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[미국특허] Controlled etching of oxides via gas phase reactions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/311
출원번호 US-0219961 (1994-03-30)
발명자 / 주소
  • Grant Robert W. (Allenstown PA) Ruzyllo Jerzy (State College PA) Torek Kevin (State College PA)
출원인 / 주소
  • Penn State Research Foundation (University Park PA 02)
인용정보 피인용 횟수 : 197  인용 특허 : 0

초록

Oxides are etched with a halide-containing species and a low molecular weight organic molecule having a high vapor pressure at standard conditions, where etching is performed at preset wafer temperature in an enclosed chamber at a pressure such that all species present in the chamber, including wate

대표청구항

A method of etching oxides on a surface of a substrate, said substrate being at a temperature, said method comprising etching with a gas phase mixture of a halide-containing species, an organic material having a higher vapor pressure than water at standard conditions of room temperature and pressure

이 특허를 인용한 특허 (197) 인용/피인용 타임라인 분석

  1. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.
  2. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.
  3. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.
  4. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.
  5. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum selective etch.
  6. Ouellet,Luc; Migneault,Ghislain; Li,Jun, Anhydrous HF release of process for MEMS devices.
  7. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.
  8. Patel,Satyadev R.; Schaadt,Gregory P.; MacDonald,Douglas B.; MacDonald,Niles K.; Shi,Hongqin, Apparatus and method for detecting an endpoint in a vapor phase etch.
  9. Patel, Satyadev R.; Schaadt, Gregory P.; MacDonald, Douglas B.; MacDonald, Niles K., Apparatus and method for flow of process gas in an ultra-clean environment.
  10. Fayfield Robert T. ; Schwab Brent, Apparatus for processing both sides of a microelectronic device precursor.
  11. Butterbaugh,Jeffery W.; Gray,David C.; Fayfield,Robert T.; Siefering,Kevin; Heitzinger,John; Hiatt,Fred C., Apparatus for surface conditioning.
  12. Patel, Satyadev R.; Doan, Jonathan C., Barrier layers for microelectromechanical systems.
  13. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
  14. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
  15. Lubomirsky, Dmitry, Chamber with flow-through source.
  16. Lubomirsky, Dmitry, Chamber with flow-through source.
  17. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
  18. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
  19. Willis, Stephen L., Chemical mechanical planarization of conductive material.
  20. Willis,Stephen L., Chemical mechanical planarization of conductive material.
  21. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
  22. Wen-Ben Chou ; Rajinder Dhindsa ; Ching-Hwa Chen, Clean chemistry low-k organic polymer etch.
  23. Wang, Xikun; Cui, Zhenjiang; Park, Soonam; Ingle, Nitin K., Cobalt-containing material removal.
  24. Lubomirsky, Dmitry; Kim, Sung Je, Conditioned semiconductor system parts.
  25. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
  26. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
  27. Hoinkis, Mark; Yan, Chun; Miyazoe, Hiroyuki; Joseph, Eric, Copper residue chamber clean.
  28. Zhu, Lina; Kang, Sean S.; Nemani, Srinivas D.; Kao, Chia-Ling, Delicate dry clean.
  29. Tahara, Shigeru; Nishimura, Eiichi; Tomita, Hiroshi; Ohiwa, Tokuhisa; Okuchi, Hisashi; Omura, Mitsuhiro, Deposit removal method.
  30. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
  31. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
  32. Fayfield Robert T. ; Heitxinger John M., Direct vapor delivery of enabling chemical for enhanced HF etch process performance.
  33. Fayfield Robert T. ; Heitzinger John M., Direct vapor delivery of enabling chemical for enhanced HF etch process performance.
  34. Purayath, Vinod R.; Wang, Anchuan; Ingle, Nitin K., Dopant etch selectivity control.
  35. Racanelli,Marco; Hu,Chun; Sherman,Phil N., Double-implant high performance varactor and method for manufacturing same.
  36. Zhang, Jingchun; Ingle, Nitin K.; Wang, Anchuan, Dry etch process.
  37. Nishimura, Eiichi; Shimizu, Yusuke, Dry etching method for silicon nitride film.
  38. Kim, Sang Hyuk; Yang, Dongqing; Lee, Young S.; Jung, Weon Young; Kim, Sang-jin; Hsu, Ching-Mei; Wang, Anchuan; Ingle, Nitin K., Dry-etch for selective oxidation removal.
  39. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
  40. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
  41. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.
  42. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.
  43. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
  44. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
