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Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-027/26
출원번호 US-0277688 (1994-07-20)
발명자 / 주소
  • Carpio Ronald A. (Austin TX)
출원인 / 주소
  • Sematech, Inc. (Austin TX 02)
인용정보 피인용 횟수 : 48  인용 특허 : 0

초록

A feedback control system for providing automated control of multi-component chemical concentrations in a hydrogen peroxide/ammonia (SC-1) aqueous bath or in a hydrogen peroxide/hydrochloric (SC-2) aqueous bath used for semiconductor processing. A sample from the liquid bath is routed to two sensors

대표청구항

A method for monitoring concentration levels of a first chemical specie, which is hydrogen peroxide (H2O2), and a second chemical specie, which is either an acid or a base, in a multi-component aqueous bath utilized in semiconductor processing, in order to provide feedback to control an amount of sa

이 특허를 인용한 특허 (48)

  1. Kim, Sungman; Jeong, Jin Ha; Kim, Jongsan; Shim, Ronald Myungsup, Ammonia gas detection apparatus and a semiconductor fabrication line including the same.
  2. Hanson Karrie J. (Westfield NJ) Higashi Gregg S. (Berkeley Heights NJ) Rosamilia Joseph M. (Berkeley Heights NJ), Apparatus for continuously controlling the peroxide and ammonia concentration in a bath.
  3. Centanni, Michael A., Apparatus for controlling the concentration of a sterilant chemical in a fluid.
  4. Centanni, Michael A., Apparatus for determining the efficiency of a vaporizer in a decontamination system.
  5. Dirk Maarten Knotter NL; Leonardus Cornelus Robertus Winters NL; Servatius Maria Vleeshouwers NL, Arrangement and method for detecting the end of life of an aqueous bath utilized in semiconductor processing.
  6. Holbrook Allison ; Huang Jiahua ; Fernandes Aaron A., Bubble monitor for semiconductor manufacturing.
  7. Kamikawa, Yuji; Shindo, Naoki; Kitahara, Shigenori; Yamasaka, Miyako, Cleaning method and cleaning equipment.
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  9. Shive Larry Wayne ; Malik Igor Jan, Control of SiO.sub.2 etch rate using dilute chemical etchants in the presence of a megasonic field.
  10. Proctor, Jr., James A.; Foore, Lawrence R.; Gorsuch, Thomas E.; Amalfitano, Carlo, Dynamic bandwidth allocation for multiple access communications using buffer urgency factor.
  11. Gorsuch, Thomas E.; Amalfitiano, Carlo, Dynamic bandwidth allocation to transmit a wireless protocol across a code division multiple access (CDMA) radio link.
  12. Kamikawa, Yuji; Kitahara, Shigenori, Liquid processing apparatus and process liquid supplying method.
  13. Allen, David; Centanni, Michael A., Method and apparatus for detection of contaminants in a fluid.
  14. Centanni, Michael A., Method and apparatus for formulating and controlling chemical concentration in a gas mixture.
  15. Centanni, Michael A., Method and apparatus for formulating and controlling chemical concentrations in a solution.
  16. Centanni, Michael A., Method and apparatus for measuring chemical concentration in a fluid.
  17. Centanni, Michael A., Method and apparatus for measuring concentration of a chemical component in a gas mixture.
  18. Korenev, Sergey A.; Korenev, Ivan S.; Centanni, Michael A., Method and apparatus for measuring the concentration of hydrogen peroxide in a fluid.
  19. Kaiser, Herbert J.; Allen, David G.; Centanni, Michael A.; McGinley, Mark D., Method and apparatus for monitoring detergent concentration in a decontamination process.
  20. Kaiser,Herbert J.; Centanni,Michael A., Method and apparatus for monitoring the purity and/or quality of steam.
