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Light erasable multichip module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-077/14
  • H01L-031/00
  • H01L-023/02
  • H01L-023/12
출원번호 US-0937017 (1992-08-31)
발명자 / 주소
  • Juskey Frank J. (Coral Springs FL) Suppelsa Anthony B. (Coral Springs FL) Dorinski Dale W. (Coral Springs FL)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 105  인용 특허 : 0

초록 ▼

A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire b

대표청구항 ▼

A multichip integrated circuit package, comprising: an insulating substrate having at least two die mounting portions and a conductive circuit pattern thereon, the conductive pattern electrically connected to solder pads on an opposite side of the substrate by means of conductive vias; a first integ

이 특허를 인용한 특허 (105)

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