$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method of making a semiconductor device using a low dielectric constant material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/02
출원번호 US-0247195 (1994-05-20)
발명자 / 주소
  • Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX) Smith Douglas M. (Albuquerque NM)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 126  인용 특허 : 0

초록 ▼

This invention provides a process for making a semiconductor device with reduced capacitance between adjacent conductors. This process can include applying a solution between conductors 24, and then gelling, surface modifying, and drying the solution to form an extremely porous dielectric layer 28.

대표청구항 ▼

A method of forming a porous dielectric on a semiconductor device comprising: (a) providing a first conductor and a horizontally adjacent second conductor, formed on a substrate wherein a gap is formed between said first and said second conductors; (b) providing a solution capable of forming a wet g

이 특허를 인용한 특허 (126)

  1. Seth, Jayshree; Feisel, Bryan C.; Sharma, Neeraj; Tan, Lian S.; Tiefenbruck, Grant F.; Wu, Jung-Sheng, Aerogel composites.
    상세보기
  2. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Shin-Puu Jeng ; Bruce E. Gnade, Aerogel thin film formation from multi-solvent systems.
    상세보기
  3. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Jeng Shin-Puu ; Gnade Bruce E., Aerogel thin film formation from multi-solvent systems.
    상세보기
  4. Takaaki Ioka JP; Tsuneaki Tanabe JP, Alkoxysilane/organic polymer composition for thin insulating film production and use thereof.
    상세보기
  5. Brinker Charles Jeffrey ; Prakash Sai Sivasankaran, Ambient pressure process for preparing aerogel thin films reliquified sols useful in preparing aerogel thin films.
    상세보기
  6. Wallace Robert M. (Richardson TX) Anthony John M. (Richardson TX) Gnade Bruce E. (Dallas TX) Cho Chih-Chen (Richardson TX), Anode plate for flat panel display having integrated getter.
    상세보기
  7. Sirhan,Motasim; Yan,John, Apparatus and methods for variably controlled substance delivery from implanted prostheses.
    상세보기
  8. Perng, Dung-Ching; Lee, Peter Wai-Man; Deacon, Thomas E., Apparatus for depositing low dielectric constant oxide film.
    상세보기
  9. Shinichi Hayashi JP; Shinji Nagashima JP, Apparatus for forming coating film.
    상세보기
  10. Todd,Michael A., Apparatus, precursors and deposition methods for silicon-containing materials.
    상세보기
  11. Todd, Michael A., CVD of porous dielectric materials.
    상세보기
  12. Watkins, James J.; Blackburn, Jason M.; Long, David P.; Lazorcik, Jason L., Chemical fluid deposition method for the formation of metal and metal alloy films on patterned and unpatterned substrates.
    상세보기
  13. Li,Li; Li,Weimin, Chemical treatment of semiconductor substrates.
    상세보기
  14. Mountsier Thomas Weller, Chemical vapor deposition of low density silicon dioxide films.
    상세보기
  15. Mountsier Thomas Weller, Chemical vapor deposition of low density silicon dioxide films.
    상세보기
  16. Chandra Grish ; Haluska Loren Andrew ; Michael Keith Winton, Coating electronic substrates with silica derived from polycarbosilane.
    상세보기
  17. Koji Sakai JP, Coating film formation apparatus and aging process apparatus.
    상세보기
  18. Chorng-Ping Chang ; Kin Ping Cheung ; Chien-Shing Pai ; Wei Zhu, Device comprising thermally stable, low dielectric constant material.
    상세보기
  19. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
    상세보기
  20. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.
    상세보기
  21. Gaynor Justin F., Dielectric layer including silicalite crystals and binder and method for producing same for microelectronic circuits.
    상세보기
  22. Gaynor, Justin F.; Huang, Judy, Dispersions of silicalite and zeolite nanoparticles in nonpolar solvents.
    상세보기
  23. Harvey Jerry L., Dummy fill patterns to improve interconnect planarity.
    상세보기
  24. Ahn,Kie Y.; Forbes,Leonard, Electronic apparatus with deposited dielectric layers.
    상세보기
  25. Goetz, Martin P.; O'Neil, Gary E., Electronic device with aerogel thermal isolation.
    상세보기
  26. Takeshita Kazuhiro,JPX ; Nagashima Shinji,JPX ; Mizutani Yoji,JPX ; Katayama Kyoshige,JPX, Gas treatment apparatus.
    상세보기
  27. Smith Douglas M. ; Ackerman William C., Glycol-based method for forming a thin-film nanoporous dielectric.
    상세보기
  28. Beratan Howard R. ; Cho Chih-Chen, High MTF optical coating for hybrid UFPA's.
    상세보기
  29. Kyle, Robert Joseph Stephen; Shelton, Gail D.; McKenney, Sam, High strength composite thermoelectric cooler and method for making same.
