이 특허를 인용한 특허 (43)

1. Akram, Salman; Hembree, David R.; Wood, Alan G., Apparatus for forming coaxial silicon interconnects.

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2. Salman Akram ; David R. Hembree ; Alan G. Wood, Apparatus for forming coaxial silicon interconnects.

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3. Breed, David S.; Du Vall, Wilbur E.; Johnson, Wendell C., Automotive electronic safety network.

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4. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Automotive electronic safety network.

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5. Gilliland, Don Alan; Koschmeder, Max John Christopher; Huettner, Cary Michael, Conductive gasket including internal contact-enhancing strip.

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6. Connie M. Wong ; Michael G. Lee, Conductive interconnect structures and methods for forming conductive interconnect structures.

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7. Rytky, Pekka, Electric circuitry arrangement.

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8. Nelson, John E.; Sherry, Jeffrey C.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.

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9. Bahn, Robert J.; Blum, Fred A.; Neuhaus, Herbert J.; Zou, Bin, Electroless process for the preparation of particle enhanced electric contact surfaces.

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10. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.

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11. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.

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12. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.

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13. Breed, David S.; DuVall, Wilbur E.; Johnson, Wendell C.; Sanders, William Thomas, Integrated occupant protection system.

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14. Cowan, Joseph W., Interconnector and method of connecting probes to a die for functional analysis.

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15. Fisher,Rayette Ann; Burdick, Jr.,William Edward; Rose,James Wilson, Large area transducer array.

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16. Fasano, Benjamin V.; Courtney, Mark G., Method and apparatus for interim assembly electrical testing of circuit boards.

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17. Akram Salman ; Hembree David R. ; Wood Alan G., Method for forming coaxial silicon interconnects.

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18. Akram Salman ; Hembree David R. ; Wood Alan G., Method for forming coaxial silicon interconnects.

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19. Salman Akram ; David R. Hembree ; Alan G. Wood, Method of forming coaxial silicon interconnects.

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20. Fisher, Rayette Ann; Burdick, Jr., William Edward; Rose, James Wilson, Methods of fabricating a large area transducer array.

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21. Hembree, David R.; Hess, Michael E.; Jacobson, John O.; Farnworth, Warren M.; Wood, Alan G., Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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22. Lee, Michael G.; Wong, Connie M.; Wang, Wen-chou Vincent, Multilayer interconnection and method.

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23. Lykins ; II James L., Rough electrical contact surface.

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24. Hashimoto Nobuaki,JPX, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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25. Hashimoto, Nobuaki, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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26. Hashimoto, Nobuaki, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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27. Hashimoto, Nobuaki, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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28. Hashimoto,Nobuaki, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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29. Nobuaki Hashimoto JP, Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument.

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30. Hashimoto, Nobuaki, Semiconductor device with substrate having penetrating hole having a protrusion.

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31. Breed, David S., Single side curtain airbag for vehicles.

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32. Kim Jang Ryeul,KRX, Test board having a plurality of power supply wiring patterns.

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33. Ortiz,Alfred E.; Collins,Joseph, Test system for device and method thereof.

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34. Glovatsky Andrew Z. ; Todd Michael G. ; Van Pham Cuong, Three-dimensional molded sockets for mechanical and electrical component attachment.

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35. David R. Hembree ; Michael E. Hess ; John O. Jacobson ; Warren M. Farnworth ; Alan G. Wood, Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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36. David R. Hembree ; Michael E. Hess ; John O. Jacobson ; Warren M. Farnworth ; Alan G. Wood, Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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37. Hembree David R. ; Hess Michael E. ; Jacobson John O. ; Farnworth Warren M. ; Wood Alan G., Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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38. Hembree David R. ; Hess Michael E. ; Jacobson John O. ; Farnworth Warren M. ; Wood Alan G., Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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39. Hembree, David R.; Hess, Michael E.; Jacobson, John O.; Farnworth, Warren M.; Wood, Alan G., Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems.

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40. Breed David S. ; Duvall Wilbur E. ; Johnson Wendell C., Vehicle electrical system.

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41. Breed, David S., Vehicle software upgrade techniques.

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42. Breed, David S., Vehicle software upgrade techniques.

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43. Breed, David S., Vehicle software upgrade techniques.

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