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Method for making multichip circuits using active semiconductor substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/60
출원번호 US-0370902 (1995-01-10)
발명자 / 주소
  • Frye Robert C. (Piscataway NJ) Tai King L. (Berkeley Heights NJ)
출원인 / 주소
  • AT&T Corp. (Murray Hill NJ 02)
인용정보 피인용 횟수 : 146  인용 특허 : 0

초록 ▼

In accordance with the invention, a multichip circuit is fabricated by providing an active semiconductor substrate comprising a set of isolated components including active components such as transistors, forming on a surface of the substrate a plurality of paths incorporating components from the sub

대표청구항 ▼

A method for making a circuit comprising a plurality of integrated circuit chips comprising the steps of: providing a semiconductor substrate having formed therein a set of isolated and unconnected electrical components for interconnecting said circuit chips, said components including at least one b

이 특허를 인용한 특허 (146)

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