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Circuit card assembly with shielding assembly for reducing EMI emissions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-009/00
출원번호 US-0262375 (1994-06-20)
발명자 / 주소
  • Gleadall Wilfred L. (Leesburg VA)
출원인 / 주소
  • Hubbell Incorporated (Orange CT 02)
인용정보 피인용 횟수 : 40  인용 특허 : 0

초록

A circuit card assembly adapted to be coupled to a housing for reducing the amount of electromagnetic interference (EMI) escaping from the housing into the environment. The circuit card assembly includes a printed circuit board, an insulative faceplate coupled to the front edge of the printed circui

대표청구항

A circuit card assembly adapted to be coupled to a housing for reducing electromagnetic interference, the housing having a front opening and electroconductive means providing a grounded closed-loop electromagnetic wave energy path peripherally surrounding said front opening, said circuit card assemb

이 특허를 인용한 특허 (40)

  1. Meyer, Gregory S.; Conrad, Karl, Apparatus and method for enhancing conductivity.
  2. Centola, Bruno; Roman, Denis G.; Suzzoni, Jean-Pierre, Apparatus for positioning an electrical assembly within a housing.
  3. Johnson Robert W. ; Eddings ; II Richard L. ; Curlee James D. ; McAnally Andrew L., Apparatus for reducing electromagnetic emissions from a computer.
  4. Parrish,Frank B.; Behziz,Arash, Automatic testing equipment instrument card and probe cabling system and apparatus.
  5. Pang, Ron Cheng Chuan; Tan, Kee-Sin; Phang, Kah Yuan, Cam-follower release mechanism for fiber optic modules with side delatching mechanisms.
  6. Puri, Surrinder S.; Strong, Dennis; Krause, Marc E., Circuit board having an emission reducing ejector.
  7. Puri, Surrinder S.; Strong, Dennis; Krause, Marc E., Circuit board having an emission reducing ejector.
  8. Mills Richard Steven ; Holt George Thomas ; Herman Patricia, Computer system having surface mount PWB grounding clips.
  9. Barsun,Stephan K.; Dobbs,Robert W., Computer system with movable card guide.
  10. Schmitt Ty R., Computer system with peripheral device carrier.
  11. Neidich Douglas A., Controlled impedance connector block.
  12. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Teo, Tat Ming, De-latching lever actuator for fiber optic modules.
  13. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Ming, Tat T., De-latching mechanisms for fiber optic modules.
  14. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Ming, Tat T., De-latching mechanisms for fiber optic modules.
  15. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Ming, Tat T., De-latching mechanisms for fiber optic modules.
  16. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Teo, Tat Ming, De-latching mechanisms for fiber optic modules.
  17. Takehara, Takao, Device for shielding electronic circuit for aircraft.
  18. Ping King-Ho (Tainan TWX) Lee Jian-Hsing (Hsin-chu TWX), ESD bypass and EMI shielding trace design in burn-in board.
  19. Penketh, David Michael, Electrical circuits.
  20. Merlet, Etienne; Courteille, Jean-Marie; Besold, Jean-Eric, Electronic module, guide rail of such a module and circuit board intended to be slotted into such a module.
  21. Petitpierre Eric M. ; Durham James H., Faceplate for an electronic circuit card for reducing EMI emissions between circuit cards inserted in a circuit card housing.
  22. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Dair, Edwin, Fiber optic modules with de-latching mechanisms having a pull-action.
  23. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Dair, Edwin, Fiber optic modules with pull-action de-latching mechanisms.
  24. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with housing/shielding.
  25. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with shielded housing/covers having mixed finger types.
  26. Hensley, James D.; Cowles, David R.; Mallery, David L., Handle assembly for electrical connection with a grounding mechanism.
  27. Song,Soo Yong, Injector/ejector and shelf structure grounded to card frame ground.
  28. Chiu, Liew Chuang; Pang, Ron Cheng Chuan; Sim, Yong Peng; Dair, Edwin; Tan, Kee Sin, Method and apparatus for push button release fiber optic modules.
  29. Chuan, Ron Pang Cheng; Peng, Sim Yong, Method and apparatus of pull-lever release for fiber optic modules.
  30. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Methods and apparatus for fiber-optic modules with shielded housings/covers with fingers.
  31. Parrish, Frank B.; Brecht, Brian; Castellano, Derek, Modularized device interface with grounding insert between two strips.
  32. Gunther Hans-Ulrich,DEX ; Mazura Paul,DEX ; Haag Volker,DEX ; Pfeifer Klaus,DEX ; Thalau Klaus-Michael,DEX ; Joist Michael,DEX ; Weiss Udo,DEX, Module support structure.
  33. Chiu,Liew C.; Pang,Ron C.; Sim,Yong P.; Tan,Kee S.; Ming,Tat T., Modules having rotatable release and removal lever.
  34. Schmitt Ty R., Peripheral device mounting apparatus.
  35. Silva David J. ; Dorfmeyer Mitchell G., Printed circuit board having a dual pattern footprint for receiving one of two component packages.
  36. Dorfmeyer Mitchell G., Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equ.
  37. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Tan, Kee S.; Dair, Edwin, Pull-action de-latching mechanisms for fiber optic modules.
  38. Chiu, Liew C.; Pang, Ron C.; Sim, Yong P.; Teo, Tat M., Retention and release mechanisms for fiber optic modules.
  39. Chiu,Liew C.; Pang,Ron C.; Sim,Yong P.; Teo,Tat M., Retention and release mechanisms for fiber optic modules.
  40. Boone,Douglas, Split key in a press-fit connector.
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