    상세보기
  30. Beratan Howard R. (Richardson TX) Cho Chih-Chen (Richardson TX), High thermal resistance backfill material for hybrid UFPA\s.
    상세보기
  31. Qi Xiang ; Matthew S. Buynoski ; Ming-Ren Lin, High-K gate dielectric process with process with self aligned damascene contact to damascene gate and a low-k inter level dielectric.
    상세보기
  32. Farrar,Paul A., Hydrophobic foamed insulators for high density circuits.
    상세보기
  33. Farrar, Paul A., Insulators for high density circuits.
    상세보기
  34. Farrar, Paul A., Insulators for high density circuits.
    상세보기
  35. Changming Jin ; Kelly J. Taylor ; Wei William Lee, Integrated circuit dielectric and method.
    상세보기
  36. Lu Jiong-Ping ; Jin Changming, Integrated circuit dielectric and method.
    상세보기
  37. Lu, Jiong-Ping; Jin, Changming, Integrated circuit dielectric and method.
    상세보기
  38. Wary John ; Beach William F. ; Olson Roger A., Internally heated pyrolysis zone.
    상세보기
  39. Masakara Alok ; Ramos Teresa ; Smith Douglas M., Limited-volume apparatus and method for forming thin film aerogels on semiconductor substrates.
    상세보기
  40. Fisher, Philip; Lin, Ming-Ren; Buynoski, Matthew S., Linerless shallow trench isolation method.
    상세보기
  41. Xiang, Qi, Low density, tensile stress reducing material for STI trench fill.
    상세보기
  42. Farrar, Paul A., Low dielectric constant STI with SOI devices.
    상세보기
  43. Farrar, Paul A., Low dielectric constant STI with SOI devices.
    상세보기
  44. Yamada, Noriko; Takahashi, Toru; Sakon, Tadashi; Matsuzaki, Yoichi; Nogami, Atsushi; Katayama, Shingo; Shiina, Ikuko, Low dielectric constant materials and their production and use.
    상세보기
  45. Yamada, Noriko; Takahashi, Toru; Sakon, Tadashi; Matsuzaki, Yoichi; Nogami, Atsushi; Katayama, Shingo; Shiina, Ikuko, Low dielectric constant materials and their production and use.
    상세보기
  46. Leung Roger Yu-Kwan ; Case Suzanne, Low dielectric constant porous films.
    상세보기
  47. Benzing, Jeffrey C.; Kelly, John, Low dielectric constant porous materials having improved mechanical strength.
    상세보기
  48. Farrar, Paul A., Low dielectric constant shallow trench isolation.
    상세보기
  49. Farrar, Paul A., Low dielectric constant shallow trench isolation.
    상세보기
  50. Farrar, Paul A., Low dielectric constant shallow trench isolation.
    상세보기
  51. Farrar, Paul A., Low dielectric constant shallow trench isolation.
    상세보기
  52. Farrar, Paul A., Low dielectric constant shallow trench isolation.
    상세보기
  53. Paul A. Farrar, Low dielectric constant shallow trench isolation.
    상세보기
  54. Roger Yu-Kwan Leung ; Suzanne Case, Low dielectric foam dielectric formed from polymer decomposition.
    상세보기
  55. Dixit, Girish A.; Konecni, Anthony; Havemann, Robert H., Low pressure, low temperature, semiconductor gap filling process.
    상세보기
  56. Douglas M. Smith ; Gregory P. Johnston ; William C. Ackerman ; Richard A. Stoltz ; Alok Maskara ; Teresa Ramos ; Shin-Puu Jeng ; Bruce E. Gnade, Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.
    상세보기
  57. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Stoltz Richard A. ; Maskara Alok ; Ramos Teresa ; Jeng Shin-Puu ; Gnade Bruce E., Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.
    상세보기
  58. Smith, Douglas M.; Johnston, Gregory P.; Ackerman, William C.; Stoltz, Richard A.; Maskara, Alok; Ramos, Teresa; Jeng, Shin-Puu; Gnade, Bruce E., Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates.
    상세보기
  59. Farrar, Paul A., Memory system with conductive structures embedded in foamed insulator.
    상세보기
  60. Liu Jun ; Domansky Karel ; Li Xiaohong ; Fryxell Glen E. ; Baskaran Suresh ; Kohler Nathan J. ; Thevuthasan Suntharampillai ; Coyle Christopher A. ; Birnbaum Jerome C., Mesoporous silica film from a solution containing a surfactant and methods of making same.
    상세보기
  61. Bruinsma,Paul J.; Baskaran,Suresh; Bontha,Jagannadha R.; Liu,Jun, Mesoporous-silica films, fibers, and powders by evaporation.
