[특허]High density integrated backplane assembly

High density integrated backplane assembly 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-005/02
출원번호	US-0076656 (1993-06-11)
발명자 / 주소	Rudy Jr. William J. (Annville PA) Shaffer Howard R. (Millersburg PA) Stahl Daniel E. (Hummelstown PA)
출원인 / 주소	The Whitaker Corporation (Wilmington DE 02)
인용정보	피인용 횟수 : 36 인용 특허 : 0

초록 ▼

A backplane assembly (200) for a compact card cage such as a junction box (10) having a forward wall section (202) and a rearward wall section (14) with interconnection circuitry (206) disposed therebetween. Struts (216) join forward and rearward wall sections and the backplane assembly is manipulatable as a unit. Interconnection circuitry (206) can be a laminar assembly of flexible circuit elements (230) with terminals (220) of daughter card-matable connectors (204) of the forward wall terminated to circuits thereof at a first connection region CR1 and terminals (212)of input/output connectors (208) terminated at a second connection region CR2. All circuits from second region CR2 can be directed to an integration region CRM part of first region CR1 and selected circuits can be directed to terminals of daughter card-matable connectors elsewhere in first region CR1 connected by a programmable integration member (130).

대표청구항 ▼

A backplane assembly for a card cage for a plurality of electrical interconnections of circuits of circuit cards with electrical conductors extending into the card cage at an input/output interface, the circuit cards being receivable into a card-receiving region of the card cage along pairs of card guides extending through the card-receiving region from a card-receiving opening of the card cage, the input/output interface including an array of electrical input/output connectors, the backplane assembly positioned between the card-receiving region and the input/output interface and comprising: a forward wall member dimensioned to traverse the rearward end of the card-receiving region within the card cage and including an array of card connectors mounted thereon to mate with corresponding connectors of a plurality of circuit cards, with said card connectors so positioned with respect to respective said pairs of card guides to mate with complementary connectors along leading ends of respective said circuit cards during card insertion; a rearward wall section at least supporting said array of input/output connectors thereon and joined to said forward wall section by a plurality of struts being affixable proximate peripheral edges of said forward and rearward wall sections and spacing them a selected distance apart; and interconnection circuitry disposed between said forward and rearward wall sections defining an array of circuits, with said interconnection circuitry affixed therebetween to define a subassembly manipulatable as a unit during card cage assembly, said card connectors each containing an array of first terminals extending from outer contact sections exposed to be mated with terminals of said connectors of said circuit cards to pin-shaped first inner contact sections connected with corresponding circuits of said interconnection circuitry at connection arrays of a first region, and said input/output connectors each containing an array of second terminals therein extending from outer contact sections exposed to be connected with external input/output conductors to pin-shaped second inner contact sections connected to respective circuits of said interconnection circuitry at connection arrays of a second region; said interconnection circuitry being defined by a plurality of flexible circuit elements adjacent one another, each said flexible circuit element including pin-receiving holes for all first inner contact sections in a first portion thereof and including pin-receiving holes for all second inner contact sections in a second portion thereof, with all said first and second inner contact sections extending through said pin-receiving holes of all said flexible circuit elements aligned therewith; each said flexible circuit element at least including selected circuits defined thereon extending from termini at selected pin-receiving holes of said first portion to termini at selected pin-receiving holes of said second portion, whereby selected said pin-shaped first and second inner contact sections extending through said selected pin-receiving holes are electrically connected to said selected circuits upon soldering, and others of said pin-shaped first and second inner contact sections remain isolated from said selected circuits, and whereby all said first and second inner contact sections are terminated to associated circuits on said flexible circuit members, whereby many said first terminals of said card connectors are electrically connected to corresponding second terminals of said input/output connectors by discrete circuits in a compact interconnection arrangement having high circuit density and with said first terminals and corresponding second terminals free of any need to be physically aligned with each other.

