$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Defect detection and defect removal apparatus of thin film electronic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/02
출원번호 US-0126209 (1993-09-24)
우선권정보 JP-0259552 (1992-09-29)
발명자 / 주소
  • Kawamura Tetsuya (Hirakata JPX) Sano Hiroshi (Hirakata JPX) Furuta Mamoru (Hirakata JPX) Yoshioka Tatsuo (Hirakata JPX) Miyata Yutaka (Ikoma JPX)
출원인 / 주소
  • Matsushita Electric Industrial Co., Ltd. (Kadoma JPX 03)
인용정보 피인용 횟수 : 48  인용 특허 : 0

초록 ▼

A laser beam is irradiated and scanned on a substrate of a liquid crystal display device of an active matrix type. Pairs of electrons and holes caused by the known internal photoelectric effect are produced by irradiation of the laser beam to electrical conductive thin films including silicon layere

대표청구항 ▼

A defect detection apparatus of a thin film electronic device comprising: laser beam generating means for generating a laser beam having a beam diameter which is smaller than a diameter of an object to be detected in the thin film electronic device, optical means for scanning said laser beam generat

이 특허를 인용한 특허 (48)

  1. Brunner,Matthias, Apparatus and method for contacting of test objects.
    상세보기
  2. Brunner,Matthias, Apparatus and method for contacting of test objects.
    상세보기
  3. Tandy, Patrick W., Apparatus and method for marking defective sections of laminate substrates.
    상세보기
  4. Yamada, Keizo, Contact hole standard test device.
    상세보기
  5. Yamada, Keizo, Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer.
    상세보기
  6. Yamada,Keizo, Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer.
    상세보기
  7. Yamada,Keizo, Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer.
    상세보기
  8. Yamada, Keizo, Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer.
    상세보기
  9. Egan, Todd J.; Budiarto, Edward W.; Miller, Robert O.; Ravid, Abraham; Hoerner, Bridger E.; Batz, Jr., Robert W.; Woodruff, Daniel J., Electroplating tool with feedback of metal thickness distribution and correction.
    상세보기
  10. Budiarto, Edward W.; Dzilno, Dmitry A.; Egan, Todd J.; Hudgens, Jeffrey C.; Merry, Nir, Fast and continuous eddy-current metrology of a conductive film.
    상세보기
  11. Yamada, Keizo; Itagaki, Yousuke; Ushiki, Takeo, Film thickness measuring apparatus and a method for measuring a thickness of a film.
    상세보기
  12. Yamada,Keizo; Itagaki,Yousuke; Ushiki,Takeo, Film thickness measuring apparatus and a method for measuring a thickness of a film.
    상세보기
  13. Wu Mingde Nevil, Functional OBIC analysis.
    상세보기
  14. Wu Mingde Nevil, Functional OBIC analysis.
    상세보기
  15. Patrick W. Tandy, Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same.
    상세보기
  16. Datta Saswati, Laser repair process for printed wiring boards.
    상세보기
  17. Datta Saswati, Laser repair process for printed wiring boards.
    상세보기
  18. Marty Michel,FRX ; Brun Alain,FRX, Localization of defects of a metallic layer of a semiconductor circuit.
    상세보기
  19. Marcuse, Arno G.; Most, Robert A.; North, Edward S., Method and apparatus for cleaning electronic test contacts.
    상세보기
  20. Prentice, Thomas C.; Crouch, Kenneth C., Method and apparatus for dispensing a viscous material on a substrate.
    상세보기
  21. Mizukami,Hirotaka, Method and apparatus for testing a wafer using a laser beam wavelength that does not generate photovoltage by excitation.
    상세보기
  22. Erickson, Brian D., Method for testing through-silicon vias at wafer sort using electron beam deflection.
    상세보기
  23. Schneider, Tod; Franklin, Sean; Venkataraman, Nithya; Davis, Donald, Method of simultaneous singulation and edge sealing of plastic displays.
    상세보기
  24. Yeh,Albert An Bon; Pabilonia,Regina Nora; Kressin,Robert William; Liu,Wei, Methods for designing and tuning one or more packaged integrated circuits.
    상세보기
  25. Johnston, Benjamin M.; Krishnaswami, Sriram; Nguyen, Hung T.; Brunner, Matthias; Liu, Yong, Mini-prober for TFT-LCD testing.
    상세보기
  26. Leong Tony P. (San Jose CA) North Edward S. (Los Altos CA) Herbst Richard L. (Palo Alto CA), Multi-wavelength laser system, probe station and laser cutter system using the same.
    상세보기
  27. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength laser system, probe station and laser cutter system using the same.
    상세보기
  28. Leong Tony P. (San Jose CA) North Edward S. (Los Altos CA) Herbst Richard Linsley (Palo Alto CA), Multi-wavelength variable attenuator and half wave plate.
    상세보기
  29. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength variable attenuator and half wave plate.
    상세보기
  30. Ravid, Abraham; Dzilno, Dmitry A.; Egan, Todd J.; Miller, Robert O., Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating.
    상세보기
  31. Marshall Gordon Jones, Photomultiplier tube reprocessing.
    상세보기
  32. Krishnaswami, Sriram; Brunner, Matthias; Beaton, William; Liu, Yong; Johnston, Benjamin M.; Nguyen, Hung T.; Ledl, Ludwig; Schmid, Ralf, Prober for electronic device testing on large area substrates.
    상세보기
  33. Yamada, Keizo; Itagaki, Yousuke; Ushiki, Takeo; Tsujide, Tohru, Production managing system of semiconductor device.
    상세보기
  34. Yamada,Keizo; Itagaki,Yousuke; Ushiki,Takeo; Tsujide,Tohru, Production managing system of semiconductor device.
    상세보기
  35. Yamada, Keizo, Semiconductor device test method and semiconductor device tester.
    상세보기
  36. Yamada, Keizo, Semiconductor device test method and semiconductor device tester.
    상세보기
  37. Yamada, Keizo, Semiconductor device test method and semiconductor device tester.
    상세보기
  38. Yamada,Keizo, Semiconductor device test method and semiconductor device tester.
    상세보기
  39. Yamada,Keizo, Semiconductor device test method and semiconductor device tester.
    상세보기
  40. Yamada, Keizo, Semiconductor device test method for comparing a first area with a second area.
    상세보기
  41. Yamada, Keizo; Itagaki, Yousuke; Ushiki, Takeo; Tsujide, Tohru, Semiconductor device tester.
    상세보기
  42. Yamada, Keizo; Itagaki, Yousuke; Ushiki, Takeo; Tsujide, Tohru, Semiconductor device tester.
    상세보기
  43. Yamada,Keizo; Itagaki,Yousuke; Ushiki,Takeo; Tsujide,Tohru, Semiconductor device tester.
    상세보기
  44. Ushiki, Takeo; Yamada, Keizo; Itagaki, Yohsuke; Tsujide, Tohru, Surface contamination analyzer for semiconductor wafers.
    상세보기
  45. Ushiki, Takeo; Yamada, Keizo; Itagaki, Yohsuke; Tsujide, Tohru, Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device.
    상세보기
  46. Ushiki, Takeo; Yamada, Keizo; Itagaki, Yohsuke; Tsujide, Tohru, Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device.
    상세보기
  47. Cox,Andrew, Testing an image display device.
    상세보기
  48. Field, John E., Use of localized temperature change in determining the location and character of defects in flat-panel displays.
    상세보기

관련 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로