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Vacuum chuck 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01J-037/20
출원번호 US-0231785 (1994-04-25)
우선권정보 JP-0115741 (1990-05-07); JP-0094377 (1991-04-24)
발명자 / 주소
  • Sakamoto Eiji (Sagamihara JPX) Ebinuma Ryuichi (Machida JPX) Hara Shinichi (Yokohama JPX) Marumo Mitsuji (Sagamihara JPX)
출원인 / 주소
  • Canon Kabushiki Kaisha (Tokyo JPX 03)
인용정보 피인용 횟수 : 68  인용 특허 : 0

초록 ▼

A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a

대표청구항 ▼

A wafer holding device, comprising: a structural member defining a wafer attraction plane and having protrusions for supporting a wafer to be exposed; and elastic members provided in associated with said protrusions and being made of a material having an elasticity modulus smaller than that of the w

이 특허를 인용한 특허 (68)

  1. Otwell Robert, 3 point vacuum chuck with non-resilient support members.
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  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
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  18. Ottens,Joost Jeroen; Van Empel,Tjarko Adriaan Rudolf; Van Meer,Aschwin Lodewijk Hendricus Johannes; Miedema,Jan Rein; Zaal,Koen Jacobus Johannes Maria, Lithographic apparatus and device manufacturing method.
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  20. Zaal, Koen Jacobus Johannes Maria; Van Empel, Tjarko Adriaan Rudolf; Meijer, Hendricus Johannes Maria; Ottens, Joost Jeroen; Le Kluse, Marco; Hopman, Jan, Lithographic apparatus, device manufacturing method, and device manufactured thereby.
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  26. Busch,Ralph E.; McKeon,James C.; Cruz,Rodolfo, Method and apparatus for coupling ultrasound between an ultrasonic transducer and an object.
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  27. Busch, Ralph E.; Krausman, Dennis, Method and apparatus for ultrasonic scanning of a fabrication wafer.
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  28. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
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  29. Rai, Pradeep Kumar; Bock, Kim Lee; Wang, Li; Huang, JinXiang; Tai, EnYong; Wang, JianHua; Ong, King Hoo, Non-uniform vacuum profile die attach tip.
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  30. Yang, Yun-sik; Kim, Kyung-dae; Hong, Hyung-sik; Kim, Min-gyu, Pedestal of a load-cup which supports wafers loaded/unloaded onto/from a chemical mechanical polishing apparatus.
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  31. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
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  33. Iwata Seiya,JPX, Processing apparatus for manufacturing semiconductors.
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  34. Busch,Ralph E., Pulse echo ultrasonic test chamber for tray production system.
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  35. Rocha-Alvarez, Juan Carlos; Chen, Chen-An; Yieh, Ellie; Venkataraman, Shankar, Purge heater design and process development for the improvement of low k film properties.
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  36. Brugger, Michael; Lach, Otto; Hammer, Dietmar, Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin.
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  38. Bulich, Drago, Rotating vacuum assisted carousel for packaging cable.
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  39. Tokudome, Hiroyuki, Semiconductor element holding apparatus and semiconductor device manufactured using the same.
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  40. Tokudome,Hiroyuki, Semiconductor element holding apparatus and semiconductor device manufactured using the same.
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  43. Cerrina Franco (Madison WI) Wallace John P. (Oregon WI), Stress-free mount for imaging mask.
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  46. Tokita, Toshinobu, Substrate holding apparatus and exposure apparatus using the same.
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  49. Takabayashi Yukio,JPX ; Uzawa Shigeyuki,JPX, Substrate holding apparatus, substrate transfer system, exposure apparatus, coating apparatus, method for making a device, and method for cleaning a substrate holding section.
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  50. Chiba Yuji,JPX ; Mizusawa Nobutoshi,JPX ; Iwamoto Kazunori,JPX ; Tanaka Yutaka,JPX ; Hara Shinichi,JPX ; Marumo Mitsuji,JPX ; Matsui Shin,JPX ; Kurosawa Hiroshi,JPX, Substrate holding device and exposing apparatus using the same.
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  51. Chiba Yuji,JPX ; Mizusawa Nobutoshi,JPX ; Iwamoto Kazunori,JPX ; Tanaka Yutaka,JPX ; Hara Shinichi,JPX ; Marumo Mitsuji,JPX ; Matsui Shin,JPX ; Kurosawa Hiroshi,JPX, Substrate holding device and exposing apparatus using the same.
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  52. Takabayashi Yukio,JPX, Substrate holding system and exposure apparatus using the same.
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  53. Semyon Sherstinsky ; Arnold Kholodenko ; Calvin Augason ; Samuel Wilson ; Michael Phillips ; Leonel Zuniga, Substrate support member.
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  54. Semyon Sherstinsky ; Calvin Augason ; Leonel A. Zuniga ; Jun Zhao ; Talex Sajoto ; Leonid Selyutin ; Joseph Yudovsky ; Maitreyee Mahajani ; Steve G. Ghanayem ; Tai T. Ngo ; Arnold Kholodenk, Substrate support member for a processing chamber.
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  55. Moghadam,Alireza Shahdoost; Velidandla,Vamsi Mohan, System and method for optimizing wafer flatness at high rotational speeds.
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  60. Timothy A. Strodtbeck ; John S. Molebash ; Bruce L. Hayes ; Rex A. Smith ; Shawn D. Davis, Thermal conditioning apparatus.
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  61. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
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  62. McKeon, James C. P., Ultrasonic inspection using acoustic modeling.
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  63. Busch,Ralph E.; Fallon,Brandon D.; McKeon,James C., Ultrasonic test chamber for tray production system and the like.
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  64. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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  65. Takahashi, Tamami, Vacuum contact pad.
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  66. Takahashi, Tamami, Vacuum contact pad.
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  67. Yang, Hae Choon, Vacuum holder for integrated circuit units.
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  68. Parks,John, Wafer clamping apparatus and method for operating the same.
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