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Polyimide-insulated cube package of stacked semiconductor device chips 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/60
출원번호 US-0329954 (1994-10-27)
발명자 / 주소
  • Bertin Claude L. (South Burlington VT) Farrar
  • Sr. Paul A. (South Burlington VT) Howell Wayne J. (South Burlington VT) Miller Christopher P. (Underhill VT) Perlman David J. (Wappingers Falls NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 96  인용 특허 : 0

초록 ▼

A cube package of stacked silicon semiconductor chips. To accommodate cube packaging, a metal transfer layer is added over the passivated chip face to bring all of the surface electrical contacts to a common chip edge. The metal transfer layer is insulated from the chip face and from the adjacent ch

대표청구항 ▼

A method for forming a semiconductor structure, comprising the steps of: forming a plurality of integrated circuit chips on an upper surface of a wafer, said wafer having a first coefficient of thermal expansion; forming a sandwich structure of a first insulation layer, a first layer of transfer met

이 특허를 인용한 특허 (96)

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