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Microprocessor cooling in a portable computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
  • H05K-007/20
출원번호 US-0116331 (1993-09-02)
발명자 / 주소
  • Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070)
인용정보 피인용 횟수 : 54  인용 특허 : 0

초록

A CPU IC package for a computer system is cooled by a layer of compressible, heat-conducting material compressed between the IC package and a heat sink plate. In one embodiment the heat sink plate is a wall element of an access panel providing access to the interior of the computer system. Closing t

대표청구항

A method for cooling a heat-producing IC package assembly to be mounted within a housing of a portable computer, such as a laptop or notebook computer, comprising steps of: mounting said IC package assembly within said housing with the package assembly positioned adjacent to a wall of said housing;

이 특허를 인용한 특허 (54)

  1. Bhatia Rakesh, Airflow heat exchanger for a portable computing device and docking station.
  2. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
  3. Robert L. McMahan ; Damon W. Broder, Apparatus and method for cooling a heat generating component in a computer.
  4. Hironori Tanaka JP, Apparatus and system for cooling a portable device.
  5. Brotherton Daniel ; Shipley Fred J. ; Haider Syed, CPU heat sink.
  6. Sagal, E. Mikhail, Capacitor post with improved thermal conductivity.
  7. Nelik Jacob, Computer component cooling assembly.
  8. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  9. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  10. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  11. Cheng Ted,TWX, Data processing apparatus having a liquid heat-dissipating system.
  12. Sagal, E. Mikhail; Panek, Jeffrey; McCullough, Kevin A., Elastomeric heat sink with a pressure sensitive adhesive backing.
  13. May Gregory J ; Sterner John R, Electronic device having external surface thermal feedback.
  14. Stolz Howard W. ; Osborn Jay K. ; Hruska Daniel B., Enclosure mounted heat sink.
  15. Doherty, John; Collins, Mike; Dunn, Lorenzo, Ergonomic solvent resistant portable computer.
  16. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
  17. McCullough, Kevin A.; Sagal, E. Mikhail; Miller, James D., Flexible glove-like heat sink.
  18. McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.; Liu, Yaoqi J., Flexible heat sink.
  19. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J., Flexible heat sink.
  20. Ali Ihab A. ; Hermerding James ; Bhatia Rakesh, Heat dissipation apparatus and method.
  21. Jeffries John ; Wang Ray, Heat dissipator with multiple thermal cooling paths.
  22. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
  23. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
  24. Marwah Ramesh ; Zappacosta Elisa E., Heat sink for a portable personal computer.
  25. Miller, James D.; Sagal, E. Mikhail; McCullough, Kevin A., Highly thermally conductive electronic connector.
  26. McCullough, Kevin A.; Miller, James D.; Sagal, Mikhail, Injection moldable elastomeric gasket.
  27. Witchger William J., Integrated circuit package heat sink attachment.
  28. Bhatia, Rakesh; DiStefano, Eric, Low thermal resistance interface for attachment of thermal materials to a processor die.
  29. Bhatia, Rakesh; DiStefano, Eric, Low thermal resistance interface for attachment of thermal materials to a processor die.
  30. Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Wong Tin-Lup, Method and system in a data processing system for efficiently cooling a portable computer system.
  31. Warren James David ; Vogt Carl Randall ; Klooz Charles David, Method for dissipating heat from an integrated circuit.
  32. McCullough,Kevin A., Method of applying phase change thermal interface materials.
  33. Sagal, E. Mikhail, Method of making a capacitor post with improved thermal conductivity.
  34. McCullough, Kevin A., Method of manufacturing a structural frame.
  35. Foster, Jon S., Method of manufacturing athermally conductive drive belt.
  36. Miller,James D.; Sagal,E. Mikhail; McCullough,Kevin A., Molded electronic connector formed from a thermally conductive polymer composition and method of making the same.
  37. Lee Sung-Bae,KRX, Mounting structure of a semiconductor device module for a computer system.
  38. Doherty, John; Collins, Mike, Multi-purpose portable computer with integrated devices.
  39. Sagal, E. Mikhail, Overmolded LED light assembly and method of manufacture.
  40. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  41. Liu, Louis; Chang, Grace, Pointing device having computer host.
  42. Song Kwang-Ho,KRX, Portable computer having a heat-emitting device mountable on a CPU for emitting heat generated from the CPU via air ven.
  43. Doherty, John; Collins, Mike; Steigerwald, Todd; Bagwell, Phillip, Portable computer with thermal control and power source shield.
  44. Yu, Chia-Hsing; Wu, Ming-Chih, Portable electronic device with exposed heat dissipating mechanism.
  45. Kambayashi, Ko; Hidesawa, Shigeru, Portable-type information apparatus.
  46. Kambayashi, Ko; Hidesawa, Shigeru, Portable-type information apparatus.
  47. Kambayashi, Ko; Hidesawa, Shigeru, Portable-type information apparatus.
  48. Bhatia Rakesh, Power cable heat exchanger for a computing device.
  49. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  50. Shogan, Gregory; Dunham, John Maynard, Thermal control through a channel structure.
  51. Foster, Jon S., Thermally conductive drive belt.
  52. Sagal, E. Mikhail, Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit.
  53. Kevin A. McCullough ; E. Mikhail Sagal ; James D. Miller, Thermally conductive electronic device case.
  54. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
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