[특허]Method of molding resin for sealing an electronic device

Method of molding resin for sealing an electronic device 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B29C-045/02 B29C-045/63 B29C-045/72
출원번호	US-0173150 (1993-12-21)
우선권정보	JP-0018352 (1991-01-17); JP-0155719 (1991-05-28); JP-0166501 (1991-06-10)
발명자 / 주소	Osada Michio (Kyoto JPX) Kawamoto Yoshihisa (Kyoto JPX)
출원인 / 주소	Towa Corporation (Uji JPX 03)
인용정보	피인용 횟수 : 36 인용 특허 : 0

초록 ▼

In a method for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

대표청구항 ▼

A method for sealing an electronic part by molding resin around said electronic part, in a mold having an upper mold section and a lower mold section to enclose a mold cavity, at least one resin melting pot, means for pressurizing a resin tablet in said resin melting pot, a resin flow path from said resin melting pot to said mold cavity, and a gas exhaust path from said resin melting pot through said mold cavity to an evacuation pump, comprising the following steps: (a) placing an unpreheated resin tablet having room temperature into said resin melting pot and placing said electronic part into said mold cavity, whereby preheating said resin tablet outside said pot is avoided, (b) preheating said resin tablet directly in said resin melting pot, (c) sealing said upper and lower mold sections relative to each other for excluding outside air from a sealed space including at least said resin melting pot, said mold cavity, and said resin flow path, (d) further heating said resin tablet in said resin melting pot for expanding said resin tablet to freely release air and moisture from said resin tablet in said resin melting pot while said outside air exclusion is maintained by said sealing step, (e) completely clamping closed said upper and lower mold sections to each other while maintaining said sealing step, (f) evacuating said sealed space while maintaining said exclusion of outside air, and (g) applying pressure to said resin tablet in said resin melting pot for forcing melted resin into said mold cavity around said electronic part while continuing said evacuating step at least partly during said pressure applying, whereby air and moisture are evacuated.

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Snow Mike, Method and apparatus for vacuum transfer molding.
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Koyama Hiroshi,JPX ; Onoue Tsutomu,JPX ; Asano Keigo,JPX ; Nakamura Tadatsugu,JPX ; Shoji Izuru,JPX, Method for forming a casting which includes an insert.
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Koyama Hiroshi,JPX ; Onoue Tsutomu,JPX ; Asano Keigo,JPX ; Nakamura Tadatsugu,JPX ; Shoji Izuru,JPX, Method for forming a casting which includes an insert.
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Yamada, Daiki; Kusumoto, Naoto, Method for manufacturing semiconductor device.
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Osada Michio,JPX ; Kawamoto Yoshihisa,JPX ; Matsuo Makoto,JPX ; Araki Koichi,JPX, Method of and apparatus for molding resin to seal electronic parts.
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Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
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Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
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Thompson, D. Scott; Leatherdale, Catherine A.; Boardman, Larry D.; Ouderkirk, Andrew J.; Kecman, Fedja, Method of making light emitting device having a molded encapsulant.
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Uragami,Hiroshi; Nakagawa,Osamu; Fujino,Kinya; Takase,Shinji; Tokuyama,Hideki; Meguro,Koichi; Nishino,Toru; Hayasaka,Noboru, Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material.
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Amano, Katsumi; Ueda, Kazutoshi, Method of resin sealing permanent magnets in laminated rotor core.
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Amano, Katsumi; Ueda, Kazutoshi, Method of resin sealing permanent magnets in laminated rotor core.
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Matsubayashi, Satoshi; Mabu, Hirotoshi; Amano, Katsumi; Shiraishi, Atsushi, Method of resin sealing permanent magnets in laminated rotor core.
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Matsubayashi, Satoshi; Mabu, Hirotoshi; Amano, Katsumi; Shiraishi, Atsushi, Method of resin sealing permanent magnets in laminated rotor core.
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Ogata, Kenji; Nishiguchi, Masashi; Imamura, Kenichiro, Mold apparatus for resin encapsulation and resin encapsulation method.
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McDougall Malcolm K., Molding overflow feedback method.
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Bolanos Mario A. ; Libres Jeremias L. ; Bednarz George A., Pre-packaged liquid molding for component encapsulation.
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Hiroshi Ise JP, Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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Method of molding resin for sealing an electronic device 원문보기

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Method of molding resin for sealing an electronic device 원문보기

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