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Fabrication of boron sputter targets 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-031/00
  • B23K-101/36
  • C23C-014/34
출원번호 US-0161605 (1993-12-06)
발명자 / 주소
  • Makowiecki Daniel M. (Livermore CA) McKernan Mark A. (Livermore CA)
출원인 / 주소
  • Regents Of The University Of California (Oakland CA 02)
인용정보 피인용 횟수 : 23  인용 특허 : 0

초록

A process for fabricating high density boron sputtering targets with sufficient mechanical strength to function reliably at typical magnetron sputtering power densities and at normal process parameters. The process involves the fabrication of a high density boron monolithe by hot isostatically compa

대표청구항

A process for fabricating high density boron sputtering targets, comprising: providing a boron monolith; and reinforcing the boron monolith by providing aluminum metallization on one side of the boron monolith. A process for fabricating high density boron sputtering targets comprising: providing a b

이 특허를 인용한 특허 (23)

  1. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  3. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  4. Smathers, David B.; Heimanson, Dorian; Gutkin, Michael, Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin.
  5. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials.
  6. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same.
  7. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  8. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Low temperature method for hermetically joining non-diffusing ceramic materials.
  9. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veyster, Alexander, Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing.
  10. Stellrecht David E., Method for producing near net shape planar sputtering targets and an intermediate therefor.
  11. Elliot, Brent; Balma, Frank; Veytser, Alexander; Parker, Michael; Cunha, Jeff, Method for repairing heaters and chucks used in semiconductor processing.
  12. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  13. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  14. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  15. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  16. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  17. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  18. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  19. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  20. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Multi-layer plate device.
  21. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  22. Heimart von Zweck, Sputter ion source for boron and other targets.
  23. McLeod, Paul Stephen, Target fabrication method for cylindrical cathodes.
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