    상세보기
  62. Xiang, Qi; Fisher, Philip A., Method and apparatus for STI using passivation material for trench bottom liner.
    상세보기
  63. Miller Gayle W. ; Shelton Gail D., Method and apparatus for deposition of porous silica dielectrics.
    상세보기
  64. Matos, Jeffrey A.; Milde, Jr., Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.
    상세보기
  65. Matos,Jeffrey A.; Milde, Jr.,Karl F., Method and apparatus for treating fuel to temporarily reduce its combustibility.
    상세보기
  66. Tamboli, Dnyanesh Chandrakant; Rao, Madhukar Bhaskara; O'Neill, Mark Leonard, Method and composition for restoring dielectric properties of porous dielectric materials.
    상세보기
  67. Witold P. Maszara ; Ming-Ren Lin ; Qi Xiang, Method for and device having STI using partial etch trench bottom liner.
    상세보기
  68. Perng Dung-Ching ; Lee Peter Wai-Man ; Deacon Thomas E., Method for depositing low dielectric constant oxide films.
    상세보기
  69. Yang Gwo-Shii,TWX ; Yew Tri-Rung,TWX ; Chen Coming,TWX ; Lur Water,TWX, Method for fabricating shallow trench isolation structure.
    상세보기
  70. Yang, Tahorng, Method for forming low dielectric constant insulating layer with foamed structure.
    상세보기
  71. Annapragada Rao Venkateswara ; Bothra Subhas, Method for forming vias through porous dielectric material and devices formed thereby.
    상세보기
  72. Dawn M. Hopper ; Richard J. Huang ; Lu You, Method for improving the dielectric constant of silicon-based semiconductor materials.
    상세보기
  73. Bothra Subhas (San Jose CA) Weling Milind G. (San Jose CA), Method for improving the manufacturability of the spin-on glass etchback process.
    상세보기
  74. Miyazawa,Takashi, Method for manufacturing laminated film, electro-optical device, method for manufacturing electro-optical device, organic electroluminescence device, and electronic appliances.
    상세보기
  75. Xiang, Qi; Fisher, Philip A., Method for shallow trench isolation using passivation material for trench bottom liner.
    상세보기
  76. Fisher, Philip; Chan, Darin A., Method for shallow trench isolation with removal of strained island edges.
    상세보기
  77. Takeshita, Kazuhiro; Nagashima, Shinji; Muramatsu, Makoto; Mizutani, Yoji; Yano, Kazutoshi; Katayama, Kyoshige, Method of coating film, coating unit, aging unit, solvent replacement unit, and apparatus for coating film.
    상세보기
  78. Takeshita, Kazuhiro; Nagashima, Shinji; Muramatsu, Makoto; Mizutani, Yoji; Yano, Kazutoshi; Katayama, Kyoshige, Method of coating film, coating unit, aging unit, solvent replacement unit, and apparatus for coating film.
    상세보기
  79. Takeshita,Kazuhiro; Nagashima,Shinji; Muramatsu,Makoto; Mizutani,Yoji; Yano,Kazutoshi; Katayama,Kyoshige, Method of coating film, coating unit, aging unit, solvent replacement unit, and apparatus for coating film.
    상세보기
  80. Karel Domansky ; Glen E. Fryxell ; Jun Liu ; Nathan J. Kohler ; Suresh Baskaran, Method of dehydroxylating a hydroxylated material and method of making a mesoporous film.
    상세보기
  81. Bernhardt Anthony F. (Berkeley CA) Contolini Robert J. (Pleasanton CA), Method of forming a spacer for field emission flat panel displays.
    상세보기
  82. Lan Shih-Ming,TWX, Method of forming interconnections.
    상세보기
  83. Aoi Nobuo,JPX, Method of forming porous film and material for porous film.
    상세보기
  84. Aoi Nobuo,JPX, Method of forming porous film and material for porous film.
    상세보기
  85. Numata Ken,JPX ; Houston Kay, Method of making reliable metal leads in high speed LSI semiconductors using dummy leads.
    상세보기
  86. Ayers Michael R., Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor device.
    상세보기
  87. Wai,Chien M.; Ohde,Hiroyuki; Kramer,Steve, Methods of forming metal-containing films over surfaces of semiconductor substrates.
    상세보기
  88. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture.
    상세보기
  89. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture.
    상세보기
  90. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package with conductive elements and associated method of manufacture.
    상세보기
  91. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device with package with conductive elements and associated method of manufacture.
    상세보기
  92. Havemann Robert H. (Garland TX) Jeng Shin-puu (Plano TX), Multilevel interconnect structure with air gaps formed between metal leads.
    상세보기
  93. Havemann Robert H. ; Jeng Shin-puu, Multilevel interconnect structure with air gaps formed between metal leads.
    상세보기
  94. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Jeng Shin-Puu, Nanoporous dielectric thin film formation using a post-deposition catalyst.
