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Heat pipe type radiation for electronic apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0035376 (1993-03-22)
우선권정보 JP-0105382 (1992-03-31); JP-0054804 (1993-02-19)
발명자 / 주소
  • Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX)
출원인 / 주소
  • Furukawa Electric Co., Ltd. (JPX 03)
인용정보 피인용 횟수 : 97  인용 특허 : 0

초록

A heat pipe type radiator is formed with a cooling plate mounted on an evaporative section of a heat pipe and a flat heat conductive plate mounted on a condenser section. Heat-generating electronic components are brought into contact with the cooling plate and a radiation fin molded from a thin plat

대표청구항

A heat pipe type radiator for cooling an electronic apparatus comprising: a heat pipe, said heat pipe comprising: a flat evaporator pipe section, having a flattened outer circumferential surface, for adsorbing heat from electronic components of the electronic apparatus; a flat condenser pipe section

이 특허를 인용한 특허 (97)

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  33. Peng,Xue Wen; Chen,Rui Hua, Heat dissipation device.
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  83. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
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  87. Parish, Overton L.; DeVilbiss, Roger S., Stacked low profile cooling system and method for making same.
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  90. Watwe, Abhay; Prasher, Ravi, Thermal cooling apparatus.
  91. Thomas Daniel Lee, Thin planar heat spreader.
  92. Thomas Daniel Lee, Thin, planar heat spreader.
  93. Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.
  94. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
  95. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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