이 특허를 인용한 특허 (32) 인용/피인용 타임라인 분석

1. Hathaway James A. ; Brunone David J. ; Reyes Michelle M., Advanced RF electronics package.

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2. Fukui, Akira, Aluminum-silicon carbide semiconductor substrate and method for producing the same.

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3. Mostafazadeh Shahram ; Smith Joseph O., Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same.

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4. Bergstedt, Leif; Ligander, Per, Carrier for electronic components.

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5. Glenn, Thomas P.; Hollaway, Roy D.; Webster, Steven, Ceramic semiconductor package and method for fabricating the package.

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6. Nagatsuka, Eiichi; Asaya, Yasumasa; Shida, Kaoru, Electronic component, laser device, optical writing device and image forming apparatus.

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7. Shishido, Itsuroh; Matsumoto, Toshihiro, Electronic package with bonded structure and method of making.

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8. Bhattacharya,Anandaroop; Calmidi,Varaprasad V.; Sathe,Sanjeev B., Electronic package with thermally-enhanced lid.

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9. Shimizu, Nobutaka; Imamura, Kazuyuki; Kikuchi, Atsushi; Minamizawa, Masaharu, Flip-chip semiconductor device having an improved reliability.

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10. Hiyoshi, Michiaki, Hermetically sealed semiconductor power module and large scale module comprising the same.

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11. Hiyoshi, Michiaki, Hermetically sealed semiconductor power module and large scale module comprising the same.

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12. Wu, Cheng-Chiao, IC chip package.

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13. Reilly, Christopher J.; Cortellini, Edmund A.; Harrington, Robin M., Infiltrated silicon carbide bodies and methods of making.

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14. Sylvester Mark F., Integrated circuit chip package assembly.

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15. Yamagata, Shin-ichi; Suwata, Osamu; Kawai, Chihiro; Fukui, Akira; Takeda, Yoshinobu, Member for semiconductor device and method for producing the same.

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16. Spowart,Jonathan E.; Maruyama,Benji; Miracle,Daniel B., Metal matrix composite material with high thermal conductivity and low coefficient of thermal expansion.

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17. Adams, Richard; Bennett, Grant; Fennessy, Kevin; Hay, Robert A.; Occhionero, Mark, Metal matrix composite structure and method.

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18. Adams,Richard W.; Bennett,Grant C.; Fennessy,Kevin; Hay,Robert A.; Occhionero,Mark, Metal matrix composite structure and method.

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19. Spowart, Jonathan E.; Maruyama, Benji; Miracle, Daniel B., Method for improving tensile properties of AlSiC composites.

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20. Sylvester Mark F., Method of increasing package reliability using package lids with plane CTE gradients.

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21. Sylvester Mark F., Method of making a lid for a chip/package system.

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22. Shyh-Ing Wu TW; Shin Hua Chao TW; Yao Shin Fang TW, Method of making ball grid array package.

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23. Hua,Fay; Deppisch,Carl L.; Whittenburg,Krista J., Reactive solder material.

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24. Wyland Christopher Paul, Semiconductor package with internal heatsink and assembly method.

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25. Shinichi Yamagata JP; Yugaku Abe JP; Makoto Imamura JP; Akira Fukui JP; Yoshishige Takano JP; Takatoshi Takikawa JP; Yoshiyuki Hirose JP, Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same.

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26. Yamagata Shinichi,JPX ; Abe Yugaku,JPX ; Imamura Makoto,JPX ; Fukui Akira,JPX ; Takano Yoshishige,JPX ; Takikawa Takatoshi,JPX ; Hirose Yoshiyuki,JPX, Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same.

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27. Yamagata, Shinichi; Abe, Yugaku; Imamura, Makoto; Fukui, Akira; Takano, Yoshishige; Takikawa, Takatoshi; Hirose, Yoshiyuki, Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same.

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28. Sylvester Mark F., Substrate with die area having same CTE as IC.

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29. Tarczynski, Gregory Richard, Super integrated circuit chip semiconductor device.

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30. Yamagata, Shinichi; Abe, Yugaku; Imamura, Makoto; Fukui, Akira; Takano, Yoshishige; Takikawa, Takatoshi; Hirose, Yoshiyuki, Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same.

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31. Lin, Wei-Feng; Huang, Chi-Chih; Li, En-Chi, System-in-package image sensor.

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32. Lin, Wei-Feng; Huang, Chi-Chih; Li, En-Chi, System-in-package image sensor.

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