  45. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Dual discharge modes operation for remote plasma.
  46. Gonzales David B. ; Bartlett Aaron T., Endpoint stabilization for polishing process.
  47. Gonzales, David B.; Bartlett, Aaron T., Endpoint stabilization for polishing process.
  48. Ingle, Nitin K.; Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Enhanced etching processes using remote plasma sources.
  49. Fayfield Robert T. ; Schwab Brent, Equipment for UV wafer heating and photochemistry.
  50. Fayfield, Robert T.; Schwab, Brent, Equipment for UV wafer heating and photochemistry.
  51. Chinn, Jeffrey D.; Soukane, Sofiane, Etch process for etching microstructures.
  52. Korolik, Mikhail; Ingle, Nitin K.; Zhang, Jingchun; Wang, Anchuan; Liu, Jie, Etch suppression with germanium.
  53. Shi,Hongqin; Schaadt,Gregory P.; Huibers,Andrew G.; Patel,Satyadev R., Etching method used in fabrications of microstructures.
  54. Kezuka,Takehiko; Suyama,Makoto; Itano,Mitsushi, Etching solution, etched article and method for etched article.
  55. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Even tungsten etch for high aspect ratio trenches.
  56. Purayath, Vinod R.; Ingle, Nitin K., Flash gate air gap.
  57. Pandit, Mandar; Wang, Xikun; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Fluorine-based hardmask removal.
  58. Park, Seung; Wang, Xikun; Liu, Jie; Wang, Anchuan; Kim, Sang-jin, Gas-phase tungsten etch.
  59. Kim, Sung Je; Kalita, Laksheswar; Pareek, Yogita; Kadam, Ankur; Goradia, Prerna Sonthalia; Thakur, Bipin; Lubomirsky, Dmitry, Generation of compact alumina passivation layers on aluminum plasma equipment components.
  60. Korolik, Mikhail; Ingle, Nitin; Kioussis, Dimitri, Germanium etching systems and methods.
  61. Cho, Tae; Kang, Sang Won; Yang, Dongqing; Lu, Raymond W.; Hillman, Peter; Celeste, Nicholas; Tan, Tien Fak; Park, Soonam; Lubomirsky, Dmitry, Grooved insulator to reduce leakage current.
  62. Han, Yong-Pil; Sawin, Herbert H., HF vapor phase wafer cleaning and oxide etching.
  63. Carter Lawrence E. ; Schwab Brent ; Fayfield Robert T., HF/IPA based process for removing undesired oxides form a substrate.
  64. Lee, Whonchee; Torek, Kevin J., High selectivity BPSG to TEOS etchant.
  65. Lee,Whonchee; Torek,Kevin J., High selectivity BPSG to TEOS etchant.
  66. Tran, Toan Q.; Malik, Sultan; Lubomirsky, Dmitry; Roy, Shambhu N.; Kobayashi, Satoru; Cho, Tae Seung; Park, Soonam; Venkataraman, Shankar, High temperature chuck for plasma processing systems.
  67. Chen, Zhijun; Li, Zihui; Ingle, Nitin K.; Wang, Anchuan; Venkataraman, Shankar, Highly selective doped oxide removal method.
  68. Chen, Xinglong; Lubomirsky, Dmitry; Venkataraman, Shankar, Insulated semiconductor faceplate designs.
  69. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
  70. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
  71. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Integrated oxide and nitride recess for better channel contact in 3D architectures.
  72. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.
  73. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
  74. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
  75. Lill, Thorsten; Berry, III, Ivan L.; Shen, Meihua; Schoepp, Alan M.; Hemker, David J., Isotropic atomic layer etch for silicon and germanium oxides.
  76. Berry, III, Ivan L.; Park, Pilyeon; Yaqoob, Faisal, Isotropic atomic layer etch for silicon oxides using no activation.
  77. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.
  78. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.
  79. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Metal air gap.
  80. Morgan Paul A. ; Torek Kevin, Method and apparatus for etch of a specific subarea of a semiconductor work object.
  81. Yael Nemirovsky IL; Sara Stolyarova IL; Benjamin Brosilow IL, Method and apparatus for removing native oxide layers from silicon wafers.
  82. Patel, Satyadev R.; Schaadt, Gregory P.; MacDonald, Douglas B.; Shi, Hongqin, Method for achieving improved selectivity in an etching process.
  83. Patel,Satyadev R.; Schaadt,Gregory P.; MacDonald,Douglas B.; Shi,Hongqin; Huibers,Andrew G.; Heureux,Peter, Method for vapor phase etching of silicon.
  84. Doi Hideyuki,JPX, Method of cleaning a surface of a compound semiconductor crystal of group II-VI elements of periodic table.
  85. Ko, Jungmin, Method of fin patterning.
  86. Chen, Guoqing; Pan, James, Method of forming hemisphere grained silicon on a template on a semiconductor work object.
  87. Torek,Kevin; Shea,Kevin; Graettinger,Thomas, Method of forming high aspect ratio structures.
  88. Torek Kevin J., Method of making an oxide structure having a finely calibrated thickness.
  89. Jeffery W. Butterbaugh ; Brent Schwab, Method of surface preparation.
