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Guard ring electrostatic chuck 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02N-013/00
출원번호 US-0169932 (1993-12-20)
발명자 / 주소
  • Barnes Michael S. (San Francisco CA) Keller John H. (Newburgh NY) Logan Joseph S. (Jamestown RI) Tompkins Robert E. (Pleasant Valley NY) Westerfield
  • Jr. Robert P. (Montgomery NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 64  인용 특허 : 0

초록 ▼

An electrostatic chuck suppresses the formation of vacuum arcs between the back of the wafer being processed and the body of the chuck by the interposition of a guard ring that floats close to the self-bias potential induced by the plasma on the wafer, thereby capacitively dividing the voltage betwe

대표청구항 ▼

An electrostatic chuck system for holding, in a vacuum ambient, by electrostatic attraction of a DC potential a workpiece having a workpiece radius comprising: at least two circularly symmetric, concentric aluminum electrodes having a hard-coat alumina coating and together providing a planar clampin

이 특허를 인용한 특허 (64)

  1. Hoi Cheong Sun ; Dominic Stephen Rosati ; Eugene Samuel Puliniak ; Bawa Singh ; Nitin Vithalbhai Desai, AC waveforms biasing for bead manipulating chucks.
    상세보기
  2. Sun Hoi Cheong Steve ; Poliniak Eugene Samuel ; Rosati Dominic Stephen ; Singh Bawa ; Desai Nitin Vithalbhai, AC waveforms biasing for bead manipulating chucks.
    상세보기
  3. Parkhe Vijay, Apparatus for igniting a plasma in a plasma processing chamber.
    상세보기
  4. Grosshart Paul F. ; Kerns Ralph C. ; Laquidara Peter P., Bias-tracking D.C. power circuit for an electrostatic chuck.
    상세보기
  5. Hoffman, Daniel J.; Miller, Matthew L.; Yang, Jang Gyoo; Chae, Heeyeop; Barnes, Michael; Ishikawa, Tetsuya; Ye, Yan, Capacitively coupled plasma reactor with magnetic plasma control.
    상세보기
  6. Yang, Jang Gyoo; Hoffman, Daniel J.; Carducci, James D.; Buchberger, Jr., Douglas A.; Hagen, Melissa; Miller, Matthew L.; Chiang, Kang-Lie; Delgadino, Gerardo A., Capacitively coupled plasma reactor with uniform radial distribution of plasma.
    상세보기
  7. Reynolds, Glyn J., Conductive seal ring electrostatic chuck.
    상세보기
  8. Thomas E. Wicker ; Alan M. Schoepp ; Robert A. Maraschin, Contamination controlling method and apparatus for a plasma processing chamber.
    상세보기
  9. Howald, Arthur M.; Holland, John P., Dechucking method and apparatus for workpieces in vacuum processors.
    상세보기
  10. Howald,Arthur; Holland,John P., Dechucking method and apparatus for workpieces in vacuum processors.
    상세보기
  11. Poliniak Eugene Samuel ; Sun Hoi Cheong Steve ; Desai Nitin Vithalbhai ; Kumar Nalin ; Roach William Ronald ; Hammer Lawrence Harrison ; Southgate Peter David ; Singh Bawa ; Rivenburg Howard Christop, Dry powder deposition apparatus.
    상세보기
  12. Yang,Jang Gyoo; Hoffman,Daniel J.; Shannon,Steven C.; Burns,Douglas H.; Lee,Wonseok; Kim,Kwang Soo, Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output.
    상세보기
  13. Jones Phillip Lawrence ; Jafarian-Tehrani Seyed Jafar ; Atlas Boris V. ; Liu David R-Chen ; Tokunaga Ken Edward ; Chen Ching-Hwa, Dynamic feedback electrostatic wafer chuck.
    상세보기
  14. Goto, Yoshinobu, Electrostatic chuck.
    상세보기
  15. Yamada Naohito,JPX ; Ohno Masashi,JPX ; Ushikoshi Ryusuke,JPX, Electrostatic chuck.
    상세보기
  16. Yamada Naohito,JPX ; Ohno Masashi,JPX ; Ushikoshi Ryusuke,JPX, Electrostatic chuck.
    상세보기
  17. Krishnaraj Padmanabhan ; Lue Brian ; Lingampalli Ramkishan Rao ; Wu Shun Jackson, Electrostatic chuck and method for fabricating the same.
    상세보기
