초록 ▼

A heat transfer system is provided for dissipating thermal energy within the personal computer. The transfer system is designed to move heat from a heat source, such as a central processing unit (CPU), to a heatsink arranged upon the portable computer keyboard. The heat transfer mechanism includes a

A heat transfer system is provided for dissipating thermal energy within the personal computer. The transfer system is designed to move heat from a heat source, such as a central processing unit (CPU), to a heatsink arranged upon the portable computer keyboard. The heat transfer mechanism includes a heat slug thermally coupled to the CPU heat source and a heat pipe thermally coupled to a backside surface of a computer keyboard. The heat pipe is designed having minimal thermal gradient, and includes an evaporation/condensation cycle associated with its operation. The heat pipe is preferably orthogonally shaped having at least one flat surface arranged near the intersection of the orthogonal members. The flat section is in registry with a heat source. Movement of the flat section relative to the heat source effectuates abutment and thermal contact therebetween. The present thermal energy transfer system is designed for enhanced heat transfer within a portable computer system without undergoing the disadvantages of bulky finned heatsinks and/or fans.

대표청구항 ▼

A system for cooling a portable computer, comprising: a portable computer having a keyboard coupled upon said computer, said keyboard includes a plurality of keys arranged on one surface of said keyboard and a metal plate arranged on the opposing surface of said keyboard; and a heat pipe having a su

A system for cooling a portable computer, comprising: a portable computer having a keyboard coupled upon said computer, said keyboard includes a plurality of keys arranged on one surface of said keyboard and a metal plate arranged on the opposing surface of said keyboard; and a heat pipe having a substantially flat outer surface which is adapted for removable, thermal coupling to said metal plate.