초록 ▼

Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber

Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

대표청구항 ▼

A heat transfer device for dissipating and removing heat energy from a heat source and delivering the heat energy to a heat sink, comprising: a diamond substrate for receiving the heat energy from the heat source; an interconnect point for connecting to said diamond substrate for receiving the heat

A heat transfer device for dissipating and removing heat energy from a heat source and delivering the heat energy to a heat sink, comprising: a diamond substrate for receiving the heat energy from the heat source; an interconnect point for connecting to said diamond substrate for receiving the heat energy from said diamond substrate; and a fiber fused to said diamond substrate at said interconnect point for receiving the heat energy from said diamond substrate and conducting the heat energy to the heat sink.