[특허]Semiconductor device package and method of making

Semiconductor device package and method of making 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/28 H01L-023/12 H05K-007/20 H05K-001/18
출원번호	US-0375061 (1995-01-19)
발명자 / 주소	Knapp James H. (Chandler AZ) Nelson Keith E. (Tempe AZ)
출원인 / 주소	Motorola, Inc. (Schaumburg IL 02)
인용정보	피인용 횟수 : 47 인용 특허 : 0

초록 ▼

A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the supportive substrate (10, 12), over the semiconductor die (16). The protective lid (20) is partially encapsulated with molding compound (28). The protective lid (20) prevents the molding compound (30) from contacting the semiconductor die (16), and associated wirebonded wires (18). A portion (30) of the protective lid (20) remains exposed. Thus, a molded package compatible with current product designs and assembly processes is provided, yet disadvantages caused by molding compound contacting the die (16) and wires (18) are avoided. Furthermore, the exposed protective lid (30) provides superior heat dissipation for the package.

대표청구항 ▼

A method for making a semiconductor device package, comprising the steps of: providing a supportive substrate comprising a printed wire board, the printed wire board comprising a plurality of edges and a plurality of exterior electrical leads extending laterally from the plurality of edges; attaching a first semiconductor die to a first surface of the supportive substrate; electrically connecting the semiconductor die to the printed wire board with a plurality of wires; covering the plurality of wires and the first semiconductor die with a first protective lid of a uniform thickness having a raised portion shaped to conform to the plurality of wires and having a lowered portion overlying the first semiconductor die and parallel to the first semiconductor die, the first protective lid attached to the first surface of the supportive substrate thereby sealing the semiconductor die and the plurality of wires; and partially encapsulating the first protective lid and a portion of the electrical leads with a molding compound such that a portion of the first protective lid overlying the semiconductor die remains exposed. A semiconductor device package comprising: a supportive substrate comprising a plurality of edges and a plurality of exterior leads extending laterally from the plurality of edges; a semiconductor die attached to a first surface of the supportive substrate and electrically connected, with a plurality of wire bonds, to the plurality of leads; a protective lid of a uniform thickness covering the semiconductor die, the protective lid having a raised portion shaped to conform to the wire bonds and having a lowered portion overlying the semiconductor die parallel to the semiconductor die, the protective lid attached to the first surface thereby sealing the semiconductor die and the plurality of wires; and molded material partially encapsulating the protective lid and a portion of the leads, a portion of the protective lid overlying the semiconductor die remaining exposed.

이 특허를 인용한 특허 (47)

