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Method of incremental object fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-001/00
출원번호 US-0131205 (1993-10-01)
발명자 / 주소
  • Andr
  • Sr. Larry E. (812 Saddlebrook Dr. S. Bedford TX 76021)
인용정보 피인용 횟수 : 37  인용 특허 : 0

초록

An incremental object or part fabrication method includes the step of determining the dimensional boundaries of the part, the dimensional boundaries including x, y, and z dimensions. A reference surface is provided and a first incremental layer of mold material is formed on the reference surface. Th

대표청구항

A method of fabricating a three-dimensional object or part comprising the steps of: determining dimensional boundaries of the part within a computer CAD/CAM system, the dimensional boundaries including x, y, and z dimensions; providing a reference surface; a) forming a first incremental layer of mol

이 특허를 인용한 특허 (37)

  1. Schroeder,Ernest C., Apparatus and method of fabricating fiber reinforced plastic parts.
  2. Cohen, Adam L., Apparatus for electrochemical fabrication using a conformable mask.
  3. Hickerson,Kevin P.; Bedal,Bryan; Diephuis,Richard J., Apparatus for three dimensional printing using image layers.
  4. Watanabe Kotaro (Nagoya JPX), CAD device for metal mold.
  5. Parkos, Joseph; Hansen, James O.; Lomasney, Gary M.; Morin, Thomas M., Electroformed conforming rubstrip.
  6. Bredt, James F.; Anderson, Timothy; Russell, David B.; Clark, Sarah L.; DiCologero, Matthew J., Material systems and methods of three-dimensional printing.
  7. Adam L. Cohen, Method for electrochemical fabrication.
  8. Cohen, Adam L., Method for electrochemical fabrication.
  9. Cohen, Adam L., Method for electrochemical fabrication.
  10. Cohen, Adam L., Method for electrochemical fabrication.
  11. Cohen, Adam L., Method for electrochemical fabrication.
  12. Cohen,Adam L., Method for electrochemical fabrication.
  13. Cohen, Adam L., Method for electromechanical fabrication.
  14. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.
  15. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Method for fabricating miniature structures or devices such as RF and microwave components.
  16. Iverson Norma Jean, Method for manufacturing physical objects using precision stereolithography.
  17. Cohen, Adam L., Method of electrochemical fabrication.
  18. DuPree Donald G. (Alta Loma CA), Method of electroforming an abrasion shield.
  19. Andre ; Sr. Larry Edward, Method of incremental layered object fabrication.
  20. Bredt, James F.; Clark, Sarah L.; Uy, Evert F.; DiCologero, Matthew J.; Anderson, Timothy; Tarkanian, Michael; Williams, Derek X., Methods and compositions for three-dimensional printing of solid objects.
  21. Brown, Elliot R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.
  22. Brown, Elliott R.; Evans, John D.; Bang, Christopher A.; Cohen, Adam L.; Lockard, Michael S.; Smalley, Dennis R.; Grosser, Morton, Miniature RF and microwave components and methods for fabricating such components.
  23. Brown,Elliott R.; Evans,John D.; Bang,Christopher A.; Cohen,Adam L.; Lockard,Michael S.; Smalley,Dennis R.; Grosser,Morton, Miniature RF and microwave components and methods for fabricating such components.
  24. Cohen, Adam L., Multi-layer encapsulated structures.
  25. Wu, Ming Ting; Larsen, III, Rulon Joseph; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  26. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  27. Wu, Ming Ting; Larsen, III, Rulon J.; Kim, Young; Kim, Kieun; Cohen, Adam L.; Kumar, Ananda H.; Lockard, Michael S.; Smalley, Dennis R., Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties.
  28. Jang Justin, Process and apparatus for creating a colorful three-dimensional object.
  29. Bo Yang ; Ming C. Leu, Rapid production of engineering tools and hollow bodies by integration of electroforming and solid freeform fabrication.
  30. Sauerhoefer Marc Raymond, Strong, dimensionally stable object.
  31. Bredt, James F.; Clark, Sarah L.; Williams, Derek X.; DiCologero, Matthew J., Thermoplastic powder material system for appearance models from 3D printing systems.
  32. Wirth, David Morgan; Pain, David Forest; Herman, Jeffrey William, Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition.
  33. Bredt,James F.; Anderson,Timothy C.; Russell,David B., Three dimensional printing material system and method.
  34. Williams, Derek X., Three dimensional printing material system and method using peroxide cure.
  35. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  36. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.
  37. Alam, Amir; Bredt, James F.; Clark, Nanette; Flynn, Mary; Sprauer, Jean; Williams, Derek X., Three-dimensional printing material system with improved color, article performance, and ease of use.
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