    상세보기
  95. Smith Douglas M. ; Johnston Gregory P. ; Ackerman William C. ; Jeng Shin-Puu, Nanoporous dielectric thin film surface modification.
    상세보기
  96. Gabriel Calvin T. ; Weling Milind G., Optimized structures for dummy fill mask design.
    상세보기
  97. Bothra Subhas ; Weling Milind G., Optimized underlayer structures for maintaining chemical mechanical polishing removal rates.
    상세보기
  98. Bothra Subhas ; Weling Milind G., Optimized underlayer structures for maintaining chemical mechanical polishing removal rates.
    상세보기
  99. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
    상세보기
  100. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
    상세보기
  101. Wary John ; Beach William F. ; Olson Roger A., Parylene polymer layers.
    상세보기
  102. Farrar, Paul A., Polynorbornene foam insulation for integrated circuits.
    상세보기
  103. Smith Douglas M. ; Ackerman William C. ; Stoltz Richard A., Polyol-based method for forming thin film aerogels on semiconductor substrates.
    상세보기
  104. Smith, Douglas M.; Ackerman, William C.; Stoltz, Richard A., Polyol-based method for forming thin film aerogels on semiconductor substrates.
    상세보기
  105. Cho Chih-Chen ; Gnade Bruce E. ; Smith Douglas M. ; Changming Jin ; Ackerman William C. ; Johnston Gregory C., Porous dielectric material with improved pore surface properties for electronics applications.
    상세보기
  106. Ahn Kie Y. ; Forbes Leonard, Porous silicon oxycarbide integrated circuit insulator.
    상세보기
  107. Ahn, Kie Y.; Forbes, Leonard, Porous silicon oxycarbide integrated circuit insulator.
    상세보기
  108. Ahn, Kie Y.; Forbes, Leonard, Porous silicon oxycarbide integrated circuit insulator.
    상세보기
  109. Kie Y. Ahn ; Leonard Forbes, Porous silicon oxycarbide integrated circuit insulator.
    상세보기
  110. Geiger, Fabrice; Gaillard, Frederic, Process for depositing a porous, low dielectric constant silicon oxide film.
    상세보기
  111. Bhandarkar Suhas Dattatreya ; Chandross Edwin Arthur ; Johnson ; Jr. David Wilfred, Process for forming patterned dielectric oxide films.
    상세보기
  112. Sahota Kashmir ; Huang Richard J. ; Matsumoto David ; Ramsbey Mark T. ; Sun Yu ; Rizzuto Judith Quan, Reduction of silicon oxynitride film delamination in integrated circuit inter-level dielectrics.
    상세보기
  113. Hsiao, Ming-Chun; Su, Kai-Nung; Lee, Cheng-Chung; Lin, Pang; Chen, San-Yuan, SOG materials for spacer anodic bonding and method of preparing the same.
    상세보기
  114. Sahota Kashmir ; Huang Richard J. ; Chen Hung-Sheng ; Sun Yu, Scalable and reliable integrated circuit inter-level dielectric.
    상세보기
  115. Wai,Chien M.; Ohde,Hiroyuki; Kramer,Steve, Semiconductor constructions.
    상세보기
  116. Wai,Chien M.; Ohde,Hiroyuki; Kramer,Steve, Semiconductor constructions comprising a layer of metal over a substrate.
    상세보기
  117. Morisaki, Hiroshi; Nozaki, Shinji, Semiconductor device with porous interlayer insulating film.
    상세보기
  118. Morisaki, Hiroshi; Nozaki, Shinji, Semiconductor device with porous interlayer insulating film.
    상세보기
  119. Morisaki,Hiroshi; Nozaki,Shinji, Semiconductor device with porous interlayer insulating film.
    상세보기
  120. Takeshita Kazuhiro,JPX ; Nagashima Shinji,JPX ; Muramatsu Makoto,JPX ; Mizutani Yoji,JPX ; Yano Kazutoshi,JPX ; Katayama Kyoshige,JPX, Spin coating apparatus including aging unit and solvent replacement unit.
    상세보기
  121. Lee Joo-hyung,KRX, Stacked capacitor structures for liquid crystal displays and related methods.
    상세보기
  122. Wong,Lawrence D., Structural reinforcement of highly porous low k dielectric films by ILD posts.
    상세보기
  123. Bharath Rangarajan ; Ramkumar Subramanian ; Bhanwar Singh, Super critical drying of low k materials.
    상세보기
  124. Wu, Jung-Sheng; Seth, Jayshree; Determan, Michael D.; Condo, Peter D.; Tan, Lian Soon; Sharma, Neeraj, Telechelic hybrid aerogels.
    상세보기
  125. Weling Milind G. ; Bothra Subhas ; Gabriel Calvin T., Use of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing.
    상세보기
  126. Wu, Hui-Jung; Drage, James S., Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로