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Dissipation of heat through keyboard using a heat pipe 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0357449 (1994-12-16)
발명자 / 주소
  • Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 100  인용 특허 : 0

초록 ▼

An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a componen

대표청구항 ▼

An apparatus for removing heat from an electrical component, said component being mounted on a first surface of a circuit board, comprising: a thermal via through said circuit board thermally coupled to said electrical component, said thermal via extending from said first surface to a second surface

이 특허를 인용한 특허 (100)

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