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Electron cyclotron resonance plasma source and method of operation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05H-001/00
출원번호 US-0048744 (1993-04-16)
발명자 / 주소
  • Dandl Raphael A. (San Marcos CA)
출원인 / 주소
  • Applied Microwave Plasma Concepts, Inc. (San Marcos CA 02)
인용정보 피인용 횟수 : 87  인용 특허 : 0

초록

A method and apparatus are disclosed employing electron cyclotron resonant (ECR) heating to produce plasma for applications including but not limited to chemical vapor deposition and etching. A magnetic field is formed by magnets circumferentially arranged about a cylindrical and symmetrical chamber

대표청구항

A method of generating plasma by electron cyclotron resonant (ECR) heating to treat specimens by processes including surface treatment, comprising the steps of forming a cylindrical chamber, introducing a gaseous medium into the chamber and maintaining low gas pressure within the chamber, supporting

이 특허를 인용한 특허 (87)

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  36. Henley, Francois J.; Cheung, Nathan W., Gettering technique for wafers made using a controlled cleaving process.
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  40. Wong Alfred Y. ; Rosenthal Glenn B., Isotope separation using a high field source and improved collectors.
  41. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
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  43. Ensberg Earl S. ; Jahns Gary L., Method and apparatus for increasing channel plasma density in an MHD vacuum pump.
  44. Bailey, III,Andrew D., Method and apparatus for plasma forming inner magnetic bucket to control a volume of a plasma.
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  50. Delaunay, Marc; Semeria, Marie-Noëlle, Method and device for electronic cyclotronic resonance plasma deposit of carbon nanofibre layers in fabric form and resulting fabric layers.
  51. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
  52. Chan, Chung, Method for non mass selected ion implant profile control.
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  69. Takada Kunio,JPX ; Suzuki Nobumasa,JPX ; Miyakoshi Toshimori,JPX, Process for producing an optical recording medium having a protective layer formed using a plasma processing device.
  70. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
  71. Grimbergen, Michael N.; Qian, Xue-Yu, Reducing deposition of process residues on a surface in a chamber.
  72. Henley Francois J. ; Cheung Nathan W., Reusable substrate for thin film separation.
  73. Yamartino, John M.; Loewenhardt, Peter K.; Lubomirsky, Dmitry; Singh, Saravjeet, Shaping a plasma with a magnetic field to control etch rate uniformity.
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  75. Henley, Francois J.; Cheung, Nathan W., Silicon-on-silicon hybrid wafer assembly.
  76. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon wafer bonding process using a thin film blister-separation method.
  77. Dandl, Raphael A.; Quon, Bill H., Stand alone plasma vacuum pump.
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  85. Kudela, Jozef; Tanaka, Tsutomu; Sorensen, Carl A.; Anwar, Suhail; White, John M.; Shinde, Ranjit Indrajit; Cho, Seon-Mee; Truong, Douglas D., Transmission line RF applicator for plasma chamber.
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  87. Benveniste, Victor M.; Ye, John; DiVergilio, William F., Waveguide for microwave excitation of plasma in an ion beam guide.
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