$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method of forming interface between die and chip carrier 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/34
출원번호 US-0123882 (1993-09-20)
발명자 / 주소
  • Sweis Jason (Sunnyvale CA) Gilleo Kenneth B. (West Kingston RI)
출원인 / 주소
  • Tessera, Inc. (San Jose CA 02)
인용정보 피인용 횟수 : 124  인용 특허 : 0

초록 ▼

A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its intro

대표청구항 ▼

A method of forming a mounting structure for a semiconductor chip comprising the steps of providing a flexible chip carrier having a top surface and a bottom surface terminals disposed on said top surface and leads in electrical connection with said terminals, placing said chip carrier a given dista

이 특허를 인용한 특허 (124)

  1. Watson,Michael John, Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes.
    상세보기
  2. Carden Timothy F. ; Zubelewicz Aleksander, Assembly process for flip chip package having a low stress chip and resulting structure.
    상세보기
  3. Timothy F. Carden ; Aleksander Zubelewicz, Assembly process for flip chip package having a low stress chip and resulting structure.
    상세보기
  4. Leonard E. Mess, Ball grid array (BGA) encapsulation mold.
    상세보기
  5. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  6. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  7. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  8. DiStefano Thomas H. ; Kovac Zlata ; Smith John W., Bondable compliant pads for packaging of a semiconductor chip and method therefor.
    상세보기
  9. Distefano Thomas H., Bonding lead structure with enhanced encapsulation.
    상세보기
  10. Distefano Thomas H., Bonding lead structure with enhanced encapsulation.
    상세보기
  11. Takeda Hidetoshi,JPX ; Bonkohara Manabu,JPX, Chip carrier semiconductor device assembly and a method for forming the same.
    상세보기
  12. Schueller Randolph Dennis ; Geissinger John David, Chip scale ball grid array for integrated circuit package.
    상세보기
  13. Schueller Randolph D., Chip scale ball grid array for integrated circuit packaging.
    상세보기
  14. Lo, Ching P.; Huang, Daniel A.; Hudson, Pete, Chip scale packaging on CTE matched printed wiring boards.
    상세보기
  15. Lo, Ching P.; Huang, Daniel A.; Hudson, Pete, Chip scale packaging on CTE matched printed wiring boards.
    상세보기
  16. Inoue Tatsuo,JPX, Chip size package.
    상세보기
  17. Il Kwon Shim ; Chang Kyu Park KR; Byung Joon Han KR; Vincent DiCaprio ; Paul Hoffman, Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages.
    상세보기
  18. Ju-Hoon Yoon KR; Dae-Byung Kang KR, Circuit pattern tape for wafer-scale production of chip size semiconductor packages.
    상세보기
  19. Kovac Zlata ; Mitchell Craig ; Distefano Thomas H. ; Smith John W., Compliant interface for semiconductor chip and method therefor.
    상세보기
  20. Thomas H. DiStefano ; John W. Smith ; Zlata Kovac ; Konstantine Karavakis, Compliant microelectronic mounting device.
    상세보기
  21. Thomas H. Distefano, Compliant semiconductor chip package with fan-out leads and method of making same.
    상세보기
  22. DiStefano Thomas H. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan ; Sweis Jason ; Union Laurie ; Gibson David, Connection components with frangible leads and bus.
    상세보기
  23. DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan; Sweis, Jason; Union, Laurie; Gibson, David, Connection components with frangible leads and bus.
    상세보기
  24. Watson, Michael John, Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes.
    상세보기
  25. Schroeder, Christopher R.; Ackerman, Christopher W.; Shipley, James C.; Acikalin, Tolga; Sauciuc, Ioan; Rutigliano, Michael L.; Maveety, James G.; Gupta, Ashish, Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same.
    상세보기
  26. Schroeder, Christopher R.; Ackerman, Christopher W.; Shipley, James C.; Acikalin, Tolga; Sauciuc, Ioan; Rutigliano, Michael L.; Maveety, James G.; Gupta, Ashish X., Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same.
    상세보기
  27. Schroeder, Christopher R.; Ackerman, Christopher W.; Shipley, James C.; Acikalin, Tolga; Sauciuc, Ioan; Rutigliano, Michael L.; Maveety, James G.; Gupta, Ashish X., Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same.
