초록 ▼

A hot melt adhesive dispensing apparatus (10) having a hopper (16) and a lid (26) includes an adhesive curing abatement system (12) comprising a plurality of gas jets (40) mounted proximate to the side wall (42) of the hopper (16). The gas jets (40) inject one of either an inert gas or dry air downw

A hot melt adhesive dispensing apparatus (10) having a hopper (16) and a lid (26) includes an adhesive curing abatement system (12) comprising a plurality of gas jets (40) mounted proximate to the side wall (42) of the hopper (16). The gas jets (40) inject one of either an inert gas or dry air downwardly and inwardly into the hopper (16), thereby reducing the contact of moisture laden ambient air with moisture cure adhesive contained therein. The adhesive curing abatement system (12) may also include an exhaust system (50) to vacuum vapors generated by the moisture cure adhesive and the inert gas or dry air from the hopper (16) when the lid (26) is open and to bleed off any injected inert gas or dry air as well as vapors generated by the moisture cure adhesive when the lid (26) is closed.

대표청구항 ▼

A method of reducing premature curing of moisture cure adhesives in a hot melt adhesive dispensing apparatus including a hopper having an open upper end, a lower end, and a side wall, comprising: inserting into said hopper moisture cure adhesive to be melted; melting said moisture cure adhesive; and

A method of reducing premature curing of moisture cure adhesives in a hot melt adhesive dispensing apparatus including a hopper having an open upper end, a lower end, and a side wall, comprising: inserting into said hopper moisture cure adhesive to be melted; melting said moisture cure adhesive; and injecting into said hopper one of either an inert gas or dry air downwardly and inwardly to substantially prevent moist ambient air from contacting said moisture cure adhesive, thereby reducing premature curing of said moisture cure adhesive.