[특허]Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging

[미국특허] Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01N-023/02
출원번호	US-0207796 (1994-03-07)
우선권정보	JP-0210711 (1988-08-26); JP-0180305 (1989-07-14)
발명자 / 주소	Hamada Toshimitsu (Yokohama JPX) Nakahata Kozo (Chigasaki JPX) Morioka Yoshifumi (Seto JPX)
출원인 / 주소	Hitachi, Ltd. (Tokyo JPX 03)
인용정보	피인용 횟수 : 16 인용 특허 : 0

초록 ▼

A method and apparatus for inspecting a solder joint by an X-ray fluoroscopic image in which an X-ray is irradiated on an object to be inspected located by a specimen stage and having a lead of an electronic part soldered to a substrate to detect an X-ray fluoroscopic image signal, a position of a lead in a tip direction is obtained by a distribution of projection with said X-ray fluoroscopic image signal projected in a lead row direction, a position of a lead in a row direction is obtained by a distribution of projection with said X-ray fluoroscopic image projected in a lead tip direction to extract a position of a solder joint as an object to be inspected, and said X-ray fluoroscopic image is evaluated every solder joint in accordance with the postion information to effect a defect detection.

대표청구항 ▼

A method, for use with an X-ray fluoroscopic imaging apparatus, of inspecting a solder joint, the method comprising the steps of: obtaining an X-ray fluoroscopic image signal by irradiating an X-ray on an object to be inspected, the object being located by a specimen stage and formed by soldering a lead of an electronic part to a substrate at said solder joint; extracting a position of the solder joint as the object to be inspected from said obtained X-ray fluoroscopic image signal; defining, from the X-ray fluoroscopic image signal, a plurality of inspection areas on a solder portion and a peripheral portion of the solder joint in accordance with the extracted position of said solder joint; and, detecting a defect with respect to the solder joint in accordance with a min │W-Sj│(j=1 . . . N) of an integrated value │W-Sj│of differential images between an X-ray fluoroscopic image signal shape W obtained from said defined inspection area of said solder portion of the solder joint and a plurality of reference image signal shapes Sj (j=1 . . . N) designated as a typical good solder joint by comparing said X-ray fluoroscopic image signal shape W with said plurality of reference image signal shapes Sj (j=1 . . . N) designated as the typical good solder joint obtained by measuring an X-ray fluoroscopic image signal shape for the typical good solder joint, for every said defined inspection area of said solder portion, and detecting a defect between the solder joints in accordance with an X-ray fluoroscopic image signal obtained from said defined inspection area of said peripheral portion of the solder joint for every said defined inspection area of said peripheral portion.

이 특허를 인용한 특허 (16)

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Kasai, Junichi; Tanaka, Junji; Masuda, Naomi, Structure, method and system for assessing bonding of electrodes in FCB packaging.
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Tanaka, Toshihisa, X-ray apparatus.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging 원문보기