    상세보기
  28. Hashimoto, Nobuaki, Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board.
    상세보기
  29. Hashimoto, Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  30. Hashimoto, Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  31. Hashimoto, Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  32. Hashimoto,Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  33. Hashimoto,Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  34. Hashimoto,Nobuaki, Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board.
    상세보기
  35. Mess, Leonard E., Encapsulation method in a molding machine for an electronic device.
    상세보기
  36. Mitchell, Craig S., Encapsulation of microelectronic assemblies.
    상세보기
  37. Nguyen Tan ; Mitchell Craig S. ; Distefano Thomas H., Encapsulation of microelectronic assemblies.
    상세보기
  38. Nguyen, Tan; Mitchell, Craig S.; DiStefano, Thomas H., Encapsulation of microelectronic assemblies.
    상세보기
  39. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
    상세보기
  40. Nobuaki Hashimoto JP, Film carrier tape.
    상세보기
  41. Hashimoto Nobuaki,JPX, Film carrier tape and semiconductor device, method of making the same and circuit board.
    상세보기
  42. Fischbach, Reinhard; Fries, Manfred; Zaeske, Manfred, Housing assembly for an electronic device and method of packaging an electronic device.
    상세보기
  43. Degani Yinon ; Greenberg Lawrence Arnold, Integrated circuit bonding method and apparatus.
    상세보기
  44. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.
    상세보기
  45. Bischoff Peter G. ; Stovall Ross W, Interposer with embedded circuitry and method for using the same to package microelectronic units.
    상세보기
  46. Shigeta Hiroyuki,JPX ; Osawa Kenji,JPX ; Sato Kazuhiro,JPX ; Makino Haruhiko,JPX ; Ito Makoto,JPX, Lead frame and semiconductor package having a lead frame.
    상세보기
  47. Pedersen, David V.; Khandros, Igor Y., Lithographically defined microelectronic contact structures.
    상세보기
  48. Light David ; Haba Belgacem ; Distefano Thomas H. ; Karavakis Konstantine, Manufacture of semiconductor connection components with frangible lead sections.
    상세보기
  49. You, Joong-Ha, Member for semiconductor package and semiconductor package using the same, and fabrication method thereof.
    상세보기
  50. You,Joong Ha, Member for semiconductor package and semiconductor package using the same, and fabrication method thereof.
    상세보기
  51. Chaudhury, Manoj Kumar; Goodwin, Andrew James; Lee, Yeong Joo; Parbhoo, Bhukandas, Method for creating adhesion during fabrication of electronic devices.
    상세보기
  52. Ju-Hoon Yoon KR; Woo-Hyun Kong KR; Chang-Bok Lee KR; Sung-Jin Yang KR, Method for laminating circuit pattern tape on semiconductor wafer.
    상세보기
  53. Mitchell, Craig; Warner, Mike; Behlen, Jim, Method for making a semiconductor chip package.
    상세보기
  54. Muff, Simon; Pohl, Jens; Winderl, Johann, Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method.
    상세보기
  55. Son Dae Woo,KRX ; Lee Youn Soo,KRX ; Kim Byung Man,KRX, Method for packaging integrated circuits with elastomer chip carriers.
    상세보기
  56. Mangrum,Marc A., Method for stacking an integrated circuit on another integrated circuit.
    상세보기
  57. Distefano Thomas H. ; Smith John W. ; Fjelstad Joseph ; Mitchell Craig S. ; Karavakis Konstantine, Method of encapsulating a semiconductor package.
    상세보기
  58. Razon Eli ; Von Seggern Walter, Method of forming a chip scale package, and a tool used in forming the chip scale package.
    상세보기
  59. DiStefano Thomas H. ; Smith John W. ; Kovac Zlata ; Karavakis Konstantine, Method of forming compliant microelectronic mounting device.
    상세보기
  60. DiStefano Thomas H. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan ; Sweis Jason ; Union Laurie ; Gibson David, Method of making connections to a semiconductor chip assembly.
    상세보기
  61. Fosberry Jennifer ; Beroz Masud ; Michael Mihalis ; Osborn Philip, Method of manufacturing a plurality of semiconductor packages.