  21. Kaiser, Herbert J.; Centanni, Michael A., Method and apparatus for monitoring the state of a chemical solution for decontamination of chemical and biological warfare agents.
  22. Kaiser, Herbert J.; Centanni, Michael A., Method and apparatus for real time monitoring of metallic cation concentrations in a solution.
  23. Centanni, Michael A., Method for determining the efficiency of a vaporizer in a decontamination system.
  24. Bodo Peter,SEX ; Hesselbom Hjalmar,SEX, Method for making elastic bumps from a wafer mold having grooves.
  25. Guldi Richard L. (Dallas TX) Kunesh Robert F. (Plano TX), Method for rotational wafer cleaning in solution.
  26. Toko Konishi JP; Cozy Ban JP; Yasuhiro Asaoka JP, Method for treating semiconductor substrates.
  27. Hase Ushio,JPX ; Yamamoto Kenichi,JPX ; Nakamura Akinobu,JPX, Method for treatment of semiconductor substrate with chemical solution and apparatus used for said treatment.
  28. Song Jong Kook,KRX, Method of cleaning a silicon wafer using a standard cleaning solution.
  29. Tadashi Shimomura JP; Masaru Ohto JP; Hiroya Watanabe JP, Method of controlling NOx gas emission by hydrogen peroxide.
  30. Geomini,Marcellinus J. H. J., Method of manufacturing electronic devices, and apparatus for carrying out such a method.
  31. Centanni,Michael A, Method of monitoring operational status of sensing devices for determining the concentration of chemical components in a fluid.
  32. Ohmi,Tadahiro; Sugawa,Shigetoshi; Teramoto,Akinobu; Akahori,Hiroshi; Nii,Keiichi, Method of surface treatment for manufacturing semiconductor device.
  33. Shih, Hong; Avoyan, Armen; Deshmukh, Shashank C.; Carman, David, Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber.
  34. Tong, Weidong; Salvati, Larry; Kadambi, Pooja, Methods and devices for implants with calcium phosphate.
  35. Fisher, Matthew L.; Snyder, David L.; Misra, Ashutosh, Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy.
  36. Wen,Hai Bo; Li,Panjian; Smith,Todd, Methods for producing metallic implants having roughened surfaces.
  37. Nakao Shuji,JPX, Monitoring method and apparatus of surface area of semiconductor wafer.
  38. Proctor, Jr., James A., Multi-detection of heartbeat to reduce error probability.
  39. Proctor, Jr., James A., Multi-detection of heartbeat to reduce error probability.
  40. Homma Yoshio,JPX ; Kusukawa Kikuo,JPX ; Moriyama Shigeo,JPX ; Nagasawa Masayuki,JPX, Polishing agent and polishing method.
  41. Homma Yoshio,JPX ; Kusukawa Kikuo,JPX ; Moriyama Shigeo,JPX ; Nagasawa Masayuki,JPX, Polishing agent and polishing method.
  42. Wochner, Hanns; Gailer, Thomas; Kellner, Rudolf, Process for cleaning polycrystalline silicon chunks.
  43. Eaton,Andrew; Entwistle,Andrew; Read,Howard; Abou Shakra,Fadi, Sample introduction system.
  44. Eaton,Andrew; Entwistle,Andrew; Read,Howard; Abou Shakra,Fadi, Sample introduction system.
  45. Hui-Ju Yoo TW; Szu-An Wu TW; Cheng-Kun Lin TW; Shiow-Jye Jenq TW, Silicon monitor for detection of H2O2 in acid bath.
  46. Ulyashin, Alexander; Bentzen, Andreas; Svensson, Bengt; Holt, Arve; Sauar, Erik, Surface passivation of silicon based wafers.
  47. Campbell, Mark A.; Tang, Phuong-Anh; Anderson, Gary R, System and method for monitoring and/or controlling attributes of multiple chemical mixtures with a single sensor.
  48. Hase Ushio,JPX ; Yamamoto Kenichi,JPX ; Miyazawa Ichiro,JPX, Wet-chemical treatment method, treatment method of semiconductor substrate, and manufacturing method of semiconductor device.
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