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| 국가/구분 | United States(US) Patent 등록 |
|---|---|
| 국제특허분류(IPC7판) |
|
| 출원번호 | US-0087434 (1993-07-09) |
| 발명자 / 주소 |
|
| 출원인 / 주소 |
|
| 인용정보 | 피인용 횟수 : 739 인용 특허 : 0 |
Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate
Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
A method of fabricating an integrated circuit module substrate on a base, comprising the steps of: applying an insulative base sheet over said base, said base sheet comprising a polymer film having an adhesive coating situated on the side of the polymer film opposite said base; placing a plurality o
A method of fabricating an integrated circuit module substrate on a base, comprising the steps of: applying an insulative base sheet over said base, said base sheet comprising a polymer film having an adhesive coating situated on the side of the polymer film opposite said base; placing a plurality of chips having contact pads face down on said base sheet; positioning a mold form around said chips; adding substrate molding material within said mold form; hardening said substrate molding material; separating said base from said base sheet; forming a plurality of vias through said base sheet, some of said plurality of vias being aligned with predetermined ones of said contact pads; and providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said base sheet to form an integrated circuit module.
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