$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Process for fabricating submicron single crystal electromechanical structures 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B44C-001/22
출원번호 US-0171965 (1993-12-22)
발명자 / 주소
  • MacDonald Noel C. (Ithaca NY) Zhang Zhoying L. (Ithaca NY) Porkolab Gyorgy A. (Ithaca NY)
출원인 / 주소
  • Cornell Research Foundation, Inc. (Ithaca NY 02)
인용정보 피인용 횟수 : 67  인용 특허 : 0

초록

A process for fabricating submicron movable mechanical structures utilizes chemically assisted ion beam etching and reactive ion etching which are independent of crystal orientation. The process provides released mechanical structures which may be of the same material or of different materials than

대표청구항

A process for fabricating, from a single crystal substrate, a high aspect ratio, released, single-crystal microstructure having any arbitrary structural orientation with respect to the substrate, comprising: providing a substrate of single-crystal material from which a microstructure is to be fabric

이 특허를 인용한 특허 (67)

  1. Adams, Scott G.; Davis, Tim, Boundary isolation for microelectromechanical devices.
  2. Eldridge, Benjamin N.; Dozier, II, Thomas H.; Khandros, Igor Y.; Mathieu, Gaetan L.; Smith, William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  3. Eldridge,Benjamin N.; Dozier, II,Thomas H.; Khandros,Igor Y.; Mathieu,Gaetan L.; Smith,William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  4. Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Dozier, Thomas H.; Smith, William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  5. Khandros,Igor Y.; Eldridge,Benjamin N.; Mathieu,Gaetan L.; Dozier, II,Thomas H.; Smith,William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  6. Naeher Ulrich (Munich DEX) Bertagnolli Emmerich (Munich DEX), Corrosion protection for micromechanical metal layers.
  7. Adams,Scott; Davis,Tim; Miller,Scott; Shaw,Kevin; Chong,John Matthew; Lee,Seung (Chris) Bok, Electrostatic actuator for microelectromechanical systems and methods of fabrication.
  8. Adams,Scott; Davis,Tim; Miller,Scott; Shaw,Kevin; Chong,John Matthew; Lee,Seung Bok (Chris), Electrostatic actuator for microelectromechanical systems and methods of fabrication.
  9. Adams, Scott; Davis, Tim; Miller, Scott; Shaw, Kevin; Chong, John Matthew; Lee, Seung Bok (Chris), Electrostatic actuator for micromechanical systems.
  10. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
  11. Kuo,Nai Hao; Yen,Kai Hsiang; Chiou,Jing Hung; Tsai,Po Hao; Lee,Yuh Wen, Fabrication method for microstructures with high aspect ratios.
  12. Dehe, Alfons; Sojka, Damian; Schmenn, Andre; Ahrens, Carsten, Field emission devices and methods of making thereof.
  13. Sridhar, Uppili; Nagarajan, Ranganathan; Miao, Yu Bo; Su, Yi, High aspect ratio trench isolation process for surface micromachined sensors and actuators.
  14. Bashir Rashid ; Kabir Abul, High sensitivity micro-machined pressure sensors and acoustic transducers.
  15. Davis, Timothy J.; Adams, Scott G., Integrated large area microstructures and micromechanical devices.
  16. Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.
  17. Zhang, Nan; Zhang, Hong; Nault, Gary, Latching apparatus for a MEMS optical switch.
  18. MacDonald Noel C. (Ithaca NY) Jazairy Ali (Ithaca NY), Masking process for fabricating ultra-high aspect ratio, wafer-free micro-opto-electromechanical structures.
  19. MacDonald, Noel C.; Aimi, Marco F., Metal MEMS devices and methods of making same.
  20. MacDonald,Noel C.; Aimi,Marco F., Metal MEMS devices and methods of making same.
  21. Barlocchi, Gabriele; Villa, Flavio, Method for forming horizontal buried channels or cavities in wafers of monocrystalline semiconductor material.
  22. Won, Jongik, Method for performing a deep trench etch for a planar lightwave circuit.
  23. Gary K. Fedder ; Xu Zhu, Method of fabricating micromachined structures and devices formed therefrom.
  24. Eslamy, Mohammad; Pedersen, David V.; Cobb, Harry D., Method of fabricating segmented contactor.
  25. Chong, John M.; Waldrop, Paul; Davis, Tim; Adams, Scott, Method of fabricating semiconductor wafers having multiple height subsurface layers.
  26. Bashir Rashid ; Kabir Abul, Method of making high sensitivity micro-machined pressure sensors and acoustic transducers.
  27. Eslamy, Mohammad; Pedersen, David V.; Cobb, Harry D., Method of repairing segmented contactor.