    상세보기
  62. DiStefano Thomas H. ; Smith John W. ; Mitchell Craig, Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures.
    상세보기
  63. Thomas H. Distefano ; John W. Smith ; Craig Mitchell, Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures.
    상세보기
  64. Collins, III,William D., Method of packaging a semiconductor light emitting device.
    상세보기
  65. Lee, Jin-Yuan; Chen, Ying-Chih; Lin, Mou-Shiung, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  66. Lee, Jin-Yuan; Chen, Ying-Chih; Lin, Mou-Shiung, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  67. Lee, Jin-Yuan; Chen, Ying-Chih; Lin, Mou-Shiung, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  68. Lee, Jin-Yuan; Chen, Ying-Chih; Lin, Mou-Shiung, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  69. Lee, Jin-Yuan; Chen, Ying-Chih; Lin, Mou-Shiung, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  70. Lee, Jin-Yuan; Chen, Ying-chih, Method of wire bonding over active area of a semiconductor circuit.
    상세보기
  71. Peddle,Charles I., Methods and apparatus for fabricating Chip-on-Board modules.
    상세보기
  72. Bretl,Frank J.; Powell,Gary; Michael,Donald L.; Ward,Jefferson P.; Scheffelin,Joseph E.; Akhavain,Mohammad, Methods and systems for forming a die package.
    상세보기
  73. Leonard E. Mess, Methods for ball grid array (BGA) encapsulation mold.
    상세보기
  74. DiStefano, Thomas H.; Fjelstad, Joseph, Methods for providing void-free layer for semiconductor assemblies.
    상세보기
  75. Raab Kurt, Methods of making compliant interfaces and microelectronic packages using same.
    상세보기
  76. Fjelstad, Joseph; Karavakis, Konstantine, Methods of making compliant semiconductor chip packages.
    상세보기
  77. Kovac, Zlata; Mitchell, Craig; Distefano, Thomas; Smith, John, Methods of making microelectronic assemblies including compliant interfaces.
    상세보기
  78. Kovac, Zlata; Mitchell, Craig; Distefano, Thomas; Smith, John, Methods of making microelectronic assemblies including compliant interfaces.
    상세보기
  79. Kovac, Zlata; Mitchell, Craig; Distefano, Thomas; Smith, John, Methods of making microelectronic assemblies including compliant interfaces.
    상세보기
  80. Kovac,Zlata; Mitchell,Craig S.; DiStefano,Thomas H.; Smith,John W., Methods of making microelectronic assemblies including compliant interfaces.
    상세보기
  81. Haba, Belgacem, Microelectronic assemblies having compliancy.
    상세보기
  82. Oganesian, Vage; Gao, Guilian; Haba, Belgacem; Ovrutsky, David, Microelectronic assemblies having compliancy and methods therefor.
    상세보기
  83. Oganesian, Vage; Gao, Guilian; Haba, Belgacem; Ovrutsky, David, Microelectronic assemblies having compliancy and methods therefor.
    상세보기
  84. Oganesian, Vage; Gao, Guilian; Haba, Belgacem; Ovrutsky, David, Microelectronic assemblies having compliancy and methods therefor.
    상세보기
  85. Fjelstad, Joseph; Karavakis, Konstantine, Microelectronic assemblies having compliant layers.
    상세보기
  86. Fjelstad, Joseph; Karavakis, Konstantine, Microelectronic assemblies having compliant layers.
    상세보기
  87. Fjelstad,Joseph; Karavakis,Konstantine, Microelectronic assemblies having compliant layers.
    상세보기
  88. Fjelstad,Joseph; Karavakis,Konstantine, Microelectronic assemblies having compliant layers.
    상세보기
  89. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure.
    상세보기
  90. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.
    상세보기
  91. Fjelstad Joseph ; Smith John W., Microelectronic lead structures with dielectric layers.
    상세보기
  92. Raab Kurt ; Pickett Thomas ; Di Stefano Thomas H., Multiple part compliant interface for packaging of a semiconductor chip and method therefor.
