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Multi-chip cooling module and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/00
출원번호 US-0087950 (1993-07-06)
발명자 / 주소
  • Loo Mike C. (San Jose CA) Vogel Marlin R. (Fremont CA)
출원인 / 주소
  • Sun Microsystems, Inc. (Mountain View CA 02)
인용정보 피인용 횟수 : 77  인용 특허 : 0

초록 ▼

A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips.

대표청구항

A method of cooling a semiconductor chip, comprising the steps of: exposing a top surface and a bottom surface of a chip on a substrate; and circulating coolant over the exposed top surface and the bottom surface of the chip on the substrate.

이 특허를 인용한 특허 (77)

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