이 특허를 인용한 특허 (53)

1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.

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2. Schreiber, Christopher; Dunn, Christopher, Additive disk drive suspension manufacturing using tie layers for vias and product thereof.

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3. Bergkessel Nicholas E. ; Bergstresser Tad ; Chiang Shiuh-Kao ; Prokop Mary K. ; Russell David B., Adhesiveless flexible laminate and process for making adhesiveless flexible laminate.

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4. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

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5. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

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6. Chen, LinLin, Apparatus and method for electrolytically depositing a metal on a workpiece.

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7. Chen LinLin, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

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8. Chen, Linlin, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

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9. Chen, Linlin; Taylor, Thomas, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

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10. Chen, Linlin; Taylor, Thomas, Apparatus and method for electrolytically depositing copper on a semiconductor workpiece.

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11. Chen, LinLin, Apparatus and method for electrolytically depositing copper on a workpiece.

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12. Peace, Steven L., Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids.

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13. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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14. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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15. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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16. Robert W. Batz, Jr. ; Scot Conrady ; Thomas L. Ritzdorf, Apparatus for high deposition rate solder electroplating on a microelectronic workpiece.

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17. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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18. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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19. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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20. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.

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21. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.

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22. Hiranaka,Kouichi; Nakagami,Ryuichi; Fukuoka,Mitsuhiro; Yamashita,Motohiro, Flexible printed circuit board and process for producing the same.

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23. Ding Peijun ; Tao Rong ; Chin Barry ; Carl Dan, IMP technology with heavy gas sputtering.

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24. Schreiber, Christopher; Dunn, Christopher Gene, Low impedance, high bandwidth disk drive suspension circuit.

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25. Mosely, Roderick Craig; Zhang, Hong; Chen, Fusen; Guo, Ted; Chen, Liang-Yuh, Low temperature integrated metallization process and apparatus.

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26. Chen, Linlin; Wilson, Gregory J.; McHugh, Paul R.; Weaver, Robert A.; Ritzdorf, Thomas L., Method for electrochemically depositing metal on a semiconductor workpiece.

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27. Chen Linlin, Method for electrolytically depositing copper on a semiconductor workpiece.

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28. Ritzdorf, Thomas L.; Graham, Lyndon W., Method for filling recessed micro-structures with metallization in the production of a microelectronic device.

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29. Ritzdorf,Thomas L.; Graham,Lyndon W., Method for filling recessed micro-structures with metallization in the production of a microelectronic device.

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30. Batz, Jr., Robert W.; Conrady, Scot; Ritzdorf, Thomas L., Method for high deposition rate solder electroplating on a microelectronic workpiece.

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31. Seryogin, Georgiy; Tetreault, Thomas G.; Golovato, Stephen N.; Chandrasekaran, Ramya, Method for increasing adhesion of copper to polymeric surfaces.

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32. Ding, Peijun; Chiang, Tony; Chin, Barry L., Method of sputtering copper to fill trenches and vias.

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33. Chen,LinLin; Graham,Lyndon W.; Ritzdorf,Thomas L.; Fulton,Dakin; Batz, Jr.,Robert W., Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density.

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34. Ritzdorf,Thomas L.; Eudy,Steve L.; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Aegerter,Brian; Dundas,Curt; Peace,Steven L., Methods and apparatus for processing microelectronic workpieces using metrology.

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35. Farnworth,Warren M.; Collins,Dale W.; McDonald,Steven M., Methods for creating electrophoretically insulated vias in semiconductive substrates.

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36. Farnworth,Warren M.; Collins,Dale W.; McDonald,Steven M., Methods for creating electrophoretically insulated vias in semiconductive substrates.

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37. Farnworth,Warren M.; Collins,Dale W.; McDonald,Steven M., Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures.

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38. Collins,Dale W., Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces.

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39. Burke Thomas F. ; Hoover Merwin F. ; Bradshaw John H., Multilayer metalized composite on polymer film product and process.

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40. Cooney ; III Edward C. ; Korejwa Josef W. ; Strippe David C., Process and apparatus for cold copper deposition to enhance copper plating fill.

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41. Hanson, Kyle M.; Eudy, Steve L.; Ritzdorf, Thomas L.; Wilson, Gregory J.; Woodruff, Daniel J.; Harris, Randy; Weber, Curtis A.; McGlenn, Tim; Anderson, Timothy A.; Bexten, Daniel P., Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces.

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42. Aegerter,Brian K.; Dundas,Curt T.; Ritzdorf,Tom L.; Curtis,Gary L.; Jolley,Michael; Peace,Steven L., Selective treatment of microelectric workpiece surfaces.

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43. Farnworth,Warren M.; Collins,Dale W.; McDonald,Steven M., Semiconductor assemblies having electrophoretically insulated vias.

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44. Farnworth,Warren M.; Collins,Dale W.; McDonald,Steven M., Semiconductor structures having electrophoretically insulated vias.

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45. Ding, Peijun; Chiang, Tony; Chin, Barry L., Sputtering method for filling holes with copper.

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46. Chen, Linlin; Graham, Lyndon W.; Ritzdorf, Thomas L.; Fulton, Dakin; Batz, Jr., Robert W., Submicron metallization using electrochemical deposition.

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47. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.

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48. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.

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49. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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50. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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51. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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52. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.

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53. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.

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