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Heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0070088 (1993-05-28)
발명자 / 주소
  • Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA)
출원인 / 주소
  • Lytron Incorporated (Woburn MA 02)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록 ▼

A heat sink is provided having a bundle of thermally conductive fibers that extend from a heat receiving end to a heat dissipating end where they are splayed as extremely numerous fins of one or plural coalesced fibers to enlarge the effective heat convecting area. The splayed fins are supported or

대표청구항 ▼

A heat sink, comprising: a fiber bundle expanded in a cooling region into a plurality of separate fins of one or more fibers each; said fiber bundle including a plurality of thermally conductive fibers extending from a first fiber bundle end to a second expanded fiber bundle end forming said plurali

이 특허를 인용한 특허 (72)

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  33. Lemak, Richard J.; Rao, V. N. Padmanabha, Heat spreader and method of making the same.
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  43. Wong, Henry; Bertram, Thomas J., Method and apparatus for removing heat from a component.
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  45. Smalc, Martin D., Method for making finned heat sink assemblies.
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  52. Marumoto,Takeshi, Shielding box having a first wiring board and a second wiring board.
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  70. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
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  72. Herzl Alfred, Thermally conductive support structure.
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