이 특허를 인용한 특허 (41)

1. Ishida Katsuaki,JPX, Carriage structure for disk device.

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2. Shingai Noboru,JPX ; Wada Tatsuo,JPX ; Aoshima Katsuro,JPX, Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module us.

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3. Noboru Shingai JP; Tatsuo Wada JP; Katsuro Aoshima JP, Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board.

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4. Shingai Noboru,JPX ; Wada Tatsuo,JPX ; Aoshima Katsuro,JPX, Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board.

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5. Akiha Yoshinobu,JPX ; Ushijima Hitoshi,JPX, End connecting portion of a planar circuit body, and method of making same.

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6. Hishinuma,Hiroyuki; Kurita,Hideyuki; Ito,Ryo; Nakamura,Masayuki, Flexible wiring boards.

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7. Chen Shu-Hui,TWX ; Chang Nai-Shung,TWX, Integrated circuit mounting board with bypass capacitors.

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8. Pace Benedict G., Inverted chip bonded module with high packaging efficiency.

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9. Pace Benedict G., Inverted chip bonded with high packaging efficiency.

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10. Inaba Masaichi,JPX, Manufacturing method for magnetic head junction board.

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11. Meyer Neal ; Davis Byron K., Method for assembling an ink-jet pen having a double-sided electrical interconnect flexible circuit.

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12. Enomoto, Ryo; Hiramatsu, Yasuji, Method for manufacturing single sided substrate.

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13. Sera Naoki,JPX ; Mitsuoka Hideki,JPX ; Sano Yoshiro,JPX ; Nasu Tetsutaro,JPX, Method for mounting an electronic component on a wiring substrate and an illuminating switch unit using this mounting me.

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14. Daroux Mark L. ; Reichert Robert ; Centa John A. ; Glover David A. ; Chiang Shiuh-Kao, Method of connecting batteries to electronic circuits.

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15. O'Connell, Ronald V.; Daroux, Mark L.; Thomas, Shawn E.; Xing, Xuekun, Method of connecting electric leads to battery tabs.

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16. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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17. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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18. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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19. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.

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20. Leedy Glenn Joseph, Method of forming a multi-chip module from a membrane circuit.

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21. Lin, Charles W. C.; Chen, Cheng-Chung, Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base.

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22. Lee, Chih-Cheng, Method of manufacturing a substrate structure.

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23. Fujimoto Masayuki,JPX ; Nakazawa Matsuo,JPX ; Takahashi Hiroshi,JPX ; Suzuki Kazutaka,JPX ; Isuzuku Koichiro,JPX, Method of manufacturing circuit module.

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24. Ohsawa Kenji,JPX ; Ito Makoto,JPX, Method of manufacturing lead frame.

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25. Tamm Wilhelm (Aidlingen DEX) Olbrich Walter (Magstadt DEX) Dippon Siegfrid (Gechingen DEX) Weitmann Michael (Holzgerlingen DEX) Lam Si-Ty (Pleasanton CA), Method of manufacturing printed circuit boards.

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26. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectonic packages and methods therefor.

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27. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.

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28. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.

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29. Haba,Belgacem; Beroz,Masud; Kang,Teck Gyu; Kubota,Yoichi; Krishnan,Sridhar; Riley, III,John B.; Mohammed,Ilyas, Microelectronic packages and methods therefor.

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30. Pace, Benedict G, Module with bumps for connection and support.

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31. Pace Benedict G., Package for electronic devices.

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32. Pace Benedict G, Package for power semiconductor chips.

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33. Galloway Terry R., Plating process for fine pitch die in wafer form.

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34. Galloway Terry R., Plating process for fine pitch die in wafer form.

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35. Hishinuma, Hiroyuki; Kurita, Hideyuki; Ito, Ryo; Nakamura, Masayuki, Process for manufacturing flexible wiring boards.

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36. Hishinuma, Hiroyuki; Kurita, Hideyuki; Ito, Ryo; Nakamura, Masayuki, Processes for manufacturing flexible wiring boards.

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37. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.

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38. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.

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39. Lin, Charles W. C.; Chen, Cheng Chung, Semiconductor chip assembly with bumped terminal, filler and insulative base.

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40. Chun Heung Sup,KRX, Semiconductor package and a method of manufacturing thereof.

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41. Inaba Masaichi,JPX, Suspension connection structure for a magnetic head.

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