$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Integrated building and conveying structure for manufacturing under ultraclean conditions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01L-001/04
  • F24F-007/007
출원번호 US-0121621 (1993-09-14)
발명자 / 주소
  • Scott Richard G. (Austin TX) Shackleton Craig R. (Austin TX) Ellis Raymond W. (Austin TX)
출원인 / 주소
  • Sematech, Inc. (Austin TX 02)
인용정보 피인용 횟수 : 76  인용 특허 : 0

초록

A building houses a semiconductor manufacturing facility, which is circular in shape and is of a multi-story structure. A silo is located at the center for use in storing and transferring wafers to clean rooms disposed radially around the silo at each floor. Human access is not permitted in the silo

대표청구항

A method of fabricating microelectronic devices on a material under an ultra-clean environment in which processing steps for processing said material are conducted in separate and isolated minienvironments, comprising the steps of: providing a manufacturing building having a central enclosure enclos

이 특허를 인용한 특허 (76)

  1. Lowrance, Robert B.; Miller, Michael; Somekh, Sass; Madigan, Conor F.; Vronsky, Eliyahu; Birang, Manoocher, Apparatus and method for control of print gap.
  2. Lowrance, Robert B.; Miller, Michael; Somekh, Sass; Madigan, Conor; Vronsky, Eliyahu; Birang, Manoocher, Apparatus and method for control of print gap.
  3. Lowrance, Robert B.; Miller, Michael; Somekh, Sass; Madigan, Conor; Vronsky, Eliyahu; Birang, Manoocher, Apparatus and method for control of print gap.
  4. Eidelman, Doron; Fisch, David; Noy, Amir; Gross, Avi, Apparatus and method for fabricating flat workpieces.
  5. Ko, Alexander Sou-Kang; Mauck, Justin; Vronsky, Eliyahu; Madigan, Conor F.; Rabinovich, Eugene; Harjee, Nahid; Buchner, Christopher; Lewis, Gregory, Apparatus and techniques for electronic device encapsulation.
  6. Ko, Alexander Sou-Kang; Mauck, Justin; Vronsky, Eliyahu; Madigan, Conor F.; Rabinovich, Eugene; Harjee, Nahid; Buchner, Christopher; Lewis, Gregory, Apparatus and techniques for electronic device encapsulation.
  7. Flitsch, Frederick A., Apparatus to support a cleanspace fabricator.
  8. Pannese, Patrick D., Applications of neural networks.
  9. Markle,Richard J., Automated integrated circuit device manufacturing facility using central control.
  10. Markle,Richard J.; Krishnaswamy,Chandrashekar, Automated integrated circuit device manufacturing facility using distributed control.
  11. van der Meulen, Peter, Batch wafer alignment.
  12. Garrett, Edward S.; Woodford, Richard D., Clean room food processing methods.
  13. Nakagawa, Toshiaki, Clean room for semiconductor device.
  14. Madigan, Conor F.; Ko, Alexander Sou-Kang; Vronsky, Eliyahu, Environmentally controlled coating systems.
  15. Lowrance, Robert; Vronsky, Eliyahu; Madigan, Conor; Ko, Alexander Sou-Kang, Face-down printing apparatus and method.
  16. Lowrance, Robert; Vronsky, Eliyahu; Madigan, Conor; Ko, Alexander Sou-Kang, Face-down printing apparatus and method.
  17. Lowrance, Robert; Vronsky, Eliyahu; Madigan, Conor; Ko, Alexander Sou-Kang, Face-down printing apparatus and method.
  18. Lowrance, Robert; Vronsky, Eliyahu; Madigan, Conor; Ko, Alexander Sou-Kang, Face-down printing apparatus and method.
  19. Scannon, Patrick J.; Bernard, Frank A.; Dadson, Jr., Alfred C.; Tenerowicz, Robert S., Flexible manufacturing system.
  20. Scannon, Patrick J.; Bernard, Frank; Dadson, Jr., Alfred C.; Tenerowicz, Robert S., Flexible manufacturing system.
  21. Ko, Alexander Sou-Kang; Mauck, Justin; Vronsky, Eliyahu; Madigan, Conor F.; Rabinovich, Eugene; Harjee, Nahid; Buchner, Christopher; Lewis, Gregory, Gas cushion apparatus and techniques for substrate coating.
  22. Mauck, Justin; Ko, Alexander Sou-Kang; Vronsky, Eliyahu; Alderson, Shandon, Gas enclosure assembly and system.
  23. Mauck, Justin; Ko, Alexander Sou-Kang; Vronsky, Eliyahu; Alderson, Shandon, Gas enclosure assembly and system.
  24. Mauck, Justin; Ko, Alexander Sou-Kang; Vronsky, Eliyahu; Alderson, Shandon, Gas enclosure assembly and system and related printing maintenance methods.
  25. Mauck, Justin; Ko, Alexander Sou-Kang; Vronsky, Eliyahu; Alderson, Shandon, Gas enclosure systems and methods utilizing an auxiliary enclosure.
  26. Heinemann, Bernhard, Installation for processing wafers.
  27. Danna,Mark; Hine,Roger G.; Bonom,Anthony C., Integrated system for tool front-end workpiece handling.
