이 특허를 인용한 특허 (22)

1. Dow, Keith, Capacitor for dram connector.

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2. Kelly Kimberley Anne ; Yu Roy, Column for module component.

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3. Jung Woo-sang,KRX ; Choi Gil-heyun,KRX ; Park Ji-soon,KRX ; Kim Byeong-jun,KRX, Completely buried contact holes.

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4. Jung Woo-sang,KRX ; Choi Gil-heyun,KRX ; Park Ji-soon,KRX ; Kim Byeong-jun,KRX, Completely buried contact holes.

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5. Cassidy Richard J. ; Lankard ; Jr. John R. ; Nayak Jawahar P., Defect reduction method for screened greensheets and article produced therefrom.

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6. Barcley, Tina P., Densely packed electronic assemblage with heat removing element.

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7. Barcley, Tina P., Electrical assemblage and method for removing heat locally generated therefrom.

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8. Masaaki Okada JP, High-density mounted device employing an adhesive sheet.

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9. Lee, SeongMin; Song, Sungmin; Ha, Jong-Woo, Integrated circuit package stacking system with redistribution and method of manufacture thereof.

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10. Jarcy, Michael J.; Gizara, Andrew R.; McCarthy, Evans S.; Villanueva, Robbie U.; Hashemi, Hassan S.; Dadkhah, Mahyar S., Leadless chip carrier for reduced thermal resistance.

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11. Barcley, Tina P., Method of removing heat from an electronic assemblage.

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12. Cellarosi Mario J., Multilayer high density micro circuit module and method of manufacturing same.

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13. Kariya, Takashi, Multilayer printed wiring board.

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14. Kariya, Takashi, Multilayer printed wiring board.

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15. Cellarosi Mario J., Multilayer, high density micro circuit module and method of manufacturing same.

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16. Ootani Mitsuaki,JPX, Multilayered electronic part and electronic circuit module including therein the multilayered electronic part.

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17. Barrow, Michael, Perimeter matrix ball grid array circuit package with a populated center.

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18. Bezama Raschid J. ; Bird Kenneth A. ; Piciacchio Alan ; Rita Robert A., Planar metallized substrate with embedded camber control material and method thereof.

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19. Barcley, Tina P., Remote thermal vias for densely packed electrical assemblage.

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20. Higashiguchi Yutaka,JPX ; Inagaki Mitsuo,JPX ; Kumai Toshio,JPX ; Ochiai Ryoichi,JPX ; Totani Makoto,JPX, Semiconductor device having terminals for heat radiation.

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21. Anthony Andric, Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals.

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22. Kitazawa Kenji,JPX ; Koriyama Shinichi,JPX ; Morioka Shigeki,JPX ; Tomie Satoru,JPX, Structure for mounting a high-frequency package.

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