  90. Shi, Hongqin; Schaadt, Gregory P., Methods and apparatus of etch process control in fabrications of microstructures.
  91. Li, Zihui; Kao, Chia-Ling; Wang, Anchuan; Ingle, Nitin K., Methods for anisotropic control of selective silicon removal.
  92. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of SiN films.
  93. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of metal and metal-oxide films.
  94. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.
  95. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of sin films.
  96. Doan, Jonathan C.; Patel, Satyadev R.; Huibers, Andrew G.; Reid, Jason S., Methods for forming and releasing microelectromechanical structures.
  97. Behlke, Mark Aaron; Huang, Lingyan; Laikhter, Andrei; Yong, Yawfui; Rose, Scott, Methods of detecting fluorescence with anthraquinone quencher dyes.
  98. Chen, Guoqing; Pan, James, Methods of forming hemispherical grained silicon on a template on a semiconductor work object.
  99. Chen, Guoqing; Pan, James, Methods of forming hemispherical grained silicon on a template on a semiconductor work object.
  100. Chen,Guoqing; Pan,James, Methods of forming hemispherical grained silicon on a template on a semiconductor work object.
  101. Hong, Sukwon; Hamana, Hiroshi; Liang, Jingmei, Methods of reducing substrate dislocation during gapfill processing.
  102. Ouellet, Luc; Wright, Patrick, Microchannels for BioMEMS devices.
  103. Doan,Jonathan; Patel,Satyadev, Microelectromechanical structure and a method for making the same.
  104. Patel,Satyadev R.; Huibers,Andrew G., Micromirror array device with a small pitch size.
  105. Huibers, Andrew; Patel, Satyadev, Micromirror array having reduced gap between adjacent micromirrors of the micromirror array.
  106. Huibers, Andrew; Patel, Satyadev, Micromirror array having reduced gap between adjacent micromirrors of the micromirror array.
  107. Huibers,Andrew; Patel,Satyadev, Micromirror array having reduced gap between adjacent micromirrors of the micromirror array.
  108. Patel, Satyadev R.; Huibers, Andrew G., Micromirror having reduced space between hinge and mirror plate of the micromirror.
  109. Patel, Satyadev R.; Huibers, Andrew G., Micromirror having reduced space between hinge and mirror plate of the micromirror.
  110. Patel,Satyadev R.; Huibers,Andrew G., Micromirror having reduced space between hinge and mirror plate of the micromirror.
  111. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
  112. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
  113. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.
  114. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
  115. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
  116. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.
  117. Kevin J. Torek, Oxide structure having a finely calibrated thickness.
  118. Lubomirsky, Dmitry, Oxygen compatible plasma source.
  119. Chen, Xinglong; Yang, Jang-Gyoo; Tam, Alexander; Tam, Elisha, Pedestal with multi-zone temperature control and multiple purge capabilities.
  120. Lubomirsky, Dmitry, Plasma processing system with direct outlet toroidal plasma source.
  121. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Plasma-free metal etch.
  122. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Polarity control for remote plasma.
  123. Choi, Tom; Ko, Jungmin; Kang, Sean, Poly directional etch by oxidation.
  124. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
  125. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
  126. Sumnitsch Franz,ATX ; Wagner Gerald,ATX, Process for wet etching of semiconductor wafers.
  127. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  128. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  129. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  130. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  131. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  132. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  133. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  134. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  135. Naik, Mehul; Ma, Paul F.; Nemani, Srinivas D., Protective via cap for improved interconnect performance.
  136. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry, Radial waveguide systems and methods for post-match control of microwaves.
  137. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  138. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  139. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  140. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
  141. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
  142. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Remotely-excited fluorine and water vapor etch.