  28. Mauck, Justin; Ko, Alexander Sou-Kang; Vronsky, Eliyahu; Alderson, Shandon; Stepanov, Alexey, Low particle gas enclosure systems and methods.
  29. John D. McCrandall ; Tom McMunigal ; Richard E. Rupp, Jr., Material delivery system for clean room-like environments.
  30. McCrandall John D. ; McMunigal Tom ; Rupp ; Jr. Richard E., Material delivery system for clean room-like environments.
  31. McCrandall, John D.; McMunigal, Tom; Rupp, Jr., Richard E., Material delivery system for clean room-like environments.
  32. McMunigal, Tom E.; Finn, Michael A.; McCrandall, John D., Material delivery system for clean room-like environments.
  33. Flitsch, Frederick A., Method and apparatus for a cleanspace fabricator.
  34. Flitsch, Frederick A., Method and apparatus for a cleanspace fabricator.
  35. Flitsch, Frederick A., Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator.
  36. Flitsch, Frederick A., Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator.
  37. Flitsch,Frederick A., Method and apparatus for an elevator system for a multilevel cleanspace fabricator.
  38. Somekh, Sass; Vronsky, Eliyahu; Madigan, Conor, Method and apparatus for load-locked printing.
  39. Somekh, Sass; Vronsky, Eliyahu; Madigan, Conor, Method and apparatus for load-locked printing.
  40. Somekh, Sass; Vronsky, Eliyahu; Madigan, Conor F., Method and apparatus for load-locked printing.
  41. Flitsch, Frederick, Method and apparatus to support a cleanspace fabricator.
  42. Flitsch, Frederick A., Method and apparatus to support process tool modules in a cleanspace fabricator.
  43. Jornitz, Maik Wolfgang, Method for connecting modular mobile rooms.
  44. Flitsch, Frederick A., Method of forming a cleanspace fabricator.
  45. Randhir P. Thakur, Method of forming a semiconductor device.
  46. Thakur,Randhir P., Method of forming a semiconductor device.
  47. Sakauchi Kazuo (Vancouver WA) Hirano Yoshihiro (Vancouver WA) Uchikawa Akira (Vancouver WA), Method of operating a growing hall containing puller cells.
  48. Thakur, Randhir P., Method of providing an oxide.
  49. Flitsch, Frederick A., Methods and apparatus for vertically orienting substrate processing tools in a clean space.
  50. Flitsch, Frederick A., Methods and apparatus for vertically orienting substrate processing tools in a clean space.
  51. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  52. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  53. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  54. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  55. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  56. Pannese, Patrick D.; Kavathekar, Vinaya; van der Meulen, Peter, Methods and systems for controlling a semiconductor fabrication process.
  57. Leveen Lindsay, Microelectronic component fabrication facility, and process for making and using the facility.
  58. Petruccelli, Daniel G., Mini-modual manufacturing environmental.
  59. Holtz, R. Barry; Arledge, Troy; Maples, Philip B.; Shanahan, David M., Modular, self-contained, mobile clean room.
  60. Holtz, R. Barry; Arledge, Troy; Maples, Phillip B.; Shanahan, David M., Modular, self-contained, mobile clean room.
  61. Holtz, R. Barry; Arledge, Troy; Maples, Phillip B.; Shanahan, David M., Modular, self-contained, mobile clean room.
  62. Sung, Chien-Ming; Wang, Simon; Chen, Jia-Ren; Lo, Henry; Yu, Chen-Hua; Wang, Jean; Zuo, Kewei, Preventing contamination in integrated circuit manufacturing lines.
  63. Yamanaka, Tomoharu; Yamazaki, Yasuhiko; Kitano, Masayuki, Production method and a production system.
  64. Rebstock, Lutz, Removable compartments for workpiece stocker.
  65. Wu Beuan P. F.,TWX, Semiconductor device fabrication system.
  66. Ohta Nahomi,JPX, Semiconductor device manufacturing line.
  67. Ohta Nahomi,JPX, Semiconductor fabrication line with contamination preventing function.
  68. van der Meulen, Peter, Semiconductor manufacturing systems.
  69. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  70. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  71. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  72. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  73. van der Meulen, Peter, Stacked process modules for a semiconductor handling system.
  74. van der Meulen, Peter, Stacked process modules for a semiconductor handling system.
  75. Akio Konishi JP; Nobuyuki Takahashi JP, Substrate processing apparatus.
  76. Rebstock, Lutz, Workpiece stocker with circular configuration.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로