이 특허를 인용한 특허 (36)

Vanyek, Gary E., Adaptable configuration plug in a vehicle entertainment system.
상세보기
Hirschberg, Robert N.; Baerman, Roger A.; Bodle, John W.; Eddy, Brett A.; Overman, Rob, Apparatus and method for using a backshell.
상세보기
Ortet, Stephane, Avionic equipment item.
상세보기
Caron, Jean-Christophe; Rebeyrotte, Vincent, Backplane electronic circuit board of an electronic apparatus, in particular for an aircraft.
상세보기
Cech, Markus; Veit, Andreas; Winkler, Markus; Bell, Andreas; Baumgartner, Klaus, Backplane module.
상세보기
Cech, Markus; Veit, Andreas; Winkler, Markus; Bell, Andreas; Baumgartner, Klaus, Backplane module.
상세보기
Jeffrey Scott Layton, Cable management solution for rack mounted computing components.
상세보기
Shimada Shozo,JPX ; Nakama Noboru,JPX ; Takahashi Tsutomu,JPX ; Kadoya Hiroshi,JPX ; Hayama Junichi,JPX, Communication apparatus.
상세보기
Shimada Shozo,JPX ; Nakama Noboru,JPX ; Takahashi Tsutomu,JPX ; Kadoya Hiroshi,JPX ; Hayama Junichi,JPX, Communication apparatus for converting an unbalanced signal into a balanced signal.
상세보기
Claude Sarno FR; Henri Bouteille FR, Connecting device for an assembly of line replaceable modules for electronic wallets and rack equipped with same for receiving such an assembly.
상세보기
Whiteman, Jr., Robert Neil; Ritter, Christopher David, Connector assembly having a back shell.
상세보기
Finona Michael Santos, Connector contact mold-positioning.
상세보기
Tomasi, Marc; De Kergommeaux, Matthieu; Bertandeau, Laurent; Banis, Christian, Electrical devices module for an avionics bay.
상세보기
Wood Samuel F. (Los Altos Hills CA) Wakerly John F. (Mountain View CA), Expandable data processing chassis and method of assembly thereof.
상세보기
Yamamoto Yoshihisa,JPX ; Kojima Hiroshi,JPX, Flexible printed circuit harness.
상세보기
Caron, Jean-Christophe; Mairet, Philippe; Rebeyrotte, Vincent; Roujean, Olivier, Fluid-cooled electrical equipment, avionic rack to receive such equipment and aircraft equipped with such racks.
상세보기
Follingstad Michael J. ; Conroy James W. ; Adams Peter W., High density patching system.
상세보기
Follingstad, Michael J.; Conroy, James W.; Adams, Peter W., High density patching system.
상세보기
Michael J. Follingstad ; James W. Conroy ; Peter W. Adams, High density patching system.
상세보기
Geschke,Gregory S.; Gustafson,William C.; Roberts,Alan B., Input/output transition board system.
상세보기
Perret,Fran챌ois; Nemoz,G챕rard; Sabourin,Jo챘l; Cognard, legal representative,Fabien; Hugon, legal representative,Jeanine; Cognard, legal representative,Elodie; Cognard, deceased,Alain, Interconnecting module for the base of electronic equipment casing.
상세보기
William Rochowicz ; Declan Killarney ; Tom Gall ; Chris Van Houten ; Don Zito, Interconnection of circuit substrates on different planes in electronic module.
상세보기
Shander, Mark Stephen; Johnson, Robert Thomas, Methods and systems for incorporating translating backplanes to facilitate wire separation.
상세보기
Clidaras, Jimmy; Kitlas, Kenneth, Modular computer system mechanical interconnection.
상세보기
Clidaras,Jimmy; Kitlas,Kenneth, Modular computer system mechanical interconnection.
상세보기
Friedhof,James, Modular interconnect system and apparatus.
상세보기
Mueller, Torsten; Seitz, Birgit; Hausdorf, Reiner; Reckziegel, Rudolf, Modules for a measuring device and measuring device.
상세보기
Chen, Steven, Multinode high density computing apparatus.
상세보기
Carol A. Howard ; Ward E. Strang, Multiport assembly having a floating electrical circuit board within an enclosure assembly.
상세보기
McLeod, David; Wade, Rex D., Network bus coupler and system.
상세보기
Imbert,Nicolas; Chuc,Charles, Reconfigurable interconnection device for electrical bundles.
상세보기
Nelson,Shannon Mary; Paul,Richard Joseph; Hischke,Mark D., Rugged shock-resistant backplane for embedded systems.
상세보기
Sasaki Takinori,JPX, Surface mount contact assembly for printed circuit board.
상세보기
Woolsey,Terrill L.; Hobson,Norman W., System for efficiently channeling high frequency data signals through sheet metal containment.
상세보기
Safarli, Artoush; McCuen, Patrick Jay, VME P2 five row interface adapter assembly, system, and method.
상세보기
Timothy D. Elmore ; Allan Knox, II ; Daniel C. Masters ; Michael L. Stockwell ; Joseph R. Talbert, VXI backplane system improvements and methods.
상세보기

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

High density integrated backplane assembly 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (36)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

High density integrated backplane assembly 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (36)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트