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[미국특허] Resin composition for optical molding 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-002/46
출원번호 US-0270058 (1994-07-01)
우선권정보 JP-0037034 (1988-02-19); JP-0176337 (1988-07-15); JP-0234496 (1988-09-19); JP-0234497 (1988-09-19)
발명자 / 주소
  • Ohkawa Kazuo (Tokyo JPX) Saito Seiichi (Tokyo JPX)
출원인 / 주소
  • Asahi Denka Kogyo K.K. (Tokyo JPX 03)
인용정보 피인용 횟수 : 30  인용 특허 : 0

초록

The present invention relates to a resin composition for optical molding which comprises (a) an actinic radical-curable and cationically polymerizable organic substance and (b) an actinic radiation-sensitive initiator for cationic polymerization. This composition can be cured without being affected

대표청구항

A resin composition for optical molding which comprises 50-90 parts by weight of (a) an actinic radiation-curable and cationically polymerizable organic substance containing at least 40% by weight of an epoxy resin having at least two epoxy groups in its molecule and at least 30% by weight of a viny

이 특허를 인용한 특허 (30) 인용/피인용 타임라인 분석

  1. Jallouli,Aref, Curable adhesive composition and its use in the optical field.
  2. Bakir,Muhannad S.; Martin,Kevin P.; Meindl,James D., Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof.
  3. Bakir,Muhannad S.; Meindl,James D., Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof.
  4. Bakir,Muhannad S.; Meindl,James D.; Patel,Chirag S., Devices having compliant wafer-level packages with pillars and methods of fabrication.
  5. Hall, Neal Allen; Degertekin, Fahrettin Levent, Displacement-measuring optical device with orifice.
  6. Bakir,Muhannad S.; Martin,Kevin P.; Meindl,James D., Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof.
  7. Akutsu Mitsuo,JPX ; Nakayashiki Tetsuyuki,JPX ; Tachikawa Hiroyuki,JPX ; Ohkawa Kazuo,JPX ; Chikaoka Satoyuki,JPX, Energy beam curable epoxy resin composition.
  8. Akutsu Mitsuo,JPX ; Nakayashiki Tetsuyuki,JPX ; Tachikawa Hiroyuki,JPX ; Ohkawa Kazuo,JPX ; Chikaoka Satoyuki,JPX, Energy beam curable epoxy resin composition, stereolithographic resin composition and stereolithographic method.
  9. Sitzmann Eugene V. ; Anderson Russell F. ; Koljack Mathias P. ; Cruz Julietta G. ; Srivastava Chandra M., High temperature performance polymers for stereolithography.
  10. Degertekin,Fahrettin Levent; Hall,Neal Allen; Lee,Wook, Highly-sensitive displacement-measuring optical device.
  11. Pang Thomas H. ; Melisaris Anastasios P. ; Renyi Wang ; Fong John W., Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures.
  12. Thomas H. Pang ; Anastasios P. Melisaris ; Wang Renyi ; John W. Fong, Liquid, radiation-curable composition, especially for producing cured articles by stereolithography having heat deflection temperatures.
  13. Anastasios P. Melisaris ; Wang Renyi ; Thomas H Pang, Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography.
  14. Melisaris Anastasios P. ; Renyi Wang ; Pang Thomas H, Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography.
  15. Rundlett, Beth, Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing.
  16. Priedeman, Jr., William R., Material and method for three-dimensional modeling.
  17. Priedeman, Jr.,William R., Method for three-dimensional modeling.
  18. Bakir,Muhannad S.; Meindl,James D., Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof.
  19. DeVoe, Robert J.; Leatherdale, Catherine A.; Florczak, Jeffrey M.; Fleming, Patrick R.; Potts, John E., Multiphoton curing to provide encapsulated optical elements.
  20. Levy Alvin C., Optical fiber containing a radiation curable primary coating composition.
  21. Gaylord,Thomas K.; Bachim,Brent L., Optical interconnects in microelectronics based on azimuthally asymmetric long-period fiber grating couplers.
  22. Watanabe Tsuyoshi,JPX ; Yamamura Tetsuya,JPX ; Takeuchi Akira,JPX ; Ukachi Takashi,JPX, Photo-curable resin composition.
  23. Xu, Jigeng, Photo-curable resin composition.
  24. Yamamura Tetsuya,JPX ; Watanabe Tsuyoshi,JPX ; Takeuchi Akira,JPX ; Ukachi Takashi,JPX, Photo-curable resin composition.
  25. Yamamura, Tetsuya; Watanabe, Tsuyoshi; Takeuchi, Akira; Ukachi, Takashi, Photo-curable resin composition used for photo-fabrication of three-dimensional object.
  26. Lapin Stephen C. ; Sullivan Michael G., Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects.
  27. Smith, Robert A.; Okoroafor, Michael O.; Graham, Marvin J., Polyfunctional thiirane compounds.
  28. Levy Alvin C., Radiation curable primary coating composition for an optical fiber.
  29. Haruta Yuichi,JPX ; Takase Hideaki,JPX ; Watanabe Tsuyoshi,JPX ; Ukachi Takashi,JPX, Resin composition and fibrous material forming mold.
  30. Moussa, Khalil M.; Liu, Jiaching, Toughened stereolithographic resin compositions.

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