    상세보기
  93. Il Kwon Shim SG; Vincent DiCaprio ; Paul Hoffman ; Byung Joon Han SG, Package for stacked integrated circuits.
    상세보기
  94. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
    상세보기
  95. Manteghi Kamran, Process for manufacturing a multi layer bumped semiconductor device.
    상세보기
  96. Wada,Kenya; Onoshiro,Jun; Hiraseko,Kouji, Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof.
    상세보기
  97. Sakaguchi Noboru,JPX ; Miyajima Yoshinori,JPX ; Hizume Toru,JPX, Resin-shield type semiconductor device.
    상세보기
  98. Lin, Mou-Shiung; Chou, Chiu-Ming, Semiconductor chip and method for fabricating the same.
    상세보기
  99. Mitchell Craig ; Warner Mike ; Behlen Jim, Semiconductor chip assembly.
    상세보기
  100. Distefano Thomas H., Semiconductor chip package with expander ring and method of making same.
    상세보기
  101. DiStefano Thomas H. ; Grube Gary W. ; Khandros Igor Y. ; Mathiew Gaetan, Semiconductor connection components and methods with releasable lead support.
    상세보기
  102. Il Kwon Shim SG; Chang Kyu Park KR; Byung Joon Han SG; Vincent DiCaprio ; Paul Hoffman, Semiconductor device and method of manufacturing such device.
    상세보기
  103. Kagii,Hidemasa; Muto,Akira; Shimizu,Ichio; Arai,Katsuo; Sato,Hiroshi; Nakamura,Hiroyuki; Osaka,Masahiko; Nakajo,Takuya; Okawa,Keiichi; Oka,Hiroi, Semiconductor device and method of manufacturing the same.
    상세보기
  104. Kagii,Hidemasa; Muto,Akira; Shimizu,Ichio; Arai,Katsuo; Sato,Hiroshi; Nakamura,Hiroyuki; Osaka,Masahiko; Nakajo,Takuya; Okawa,Keiichi; Oka,Hiroi, Semiconductor device and method of manufacturing the same.
    상세보기
  105. Shigeru Yamada JP; Yasufumi Uchida JP; Noriko Murakami JP; Yoshinori Shizuno JP, Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor.
    상세보기
  106. Yamada Shigeru,JPX ; Uchida Yasufumi,JPX ; Murakami Noriko,JPX ; Shizuno Yoshinori,JPX, Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same.
    상세보기
  107. Hashimoto, Nobuaki, Semiconductor device, method of making the same, circuit board, and flexible substrate.
    상세보기
  108. Nobuaki Hashimoto JP, Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate.
    상세보기
  109. Heo Young Wook,KRX ; Han Byung Joon,KRX, Semiconductor package and assembly for fabricating the same.
    상세보기
  110. Heo Young Wook,KRX ; Han Byung Joon,KRX, Semiconductor package and method for fabricating the same.
    상세보기
  111. Lin, Po Chun, Semiconductor structure and manufacturing method thereof.
    상세보기
  112. Lin, Po Chun, Semiconductor structure and manufacturing method thereof.
    상세보기
  113. Chun Dong Seok,KRX, Stackable ball grid array semiconductor package and fabrication method thereof.
    상세보기
  114. Dong Seok Chun KR, Stackable ball grid array semiconductor package and fabrication method thereof.
    상세보기
  115. Culnane Thomas M. ; Gaynes Michael A. ; Kodnani Ramesh R. ; Pierson Mark V., Stiffeners with improved adhesion to flexible substrates.
    상세보기
  116. Luvara John J. ; Quigley ; Jr. John J. ; Prasad Ray, Structure for printed circuit design.
    상세보기
  117. Luvara John J. ; Quigley Jay J ; Prasad Ray, Structure for printed circuit design.
    상세보기
  118. Mangrum,Marc A., Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element.
    상세보기
  119. Mitchell Craig ; Distefano Thomas H., System for encapsulating microelectronic devices.
    상세보기
  120. Boggs,David W.; Dungan,John H.; Sanders,Frank A.; Sato,Daryl A.; Willis,Dan, Three-dimensional flexible interposer.
    상세보기
  121. Razon Eli ; Von Seggern Walter, Tool used in forming a chip scale package.
    상세보기
  122. Raab, Kurt; Smith, John W., Transferable resilient element for packaging of a semiconductor chip and method therefor.
    상세보기
  123. Mitchell Craig S. ; Distefano Thomas H., Vacuum dispense apparatus for dispensing an encapsulant.
    상세보기
  124. Mitchell Craig S. ; Distefano Thomas H., Vacuum dispense method for dispensing an encapsulant and machine therefor.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로