  18. Michael Scott Barnes ; John Howard Keller ; Joseph S. Logan ; Robert E. Tompkins ; Robert Peter Westerfield, Jr., Electrostatic chuck with reference electrode.
    상세보기
  19. Sun Hoi Cheong Steve ; Pletcher Timothy Allen, Electrostatic chucks and a particle deposition apparatus therefor.
    상세보기
  20. Sun Hoi Cheong Steve ; Pletcher Timothy Allen, Electrostatic chucks and a particle deposition apparatus therefor.
    상세보기
  21. Howald Arthur M. ; Holland John P., Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors.
    상세보기
  22. Buchberger, Jr.,Douglas A.; Hoffman,Daniel J.; Ramaswamy,Kartik; Nguyen,Andrew; Hanawa,Hiorji; Collins,Kenneth S.; Al Bayati,Amir, Gasless high voltage high contact force wafer contact-cooling electrostatic chuck.
    상세보기
  23. Zheng, Hui; Tsai, Kenneth; Wang, Hong; He, Yongxiang; Garcia, III, Jesus G.; Deyo, Daniel M., Guard for electrostatic chuck.
    상세보기
  24. Barnes Michael S. (San Francisco CA) Keller John H. (Newburgh NY) Logan Joseph S. (Jamestown RI) Tompkins Robert E. (Pleasant Valley NY) Westerfield ; Jr. Robert P. (Montgomery NY), Guard ring electrostatic chuck.
    상세보기
  25. Michael Scott Barnes ; John Howard Keller ; Joseph S. Logan ; Robert E. Tompkins ; Robert Peter Westerfield, Jr., Guard ring electrostatic chuck.
    상세보기
  26. Hoffman,Daniel J.; Ye,Yan; Katz,Dan; Buchberger, Jr.,Douglas A.; Zhao,Xiaoye; Chiang,Kang Lie; Hagen,Robert B.; Miller,Matthew L., MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression.
    상세보기
  27. Hoffman,Daniel J.; Ye,Yan; Katz,Dan; Buchberger, Jr.,Douglas A.; Zhao,Xiaoye; Chiang,Kang Lie; Hagen,Robert B.; Miller,Matthew L., MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression.
    상세보기
  28. Hoffman, Daniel J.; Ye, Yan; Katz, Dan; Buchberger, Jr., Douglas A.; Zhao, Xiaoye; Chiang, Kang-Lie; Hagen, Robert B.; Miller, Matthew L., Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression.
    상세보기
  29. Graven Andrew J. ; Schmidt Melvin ; McCuen Kenneth A. ; Ra Yunju, Method and apparatus for clamping a substrate.
    상세보기
  30. Fotland, Richard; Bowers, John; Jameson, William, Method and apparatus for producing uniform small portions of fine powders and articles thereof.
    상세보기
  31. Fotland, Richard; Bowers, John; Jameson, William, Method for depositing particles onto a substrate using an alternating electric field.
    상세보기
  32. Parkhe Vijay, Method for igniting a plasma in a plasma processing chamber.
    상세보기
  33. Hoffman,Daniel J.; Gold,Ezra Robert, Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters.
    상세보기
  34. Hoffman,Daniel J.; Gold,Ezra Robert, Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure.
    상세보기
  35. Hoffman, Daniel J.; Gold, Ezra Robert, Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of selected chamber parameters.
    상세보기
  36. Hoi Cheong Steve Sun ; Timothy Allen Pletcher, Method of depositing particles with an electrostatic chuck.
    상세보기
  37. Sun, Hoi Cheong Steve; Pletcher, Timothy Allen, Method of depositing particles with an electrostatic chuck.
    상세보기
  38. Hoffman, Daniel J., Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current.
    상세보기
  39. Hoffman, Daniel J., Method of determining wafer voltage in a plasma reactor from applied bias voltage and current and a pair of constants.
    상세보기
  40. Yang,Jang Gyoo; Hoffman,Daniel J.; Shannon,Steven C.; Burns,Douglas H.; Lee,Wonseok; Kim,Kwang Soo, Method of feedback control of ESC voltage using wafer voltage measurement at the bias supply output.
    상세보기
  41. Hoffman, Daniel J., Method of operating a plasma reactor chamber with respect to two plasma parameters selected from a group comprising ion density, wafer voltage, etch rate and wafer current, by controlling chamber parameters of source power and bias power.
