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A cooling package for a semiconductor chip includes, in addition to the chip, leads for the chip provided by a tape automated bonding frame, a cold header attached to the chip, a header frame, a pitch translator printed circuit board having conductive pads for receiving the chip leads and a pluralit

A cooling package for a semiconductor chip includes, in addition to the chip, leads for the chip provided by a tape automated bonding frame, a cold header attached to the chip, a header frame, a pitch translator printed circuit board having conductive pads for receiving the chip leads and a plurality of holes connected to the pads, a plurality of attachment devices such as hollow thin wall stainless steel pins positioned in the holes, and a cavity insulator. The method of chip package assembly requires the assembly of two sub-assemblies and the subsequent assembly of the two sub-assemblies into a chip package.

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A method for assembling a semiconductor chip in a cooling package, to provide a cooling path from the chip to a cooling source while reducing the thermal conductivity electrical connections from the chip to a circuit board on which it is mounted, comprising the following steps: (a) applying leads to

A method for assembling a semiconductor chip in a cooling package, to provide a cooling path from the chip to a cooling source while reducing the thermal conductivity electrical connections from the chip to a circuit board on which it is mounted, comprising the following steps: (a) applying leads to a chip; (b) attaching the chip to a header for cooling the chip; (c) attaching the chip and header to a header frame; (d) providing a pitch translator for translating the pitch of the chip leads to an array of holes in said pitch translator; (e) attaching circuit board attachment devices to the holes in the pitch translator; (f) attaching the leads of the chip to the pitch translator; (g) attaching the pitch translator to the header frame; and (h) attaching an insulator for insulating the header and the header frame to the assembled header frame and pitch translator.