이 특허를 인용한 특허 (28)

1. Cloud, Eugene H.; Farrar, Paul A., Assemblies and packages including die-to-die connections.

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2. DeNatale, Jeffrey F.; Lin, Yu-Hua K.; Stupar, Philip A., Compliant micro-socket hybridization method.

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3. Colombo,Bruce A.; Feustel,Clay A.; Jennings,Mark R.; Jones,Sean L.; Lampert,Norman R.; Leone,Frank S.; McCormack,Francis G.; Sandels,Gregory A.; Subh,Naif T.; White,Ian A., Connector systems for dynamically updating information related to a network and methods for developing the connector systems.

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4. Chen, Xiaoyu; Gui, Hui; Zeng, Junhua; Zhang, HongWei, Connector, electronic device and illuminating device having the connector.

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5. Peng, Yihlih; Pinyan, James A., Coupling a light sensor array with an optical component.

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6. Peng,Yihlih; Pinyan,James A., Coupling a light sensor array with an optical component.

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7. Cloud, Eugene H.; Farrar, Paul A., Die to die connection method and assemblies and packages including dice so connected.

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8. Cloud,Eugene H.; Farrar,Paul A., Die to die connection method and assemblies and packages including dice so connected.

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9. Farnworth Warren M. ; Wood Alan G., Die-to-insert permanent connection and method of forming.

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10. Warren M. Farnworth ; Alan G. Wood, Die-to-insert permanent connection and method of forming.

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11. Warren M. Farnworth ; Alan G. Wood, Die-to-insert permanent connection and method of forming.

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12. Grois, Igor; Kim, Byung; Marrapode, Thomas R.; Matasek, Jeffrey A., Fiber optic connector.

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13. Yang Jau-Yuann ; Yuan Han-Tzong, Flip-chip die attachment for a high temperature die to substrate bond.

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14. Rall David W. (Webster NY) Minerd Timothy M. (Pittsford NY), I/O interface device and connector module with dual locators.

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15. Magel Gregory Anton ; McDonald Terrance Gus ; Yang Jau-Yuann ; Yuan Han-Tzong, Integrated microchip chemical sensor.

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16. Vinod K. Bhardwaj ; Larry W. Haugen, Integrated socket with chip carrier.

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17. Theodore A. Khoury, Method and apparatus for edge connection between elements of an integrated circuit.

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18. Theodore A. Khoury, Method and apparatus for edge connection between elements of an integrated circuit.

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19. Freund, Joseph M.; Przybylek, George J.; Dautartas, Mindaugas F., Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom.

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20. Farnworth Warren M. (Nampa ID) Wood Alan G. (Boise ID), Method of forming a die-to-insert permanent connection.

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21. Johnson Dean A. ; Laubengayer William R. ; Richardson Stephen G., Multiple circuit board assembly having an interconnect mechanism that includes a flex connector.

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22. Case, Steven K.; Mowry, Gregory S.; Skunes, Timothy A., Optical device.

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23. Case,Steven K.; Skunes,Timothy A.; Knipfer,Michael; Mowry,Gregory S., Optical device with alignment compensation.

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24. Case,Steven K.; Mowry,Gregory S.; Skunes,Timothy A., Optical module.

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25. Stupar, Philip A.; Lin, Yu-Hua K.; Cooper, Donald E.; DeNatale, Jeffrey F.; Tennant, William E., Self-aligning hybridization method.

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26. Johnson Michael Gunnar, Spring clamp adapted for coupling with a circuit board.

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27. Wang, Liwei; Feng, Dazeng; Yin, Xiaoming; Coroy, Trenton Gary, Wafer level testing of optical components.

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28. Hsu, Shih-Hsiang; Feng, Dazeng; Kung, Cheng-Chih; Yin, Xiaoming; Coroy, Trenton Gary, Waveguide tap monitor.

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