Reed, Paul, Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards.
상세보기
Cole, Barrett E.; Marta, Terry, Beam intensity detection in a cavity ring down sensor.
상세보기
Cole, Barrett E., CRDS mirror for normal incidence fiber optic coupling.
상세보기
Cole, Barrett E., Cavity enhanced photo acoustic gas sensor.
상세보기
Cole, Barrett E., Cavity ring-down spectrometer having mirror isolation.
상세보기
Cox, James Allen; Cole, Barrett E., Compact gas sensor using high reflectance terahertz mirror and related system and method.
상세보기
Arnold,Rocky R.; Zarganis,John C.; Montauti,Fabrizio, EMI shielding for electronic component packaging.
상세보기
Skinner, Harry G.; Kirkbride, Walter M., Electromagnetic interference and heatsinking.
상세보기
Skinner, Harry G.; Kirkbride, Walter M., Electromagnetic interference and heatsinking.
상세보기
Gabower,John F., Electromagnetic interference shields for electronic devices.
상세보기
Fritz, Bernard, Enhanced cavity for a photoacoustic gas sensor.
상세보기
Onishi Yukihiro,JPX, Heat-dissipating structure of an electronic part.
상세보기
Cox, James Allen; Higashi, Robert, High reflectance terahertz mirror and related method.
상세보기
Higashi, Robert E.; Newstrom-Peitso, Karen M.; Ridley, Jeffrey A., Integral topside vacuum package.
상세보기
Zhao, Sam Ziqun; Khan, Rezaur Rahman, Integrated circuit (IC) package stacking and IC packages formed by same.
상세보기
Zohni, Nael; Nagarajan, Kumar; Boja, Ronilo, Integrated circuit packaging devices and methods.
상세보기
Khan, Rezaur Rahman; Zhao, Sam Ziqun, Interconnect structure and formation for package stacking of molded plastic area array package.
상세보기
Khan, Rezaur Rahman; Zhao, Sam Ziqun, Interposer for die stacking in semiconductor packages and the method of making the same.
상세보기
Mazzochette, Joseph B., LED package with stepped aperture.
상세보기
Khan, Rezaur Rahman; Wang, Ken Jian Ming, Lead frame-BGA package with enhanced thermal performance and I/O counts.
상세보기
Zhao, Sam Ziqun; Khan, Rezaur Rahman, Leadframe IC packages having top and bottom integrated heat spreaders.
상세보기
Zhang, Leilei, Metal lid with improved adhesion to package substrate.
상세보기
Ronald D. Myer ; David J. Post ; Bradley R. Knigga ; Paul C. Staab, Method for integrated circuit packaging.
상세보기
Reed, Paul, Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces.
상세보기
Tiffany ; III Harry J., Method for making tamper-preventing, contact-type, smart cards.
상세보기
Zhao, Sam Ziqun; Khan, Reza ur Rahman, Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages.
상세보기
Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages.
상세보기
Arnold, Rocky R.; Zarganis, John; Toyama, Steve, Multi-layered structures and methods for manufacturing the multi-layered structures.
상세보기
Cole,Barrett E.; Higashi,Robert E.; Zins,Christopher J.; Krishnankutty,Subash, Multi-substrate package assembly.
상세보기
Cole,Barrett E.; Higashi,Robert E.; Zins,Christopher J.; Krishnankutty,Subash, Multi-substrate package assembly.
상세보기
Cole, Barrett E.; Marta, Terry; Cox, James Allen; Nusseibeh, Fouad, Multiple wavelength cavity ring down gas sensor.
상세보기
Zhao, Sam Ziqun; Khan, Rezaur Rahman, No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement.
상세보기
Cole, Barrett E.; Cox, James A.; Zook, J. David, Optical cavity system having an orthogonal input.
상세보기
Kirchdoerffer Remy,FRX ; Elefteriou Pierre,FRX, Process for the production of an apparatus or instrument by overmolding and apparatus or instrument thus obtained.
상세보기
Davidson Howard L., Sealed liquid-filled module and method of forming same.
상세보기
Ming-Tung Shen TW, Semiconductor device.
상세보기
Shimizu Nobutaka,JPX ; Nishimura Takao,JPX ; Kikuchi Atsushi,JPX ; Akai Takao,JPX ; Ihara Takumi,JPX, Semiconductor device having cap.
상세보기
Suzuki Katsuhiko,JPX ; Sorimachi Isamu,JPX ; Haga Akira,JPX ; Uchida Hiroyuki,JPX ; Suzuki Katsunobu,JPX, Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same.
상세보기
Loo,Kum Weng; Kho,Chek Lim, Semiconductor device package and method of manufacture.
상세보기
Tang Tom,TWX ; Huang Chien Ping,TWX ; Chiang Kevin,TWX ; Lai Jeng-Yuan,TWX ; Tien Candy,TWX ; Liu Vicky,TWX, Semiconductor package having a heat sink with an exposed surface.
상세보기
Huang, Chien Ping; Tang, Tom; Chiang, Kevin; Lai, Jenq-Yuan; Tien, Candy; Liu, Vicky, Semiconductor package having an exposed heat spreader.
상세보기
Huang, Chien-Ping, Semiconductor package with heat dissipating structure.
상세보기
Huang, Chien-Ping, Semiconductor package with heat dissipating structure.
상세보기
Huang,Chien Ping, Semiconductor package with heat dissipating structure.
상세보기
Ip Matthew W., Sensor package arrangement.
상세보기
Distefano Thomas H., Thermally enhanced packaged semiconductor assemblies.
상세보기
Thomas H. Distefano, Thermally enhanced packaged semiconductor assemblies.
상세보기

내보내기 메뉴

내보내기 구분

파일저장
인쇄
메일전송

구성항목

기본정보
상세정보

관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC

저장형식

Text(ASCII format)
Excel format
PIAS분석(.xls)

메일정보

받는사람 (필수): @
보내는사람 (선택): @
제목
내용: KISTI 검색결과 이메일 서비스

안내

총 건의 자료가 검색되었습니다.

다운받으실 자료의 인덱스를 입력하세요. (1-10,000)

검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다.

데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요)

다운로드 파일은 UTF-8 형태로 저장됩니다.
파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오.

Text(ASCII format)
Excel format

AI-Helper ※ AI-Helper는 을 사용합니다.

AI-Helper

안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

Semiconductor device package and method of making 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (47)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Semiconductor device package and method of making 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (47)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트