    상세보기
  42. Mashiro Supika (Saitama-Prefecture JPX) Sakamoto Kiyotaka (Tokyo JPX), Method of removing substrate and apparatus for controlling applied voltage.
    상세보기
  43. Kutney, Michael C.; Hoffman, Daniel J.; Delgadino, Gerardo A.; Gold, Ezra R.; Sinha, Ashok; Zhao, Xiaoye; Burns, Douglas H.; Ma, Shawming, Methods to avoid unstable plasma states during a process transition.
    상세보기
  44. Poliniak, Eugene Samuel; Steve Sun, Hoi Cheong; Desai, Nitin Vithalbhai; Kumar, Nalin; Roach, William Ronald; Hammer, Lawrence Harrison; Southgate, Peter David; Singh, Bawa; Rivenburg, Howard Christo, Methods using dry powder deposition apparatuses.
    상세보기
  45. Poliniak, Eugene Samuel; Sun, Hoi Cheong Steve; Desai, Nitin Vithalbhai; Kumar, Nalin; Roach, William Ronald; Hammer, Lawrence Harrison; Southgate, Peter David; Singh, Bawa; Rivenburg, Howard Christo, Methods using dry powder deposition apparatuses.
    상세보기
  46. Fairbairn Kevin ; Sinha Ashok, Multideck wafer processing system.
    상세보기
  47. Husain Anwar, Multilayered electrostatic chuck and method of manufacture thereof.
    상세보기
  48. Sivaramakrishnan Visweswaren ; Ravi Tirunelveli S. ; Ravi Kramadhati V., Multiple substrate processing apparatus for enhanced throughput.
    상세보기
  49. Castro Edward Ross ; Tokunaga Ken Edwin ; Atlas Boris V. ; Liu David Ru-Chen, Negative offset bipolar electrostatic chucks.
    상세보기
  50. Hoffman,Daniel J., Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power.
    상세보기
  51. Buchberger, Jr.,Douglas A.; Hoffman,Daniel J.; Regelman,Olga; Carducci,James; Horioka,Keiji; Yang,Jang Gyoo, Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface.
    상세보기
  52. Hoffman, Daniel J.; Lindley, Roger A.; Kutney, Michael C.; Salinas, Martin J.; Tavassoli, Hamid F.; Horioka, Keiji; Buchberger, Jr., Douglas A., Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction.
    상세보기
  53. Hoffman, Daniel J.; Yin, Gerald Zheyao, Plasma reactor with overhead RF electrode tuned to the plasma.
    상세보기
  54. Hoffman,Daniel J.; Yin,Gerald Zheyao; Ye,Yan; Katz,Dan; Buchberger, Jr.,Douglas A.; Zhao,Xiaoye; Chiang,Kang Lie; Hagen,Robert B.; Miller,Matthew L., Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression.
    상세보기
  55. Hoffman,Daniel; Yang,Jang Gyoo; Buchberger, Jr.,Douglas A.; Burns,Douglas, Plasma reactor with overhead RF source power electrode having a resonance that is virtually pressure independent.
    상세보기
  56. Hofman,Daniel J.; Sun,Jennifer Y.; Thach,Senh; Ye,Yan, Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination.
    상세보기
  57. Dible Robert D. ; Lenz Eric H. ; Lambson Albert M., Power segmented electrode.
    상세보기
  58. Dible Robert D. ; Lenz Eric H. ; Lambson Albert M., Power segmented electrode.
    상세보기
  59. Wicker, Thomas E., Semiconductor processing equipment having improved process drift control.
    상세보기
  60. Wicker, Thomas E., Semiconductor processing equipment having improved process drift control.
    상세보기
  61. Rossman Kent ; Lue Brian ; Redeker Fred C., Shield for an electrostatic chuck.
    상세보기
  62. Howald, Arthur M., System and method for dechucking a workpiece from an electrostatic chuck.
    상세보기
  63. Ross Charles P. ; Lai Canfeng, Unbalanced bipolar electrostatic chuck power supplies and methods thereof.
    상세보기
  64. Dhindsa Rajinder ; Franchuk Steven ; Manzanilla Carlos ; Tokunaga Ken E., Wafer electrical discharge control by wafer lifter system.
    상세보기

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