  143. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
  144. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
  145. Patel, Satyadev R.; Doan, Jonathan C., Sacrificial layers for use in fabrications of microelectromechanical devices.
  146. Yang, Dongqing; Zhu, Lala; Wang, Fei; Ingle, Nitin K., Saving ion-damaged spacers.
  147. Chen, Zhijun; Huang, Jiayin; Wang, Anchuan; Ingle, Nitin, Selective SiN lateral recess.
  148. Wang, Xikun; Lei, Jianxin; Ingle, Nitin; Shaviv, Roey, Selective cobalt removal for bottom up gapfill.
  149. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
  150. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
  151. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
  152. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
  153. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
  154. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
  155. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
  156. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
  157. Citla, Bhargav; Ying, Chentsau; Nemani, Srinivas; Babayan, Viachslav; Stowell, Michael, Selective etch using material modification and RF pulsing.
  158. Wang, Xikun; Ingle, Nitin, Selective in situ cobalt residue removal.
  159. Hoinkis, Mark; Miyazoe, Hiroyuki; Joseph, Eric, Selective sputtering for pattern transfer.
  160. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and nitrogen.
  161. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and oxygen.
  162. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
  163. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
  164. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
  165. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
  166. Wang, Xikun; Ingle, Nitin, Selective tungsten removal.
  167. Pandit, Mandar B.; Wang, Anchuan; Ingle, Nitin K., Self-aligned process.
  168. Arnepalli, Ranga Rao; Goradia, Prerna Sonthalia; Visser, Robert Jan; Ingle, Nitin; Korolik, Mikhail; Biswas, Jayeeta; Lodha, Saurabh, Self-limiting atomic thermal etching systems and methods.
  169. Muraoka Kouichi,JPX ; Kunishima Iwao,JPX ; Nishino Hirotaka, Semiconductor device manufacturing method.
  170. Gilton, Terry L.; Li, Li, Semiconductor fabrication apparatus.
  171. Torek,Kevin; Shea,Kevin, Semiconductor fabrication that includes surface tension control.
  172. Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Semiconductor processing systems having multiple plasma configurations.
  173. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
  174. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
  175. Nguyen, Andrew; Ramaswamy, Kartik; Nemani, Srinivas; Howard, Bradley; Vishwanath, Yogananda Sarode, Semiconductor system assemblies and methods of operation.
  176. Ko, Jungmin; Choi, Tom; Ingle, Nitin; Kim, Kwang-Soo; Wou, Theodore, SiN spacer profile patterning.
  177. Park, Seung; Wang, Anchuan, Silicon etch process with tunable selectivity to SiO2 and other materials.
  178. Korolik, Mikhail; Ingle, Nitin K.; Wang, Anchuan; Xu, Jingjing, Silicon germanium processing.
  179. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Silicon oxide selective removal.
  180. Huang, Jiayin; Chen, Zhijun; Wang, Anchuan; Ingle, Nitin, Silicon pretreatment for nitride removal.
  181. Li, Zihui; Hsu, Ching-Mei; Zhang, Hanshen; Zhang, Jingchun, Silicon selective removal.
  182. Chen, Zhijun; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Silicon-carbon-nitride selective etch.
  183. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.
  184. Luere, Olivier; Kang, Sean S.; Nemani, Srinivas D., Spacer formation.
  185. Jang, Won-Ick; Choi, Chang-Auck; Jun, Chi-Hoon; Kim, Youn-Tae; Lee, Myung-Lae, Stiction-free microstructure releasing method for fabricating MEMS device.
  186. Hayashi, Daisuke, Substrate processing method and substrate processing system.
  187. Grant, Robert W.; Petrone, Benjamin J.; Mumbauer, Paul D., Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems.
  188. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.
  189. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.
  190. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.
  191. Liu, Jie; Wang, Xikun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Tungsten oxide processing.
  192. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.
  193. Fayfield Robert T. ; Schwab Brent D., UV/halogen treatment for dry oxide etching.
  194. Yang, Dongqing; Tang, Jing; Ingle, Nitin, Uniform dry etch in two stages.
  195. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.
  196. Butterbaugh Jeffery W. ; Sawin Herbert H. ; Zhang Zhe ; Han Yong-Pil, Vapor phase cleaning of alkali and alkaline earth metals.
  197. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.

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