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Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
출원번호 US-0355985 (1994-12-14)
발명자 / 주소
  • Hatakeyama Atsushi (Kawasaki JPX) Baba Fumio (Kawasaki JPX) Kasai Junichi (Kawasaki JPX) Sato Mitsutaka (Kawasaki JPX)
출원인 / 주소
  • Fujitsu Limited (Kawasaki JPX 03)
인용정보 피인용 횟수 : 125  인용 특허 : 0

초록 ▼

A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the

대표청구항 ▼

A semiconductor device, comprising: a first chip having a circuit arrangement, and a plurality of first terminals formed on a center position of a main surface of the first chip along one of a short side and a long side of the first chip and substantially arranged into a line; a second chip having a

이 특허를 인용한 특허 (125)

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