  28. Gordon M. Babson ; Anthony M. Palagonia, Micro probe and method of fabricating same.
  29. Bowers, John Edward; Helkey, Roger Jonathan; Corbalis, Charles; Sink, Robert Kehl; Lee, Seung Bok; MacDonald, Noel, Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same.
  30. Lee, Seung Bok; MacDonald, Noel, Micro-electro-mechanical-system (MEMS) mirror device having large angle out of plane motion using shaped combed finger actuators and method for fabricating the same.
  31. Sugino Rinji (Kawasaki JPX), Micro-machining minute hollow using native oxide membrane.
  32. Sugino Rinji,JPX, Micro-machining minute hollow using native oxide membrane.
  33. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Microelectromechanical accelerometer for automotive applications.
  34. Zhang Nan, Microelectromechanical optical switch and method of manufacture thereof.
  35. Zhang, Nan, Microelectromechanical optical switch and method of manufacture thereof.
  36. Blanchard, Richard A., Microelectromechanical systems (MEMS) device including a superlattice.
  37. Haronian Dan,ILX ; MacDonald Noel C., Microelectromechanics-based frequency signature sensor.
  38. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.
  39. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.
  40. Tu Jay Kuang-Jieh ; Ferrari Mauro, Microfabricated filter and capsule using a substrate sandwich.
  41. Chong John M. ; Adams Scott G. ; MacDonald Noel C. ; Shaw Kevin A., Microfabrication process for enclosed microstructures.
  42. Beerling, Timothy; Yin, Hongfeng, Micromachined titanium for high pressure microfluidic applications.
  43. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Micromechanical accelerometer for automotive applications.
  44. MacDonald Noel C. ; Shaw Kevin A. ; Adams Scott G., Micromechanical accelerometer for automotive applications.
  45. Reed Michael L. (Pittsburgh PA) Weiss Lee E. (Pittsburgh PA), Micromechanical barb and method for making the same.
  46. Gopal, Vidyut; Chinn, Jeffrey D., Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device.
  47. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructures and single mask, single-crystal process for fabrication thereof.
  48. Hofmann, Wolfgang M. J.; Neves, Hercules; MacDonald, Noel C.; Adams, Scott G., Multiple-level actuators and clamping devices.
  49. Kevin A. Shaw ; James S. Sutherland, Optoelectronic packaging.
  50. Kimberly L. Turner ; Noel C. MacDonald, Parametric resonance in microelectromechanical structures.
  51. Arturo A. Ayon, Plasma etch techniques for fabricating silicon structures from a substrate.
  52. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  53. Vigna Benedetto,ITX ; Ferrari Paolo,ITX ; Ferrera Marco,ITX ; Montanini Pietro,ITX, Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom.
  54. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
  55. Eslamy,Mohammad; Pedersen,David V.; Cobb,Harry D., Segmented contactor.
  56. Eslamy,Mohammad; Pedersen,David V.; Cobb,Harry D., Segmented contactor.
  57. Kikutani, Keisuke; Imamura, Tsubasa, Semiconductor device manufacturing method.
  58. Currie, Matthew T.; Lochtefeld, Anthony J., Shallow trench isolation process.
  59. Currie,Matthew T.; Lochtefeld,Anthony J., Shallow trench isolation process.
  60. Chong, John; Lee, Seung Bok; MacDonald, Noel; Lewis, Robert; Hunt, Peter, Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same.
  61. Petersen Kurt E. ; Maluf Nadim ; McCulley Wendell ; Logan John ; Klaasen Erno ; Noworolski Jan M., Single crystal silicon sensor with high aspect ratio and curvilinear structures.
  62. Petersen Kurt E. ; Maluf Nadim ; McCulley Wendell ; Logan John ; Klaasen Erno ; Noworolski Jan Mark, Single crystal silicon sensor with high aspect ratio and curvilinear structures.
  63. Ellis, Matthew D.; Parker, Eric G.; Skidmore, George D., System and method for constraining totally released microcomponents.
  64. Skidmore, George D., System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon.
  65. Hierold Christofer,DEX, Thermal sensor/actuator in semiconductor material.
  66. MacDonald Noel C. ; Huang Xiaojun Trent ; Chen Liang-Yuh, Trench-filling etch-masking microfabrication technique.
  67. Liu Yung Sheng,TWX ; Smith Lowell Scott, Ultrasound imaging system and method using a quantum well-device for enabling optical interconnections.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로