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Phase change cooling of semiconductor power modules 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-025/04
  • H01L-023/48
  • H01L-039/02
출원번호 US-0103647 (1993-08-09)
발명자 / 주소
  • Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA)
출원인 / 주소
  • Hughes Aircraft Company (Los Angeles CA 02)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록 ▼

Semiconductor wafer (22) and substrate (20) are enclosed in housing (12) on heat extracting base (14) . The space within the housing is filled with a phase change material (28) which absorbs heat at a transitional temperature below the critical temperature of the semiconductor wafer to absorb heat d

대표청구항 ▼

A semiconductor cooling system (10) comprising: a base (14) with an upper mounting surface (16), said base having a plurality of fins (18) integrally formed therewith and extending out of said base (14) on a side opposite said mounting surface (16); a cold plate (40)in connection with said base (14)

이 특허를 인용한 특허 (72)

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