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[미국특허] Porous substrate and conductive ink filled vias for printed circuits 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-009/00
출원번호 US-0057972 (1993-05-06)
우선권정보 JP-0113527 (1992-05-06)
발명자 / 주소
  • Hatakeyama Akihito (Kadoma JPX) Sogo Hiroshi (Nishinomiya JPX) Kojima Tamao (Osaka JPX) Horio Yasuhiko (Osaka JPX) Tsukamoto Masahide (Nara JPX) Fukumura Yasushi (Kyoto JPX)
출원인 / 주소
  • Matsushita Electric Industrial Co., Ltd. (JPX 03)
인용정보 피인용 횟수 : 172  인용 특허 : 0

초록 ▼

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the

대표청구항 ▼

An organic substrate used for printed circuits, which comprises a porous raw material, electro-conductive paste filled in through-holes formed in said porous raw material, and metal foils applied onto opposite surfaces of said porous raw material, said metal foils adhered to the opposite surfaces of

이 특허를 인용한 특허 (172)

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  167. Iino Yuji,JPX ; Sasamori Riichi,JPX ; Hayashi Katsura,JPX ; Hori Masaaki,JPX ; Shikada Hidenori,JPX ; Harazono Masaaki,JPX, Wiring board.
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  168. Katori Naohiro,JPX ; Tomita Kiyoshi,JPX ; Nakakawaji Fujito,JPX ; Sekioka Yoichi,JPX ; Matsuo Syogo,JPX ; Uchimoto Koichi,JPX, Wiring board and method for manufacturing the same.
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  169. Kawashima, Toshiyuki; Tahara, Nobuharu; Ikeda, Kenichi, Wiring board and method of manufacturing the same.
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  170. Higashitani, Hideki, Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same.
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  171. Higashitani, Hideki, Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same.
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