이 특허를 인용한 특허 (38)

1. Michael B. Ball, Apparatus and method of clamping semiconductor devices using sliding finger supports.

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2. Ball, Michael B., Apparatus for clamping semiconductor devices using sliding finger supports.

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3. Ball, Michael B., Apparatus of clamping semiconductor devices using sliding finger supports.

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4. Ball,Michael B., Apparatus of clamping semiconductor devices using sliding finger supports.

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5. Ball, Michael B.; Fogal, Rich, Bondhead lead clamp apparatus.

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6. Ball, Michael B.; Fogal, Rich, Bondhead lead clamp apparatus.

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7. Ball Michael B. ; Fogal Rich, Bondhead lead clamp apparatus and method.

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8. Ball Michael B. ; Fogal Rich, Bondhead lead clamp apparatus and method.

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9. Ball Michael B. ; Fogal Rich, Bondhead lead clamp apparatus and method.

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10. Ball, Michael B.; Fogal, Rich, Bondhead lead clamp apparatus and method.

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11. Ball, Michael B.; Fogal, Rich, Bondhead lead clamp apparatus and method.

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12. Michael B. Ball ; Rich Fogal, Bondhead lead clamp apparatus and method.

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13. Michael B. Ball ; Rich Fogal, Bondhead lead clamp apparatus and method.

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14. Ball Michael B. ; Fogal Rich, Device and method for clamping and wire-bonding the leads of a lead frame one set at a time.

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15. Ball Michael B. ; Fogal Rich, Device and method for clamping and wire-bonding the leads of a lead frame one set at a time.

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16. Ball, Michael B.; Fogal, Rich, Device and method for clamping and wire-bonding the leads of a lead frame one set at a time.

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17. Michael B. Ball ; Rich Fogal, Device and method for clamping and wire-bonding the leads of a lead frame one set at a time.

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18. Michael B. Ball ; Rich Fogal, Device and method for clamping and wire-bonding the leads of a lead frame one set at a time.

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19. Corisis, David J., Die paddle clamping for wire bond enhancement.

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20. Corisis David J., Die paddle clamping method for wire bond enhancement.

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21. Corisis David J., Die paddle clamping method for wire bond enhancement.

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22. Corisis David J., Die paddle clamping method for wire bond enhancement.

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23. Corisis, David J., Die paddle clamping method for wire bond enhancement.

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24. Corisis, David J., Die paddle clamping method for wire bond enhancement.

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25. Xu, Xuesong; Song, Meijiang; Yao, Jinzhong, Lead frame with solder flow control.

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26. Ball, Michael B.; Fogal, Rich, Method for clamping and wire-bonding the leads of a lead frame one set at a time.

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27. Michael B. Ball ; Rich Fogal, Methods for clamping and wire-bonding the leads of a lead frame one set at a time.

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28. Ball,Michael B., Methods for lead penetrating clamping system.

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29. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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30. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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31. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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32. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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33. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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34. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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35. Sven Evers ; Craig T. Clyne, Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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36. Sven Evers ; Craig T. Clyne, Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.

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37. Schroen,Walter H., Wafer level packaging.

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38. Walter H. Schroen, Wafer level packaging.

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