembly.
    상세보기
  15. Ju, Ted, Electrical connector.
    상세보기
  16. Ma,Hao Yun, Electrical connector.
    상세보기
  17. Yeow Yew Thye ; Pham Cuong Van, Electrical connector for rigid circuit boards.
    상세보기
  18. Hoover, David; Mongold, John; Knowlden, Donald, Electrical contacts with solder members and methods of attaching solder members to electrical contacts.
    상세보기
  19. Hardin, Keith Bryan, Extrusion process for manufacturing a Z-directed component for a printed circuit board.
    상세보기
  20. Peloza, Kirk B.; Faje, Richard A.; Hodge, Ronald C.; Gould, Jon S., Method of attaching a solder element to contact and the contact assembly formed thereby.
    상세보기
  21. Crane ; Jr. Stanford W. ; Portuondo Maria M., Method of manufacturing a semiconductor chip carrier.
    상세보기
  22. Crane, Jr., Stanford W.; Portuondo, Maria M., Prefabricated semiconductor chip carrier.
    상세보기
  23. Crane, Jr., Stanford W.; Portuondo, Maria M., Prefabricated semiconductor chip carrier.
    상세보기
  24. Hardin, Keith Bryan; Hall, Paul Kevin; Kratzer, Zachary Charles Nathan; Zhang, Qing, Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material.
    상세보기
  25. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Screening process for manufacturing a Z-directed component for a printed circuit board.
    상세보기
  26. Mosley Joseph M. ; Portuondo Maria M., Semiconductor die carrier having a dielectric epoxy between adjacent leads.
    상세보기
  27. Seidler Jack (Flushing NY), Solder bearing lead and method of fabrication.
    상세보기
  28. Hall, Paul Kevin; Hardin, Keith Bryan; Kratzer, Zachary Charles Nathan; Zhang, Qing, Spin coat process for manufacturing a Z-directed component for a printed circuit board.
    상세보기
  29. Philip H. Chen, Surface mounted device with grooves on a termination lead.
    상세보기
  30. Chen Philip H., Surface mounted device with grooves on a termination lead and methods of assembly.
    상세보기
  31. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Oglesbee, Robert Aaron, Z-directed capacitor components for printed circuit boards.
    상세보기
  32. Hardin, Keith Bryan; Dressman, Richard Herman; Fessler, John Thomas; Hall, Paul Kevin; Naily, Brian Lee, Z-directed connector components for printed circuit boards.
    상세보기
  33. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed delay line components for printed circuit boards.
    상세보기
  34. Hardin, Keith Bryan; Hall, Paul Kevin; Oglesbee, Robert Aaron, Z-directed filter components for printed circuit boards.
    상세보기
  35. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed pass-through components for printed circuit boards.
    상세보기
  36. Hardin, Keith Bryan; Fessler, John Thomas; Hall, Paul Kevin; Nally, Brian Lee; Oglesbee, Robert Aaron, Z-directed pass-through components for printed circuit boards.
    상세보기
  37. Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for controlling transmission line impedance.
    상세보기
  38. Hardin, Keith Bryan, Z-directed printed circuit board components having conductive channels for reducing radiated emissions.
    상세보기
  39. Hardin, Keith Bryan, Z-directed printed circuit board components having different dielectric regions.
    상세보기
  40. Hardin, Keith Bryan, Z-directed variable value components for printed circuit boards.
    상세보기

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

관련 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로